Patents by Inventor Shawn Whaley

Shawn Whaley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable gap hard stop design
    Patent number: 10087525
    Abstract: A reaction system for processing semiconductor substrates is disclosed. The reaction system includes a susceptor for holding the substrate as well as a baseplate as a part of housing for the reaction system. A pin located on the susceptor can interact with a baseplate feature located on the baseplate to result in a variable gap between the susceptor and the baseplate. The baseplate feature may take the form of a series of steps, a wedge, or a milled-out feature.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: October 2, 2018
    Assignee: ASM IP Holding B.V.
    Inventors: Michael Schmotzer, Shawn Whaley
  • Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization
    Patent number: 9589801
    Abstract: Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 7, 2017
    Assignee: Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University
    Inventors: Nicole Herbots, Shawn Whaley, Robert Culbertson, Ross Bennett-Kennett, Ashlee Murphy, Matthew Bade, Sam Farmer, Brance Hudzietz
  • VARIABLE GAP HARD STOP DESIGN
    Publication number: 20170040206
    Abstract: A reaction system for processing semiconductor substrates is disclosed. The reaction system includes a susceptor for holding the substrate as well as a baseplate as a part of housing for the reaction system. A pin located on the susceptor can interact with a baseplate feature located on the baseplate to result in a variable gap between the susceptor and the baseplate. The baseplate feature may take the form of a series of steps, a wedge, or a milled-out feature.
    Type: Application
    Filed: August 4, 2015
    Publication date: February 9, 2017
    Inventors: Michael Schmotzer, Shawn Whaley
  • Methods for Wafer Bonding and for Nucleating Bonding Nanophases Using Wet and Steam Pressurization
    Publication number: 20140235031
    Abstract: Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
    Type: Application
    Filed: October 31, 2012
    Publication date: August 21, 2014
    Inventors: Nicole Herbots, Shawn Whaley, Robert Culbertson, Ross Bennett-Kennett, Ashlee Murphy, Matthew Bade, Sam Farmer, Brance Hudzietz