Abstract: A voltage regulator circuit included in a computer system may generate a voltage level on a power supply signal using a source power supply signal and based initial values of one or more operation parameters derived from wafer-level test data. One or more operation characteristics of the voltage regulator circuit may be sampled, by a measurement circuit, at multiple time points to generated measurement data. A control circuit may adapt operation of the voltage regulator circuit based on the measurement data.

Abstract: A system that includes a regulator unit is disclosed. The regulator unit includes first and second phase units whose outputs are coupled to a common output node. Each of the phase units may be configured to source current to the output node in response to the assertion of a respective clock signal in order to generate a regulated supply voltage. Each phase unit includes a respective transconductance amplifier configured to generate a respective demand current dependent upon a reference voltage and the regulated supply voltage.

Abstract: A system that includes a regulator unit is disclosed. The regulator unit includes first and second phase units whose outputs are coupled to through first and second coupled inductors, respectively, to a power supply node of a circuit block. The first phase unit may be configured to discharge, for a first period of time, the power supply node through the first inductor in response to determining a sense current is greater than a demand current. The operation of the second phase unit may follow that of the first phase unit after a second period of time has elapsed.

Abstract: Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material.

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.

Abstract: A system that includes a regulator unit is disclosed. The regulator unit includes first and second phase units whose outputs are coupled to through first and second coupled inductors, respectively, to a power supply node of a circuit block. The first phase unit may be configured to discharge, for a first period of time, the power supply node through the first inductor in response to determining a sense current is greater than a demand current. The operation of the second phase unit may follow that of the first phase unit after a second period of time has elapsed.

Abstract: Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material.

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

Abstract: A system that includes a regulator unit is disclosed. The regulator unit includes first and second phase units whose outputs are coupled to through first and second coupled inductors, respectively, to a power supply node of a circuit block. The first phase unit may be configured to discharge, for a first period of time, the power supply node through the first inductor in response to determining a sense current is greater than a demand current. The operation of the second phase unit may follow that of the first phase unit after a second period of time has elapsed.

Abstract: A system that includes a regulator circuit is disclosed. The regulator circuit includes first and second phase units whose outputs are coupled to a power supply node of a circuit block, via respective coupled inductors. The first phase unit may initiate a charge cycle of the power supply node in response to assertion of a clock signal and generate a compensated current using currents measure through both inductors and the clock signal. In response to a determination that the compensated current is greater than a demand current generated using a voltage level of the power supply node and a reference voltage, the first phase unit may halt the charge cycle.

Abstract: A variety of integrated circuit devices and a method for their formation and integration are provided. The integrated circuit devices may include inductors, capacitors, and/or other passive devices. In an exemplary embodiment, a first substrate is received and a conductive material is applied to the first substrate such that a loop of the conductive material is formed on the first substrate. A magnetic material is applied to the first substrate and surrounds at least a portion of the loop. A thermal process is performed on the first substrate having the conductive material and the magnetic material applied thereupon. The conductive material is bonded to a second substrate, and thereafter, the conductive material and the magnetic material are separated from the first substrate.

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

Abstract: Systems that include integrated circuit dies and voltage regulator units are disclosed. Such systems may include a voltage regulator module and an integrated circuit mounted in a common system package. The voltage regulator module may include a voltage regulator circuit and one or more passive devices mounted to a common substrate, and the integrated circuit may include a System-on-a-chip. The system package may include an interconnect region that includes wires fabricated on multiple conductive layers within the interconnect region. At least one power supply terminal of the integrated circuit may be coupled to an output of the voltage regulator module via a wire included in the interconnect region.

Abstract: A system that includes a regulator unit is disclosed. The regulator unit includes first and second phase units whose outputs are coupled to through first and second coupled inductors, respectively, to a power supply node of a circuit block. The first phase unit may be configured to discharge, for a first period of time, the power supply node through the first inductor in response to determining a sense current is greater than a demand current. The operation of the second phase unit may follow that of the first phase unit after a second period of time has elapsed.

Abstract: A system that includes a regulator circuit is disclosed. The regulator circuit includes first and second phase units whose outputs are coupled to a power supply node of a circuit block, via respective coupled inductors. The first phase unit may initiate a charge cycle of the power supply node in response to assertion of a clock signal and generate a compensated current using currents measure through both inductors and the clock signal. In response to a determination that the compensated current is greater than a demand current generated using a voltage level of the power supply node and a reference voltage, the first phase unit may halt the charge cycle.

Abstract: A system that includes multiple integrated circuits is disclosed. A first integrated circuit of the system includes a plurality of circuit blocks, and a first circuit block of the plurality of circuit blocks includes a first power terminal. A second integrated circuit of the system includes multiple voltage regulation circuits, a second power terminal coupled to an output of a given voltage regulation circuit, and a third power terminal coupled to an input of the given voltage regulation circuit. A substrate, included in the system, includes a plurality of conductive paths, each of which includes a plurality of wires fabricated on a plurality of conductive layers. The system further includes a power management unit that may be configured to generate a power supply voltage at a fourth power terminal that is coupled to the third power terminal via a first conductive path of the plurality of conductive paths.

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

Abstract: A system that includes a regulator unit is disclosed. The regulator unit includes first and second phase units whose outputs are coupled to a common output node. Each of the phase units may be configured to source current to the output node in response to the assertion of a respective clock signal in order to generate a regulated supply voltage. Each phase unit includes a respective transconductance amplifier configured to generate a respective demand current dependent upon a reference voltage and the regulated supply voltage.

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.