Abstract: This document describes techniques and systems of an exposed portion of a PCB configured to provide isolation among radar antennas. The described radar system includes an exposed portion of a surface of a printed circuit board (PCB) positioned between a first antenna and a second antenna. The PCB includes a metal plating on the surface of the PCB. A width of the exposed portion can delay a phase of electromagnetic (EM) energy conducted by the metal plating relative to a phase of EM energy that does not traverse the exposed portion. A height of the exposed portion can cause an amount of the EM energy conducted by the metal plating to be approximately equal to an amount of EM energy that traverses the exposed portion. In this way, the described systems and techniques can reduce signal-coupling among radar antennas without additional hardware costs and distance between the antennas.

Abstract: An illustrative example antenna device includes a substrate, a transmission line supported on the substrate, and a plurality of conductive patches supported on the substrate. Each conductive patch has a first end coupled to the transmission line and a second end coupled to ground. The plurality of conductive patches are arranged in sets including two of the conductive patches facing each other on opposite sides of the transmission line.

Abstract: This document describes techniques and systems of an exposed portion of a PCB configured to provide isolation among radar antennas. The described radar system includes an exposed portion of a surface of a printed circuit board (PCB) positioned between a first antenna and a second antenna. The PCB includes a metal plating on the surface of the PCB. A width of the exposed portion can delay a phase of electromagnetic (EM) energy conducted by the metal plating relative to a phase of EM energy that does not traverse the exposed portion. A height of the exposed portion can cause an amount of the EM energy conducted by the metal plating to be approximately equal to an amount of EM energy that traverses the exposed portion. In this way, the described systems and techniques can reduce signal-coupling among radar antennas without additional hardware costs and distance between the antennas.

Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.

Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

Abstract: An illustrative example antenna device includes a substrate. A plurality of conductive members in the substrate establish a substrate integrated waveguide. A plurality of first and second slots are on an exterior surface of a first portion of the substrate. Each of the second slots is associated with a respective one of the first slots. The first and second slots are configured to establish a radiation pattern that varies across a beam of radiation emitted by the antenna device. A plurality of parasitic interruptions include slots on the exterior surface of a second portion of the substrate. The parasitic interruptions reduce ripple effects otherwise introduced by adjacent antennas.

Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

Abstract: A radar assembly includes a monolithic-microwave-integrated-circuit (MMIC), an antenna-element, and a single printed-circuit-board (PCB). The MMIC includes an arrangement of solder-balls configured to couple radar-signals into or out of the MMIC. The antenna-element includes a ridge-air-waveguide configured to propagate radar-signals to or from one or more radiation-slots of the antenna-element. The PCB is directly attached to the MMIC. The PCB includes a transition-feature configured to couple radar-signals between the arrangement of solder-balls and the ridge-air-waveguide. The transition-feature is characterized as a slot that extends between the arrangement of solder-balls and the ridge-air-waveguide. The transition-feature may be an L-shaped-slot or a U-shaped-slot. The assembly is designed/configured to be compatible with known printed circuit board fabrication processes.

Abstract: An illustrative example antenna device includes a substrate. A plurality of conductive members in the substrate establish a substrate integrated waveguide. A plurality of first and second slots are on an exterior surface of a first portion of the substrate. Each of the second slots is associated with a respective one of the first slots. The first and second slots are configured to establish a radiation pattern that varies across a beam of radiation emitted by the antenna device. A plurality of parasitic interruptions include slots on the exterior surface of a second portion of the substrate. The parasitic interruptions reduce ripple effects otherwise introduced by adjacent antennas.

Abstract: A transceiver includes first electrical channels and second electrical channels. The first electrical channels are configured to transfer electromagnetic signals to first air waveguides. Each of the first electrical channels extend from a transmitter along an exterior surface of a chip package that supports the transmitter and terminate at first transitions on the exterior surface. Each of the first plurality of air waveguides are attached to the exterior surface and overlay one of the first transitions. The transceiver also includes second electrical channels configured to transfer second electromagnetic signals from second air waveguides. Each of the second electrical channels extend from a receiver along the exterior surface of the chip package that supports the receiver and terminate at second transitions on the exterior surface. Each of the second air waveguides are attached to the exterior surface and overlay one of the second transitions.

Abstract: An illustrative example antenna device includes a substrate. A plurality of conductive members in the substrate establish a substrate integrated waveguide. A plurality of first and second slots are on an exterior surface of a first portion of the substrate. Each of the second slots is associated with a respective one of the first slots. The first and second slots are configured to establish a radiation pattern that varies across a beam of radiation emitted by the antenna device. A plurality of parasitic interruptions include slots on the exterior surface of a second portion of the substrate. The parasitic interruptions reduce ripple effects otherwise introduced by adjacent antennas.

Abstract: A signal handling device includes a first substrate. A plurality of first conductors in the first substrate are arranged to form a substrate integrated waveguide. A second substrate includes a plurality of second conductors arranged to form a resonating cavity near one end of the substrate integrated waveguide. A signal carrier is aligned with the one end of the substrate integrated waveguide.

Abstract: A radar assembly includes a monolithic-microwave-integrated-circuit (MMIC), an antenna-element, and a single printed-circuit-board (PCB). The MMIC includes an arrangement of solder-balls configured to couple radar-signals into or out of the MMIC. The antenna-element includes a ridge-air-waveguide configured to propagate radar-signals to or from one or more radiation-slots of the antenna-element. The PCB is directly attached to the MMIC. The PCB includes a transition-feature configured to couple radar-signals between the arrangement of solder-balls and the ridge-air-waveguide. The transition-feature is characterized as a slot that extends between the arrangement of solder-balls and the ridge-air-waveguide. The transition-feature may be an L-shaped-slot or a U-shaped-slot. The assembly is designed/configured to be compatible with known printed circuit board fabrication processes.

Abstract: Various embodiments of an electronic assembly and a method of forming such assembly are disclosed. The electronic assembly includes a first integrated circuit package electrically connected to a second integrated circuit package. The first integrated circuit package includes a dielectric layer, a patterned conductive layer disposed within the dielectric layer, a device disposed on the first major surface of the dielectric layer and electrically connected to the patterned conductive layer, and an encapsulant layer disposed on the device and at least a portion of the first major surface of the dielectric layer. A conductive pillar of the second integrated circuit package is disposed within a trench of the first integrated circuit package such that the conductive pillar is electrically connected to a conductor disposed within the trench of the first integrated circuit package. The conductive pillar is electrically connected to a patterned conductive layer of the second integrated circuit package.

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Abstract: An illustrative example antenna device includes a substrate, a transmission line supported on the substrate, and a plurality of conductive patches supported on the substrate. Each conductive patch has a first end coupled to the transmission line and a second end coupled to ground. The plurality of conductive patches are arranged in sets including two of the conductive patches facing each other on opposite sides of the transmission line.

Abstract: A signal handling device includes a first substrate. A plurality of first conductors in the first substrate are arranged to form a substrate integrated waveguide. A second substrate includes a plurality of second conductors arranged to form a resonating cavity near one end of the substrate integrated waveguide. A signal carrier is aligned with the one end of the substrate integrated waveguide.