Abstract: The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.

Abstract: The present invention relates to masking techniques and apparatuses, and in particular, to a method and apparatus for masking a flexible substrate to be coated with one or more material layers. The method involves flexing a substrate to provide a curved surface and providing a flexible sheet on the curved surface to properly apply a coating on the surface of the substrate. The apparatus includes a substrate and a flexible sheet. An elastic material, such as a spring pin, or an off-axis roll-down bar may be used to create the tension used to flex the substrate and or flexible sheet.

Abstract: A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.

Abstract: A method of manufacturing a sulfated paste for use in a lead acid battery cell comprises introducing sulfuric acid to an oxide of lead and subsequently introducing a tin-containing material.

Abstract: A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.

Abstract: An active paste for an lead-acid electrochemical cell which in a preferred embodiment includes tin; a method of manufacturing the same; and an electrochemical cell utilizing the same. The tin may be a tin sulfate, tin oxide, or metallic tin. The active paste sandwiches a primarily lead film which may, but need not, also include tin, to form a positive electrode. One or more positive electrodes are interleafed with a number of negative electrodes, separated by a separator material. The assembly is placed in a container and electrolyte is introduced. In alternate embodiments, the paste may include some combination of antimony, arsenic, germanium, indium, selenium, gallium, tellurium or other semiconductor materials with or without tin compounds.

Abstract: An active paste for an lead-acid electrochemical cell which in a preferred embodiment includes tin; a method of manufacturing the same; and an electrochemical cell utilizing the same. The tin may be a tin sulfate, tin oxide, or metallic tin. The active paste sandwiches a primarily lead film which may, but need not, also include tin, to form a positive electrode. One or more positive electrodes are interleafed with a number of negative electrodes, separated by a separator material. The assembly is placed in a container and electrolyte is introduced. In alternate embodiments, the paste may include some combination of antimony, arsenic, germanium, indium, selenium, gallium, tellurium or other semiconductor materials with or without tin compounds.

Abstract: An active paste for an lead-acid electrochemical cell which in a preferred embodiment includes tin; a method of manufacturing the same; and an electrochemical cell utilizing the same. The tin may be a tin sulfate, tin oxide, or metallic tin. The active paste sandwiches a primarily lead film which may, but need not, also include tin, to form a positive electrode. One or more positive electrodes are interleafed with a number of negative electrodes, separated by a separator material. The assembly is placed in a container and electrolyte is introduced. In alternate embodiments, the paste may include some combination of antimony, arsenic, germanium, indium, selenium, gallium, tellurium or other semiconductor materials with or without tin compounds.

Abstract: An active paste for an lead-acid electrochemical cell which in a preferred embodiment includes tin; a method of manufacturing the same; and an electrochemical cell utilizing the same. The tin may be a tin sulfate, tin oxide, or metallic tin. The active paste sandwiches a primarily lead film which may, but need not, also include tin, to form a positive electrode. One or more positive electrodes are interleafed with a number of negative electrodes, separated by a separator material. The assembly is placed in a container and electrolyte is introduced. In alternate embodiments, the paste may include some combination of antimony, arsenic, germanium, indium, selenium, gallium, tellurium or other semiconductor materials with or without tin compounds.