Patents by Inventor Shay Assaf
Shay Assaf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894251Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.Type: GrantFiled: January 5, 2022Date of Patent: February 6, 2024Assignee: Applied Materials, Inc.Inventors: Jacob Newman, Ulrich Oldendorf, Martin Aenis, Andrew J. Constant, Shay Assaf, Jeffrey C. Hudgens, Alexander Berger, William Tyler Weaver
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Patent number: 11817332Abstract: Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.Type: GrantFiled: September 22, 2020Date of Patent: November 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: William T. Weaver, Andrew J. Constant, Shay Assaf, Jacob Newman
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Publication number: 20230187239Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.Type: ApplicationFiled: February 9, 2023Publication date: June 15, 2023Inventors: Jacob Newman, Andrew J. Constant, Michael R. Rice, Paul B. Reuter, Shay Assaf, Sushant S. Koshti
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Publication number: 20230113673Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.Type: ApplicationFiled: October 12, 2021Publication date: April 13, 2023Inventors: Sushant S. Koshti, Paul B. Reuter, David Phillips, Jacob Newman, Andrew J. Constant, Michael R. Rice, Shay Assaf, Srinivas Poshatrahalli Gopalakrishna, Devendra Channappa Holeyannavar, Douglas B. Baumgarten, Arunkumar Ramachandraiah, Narayanan Ramachandran
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Patent number: 11581203Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.Type: GrantFiled: August 3, 2021Date of Patent: February 14, 2023Assignee: Applied Materials, Inc.Inventors: Jacob Newman, Andrew J. Constant, Michael R. Rice, Paul B. Reuter, Shay Assaf, Sushant S. Koshti
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Publication number: 20220130700Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.Type: ApplicationFiled: January 5, 2022Publication date: April 28, 2022Inventors: Jacob NEWMAN, Ulrich OLDENDORF, Martin AENIS, Andrew J. CONSTANT, Shay ASSAF, Jeffrey C. HUDGENS, Alexander BERGER, William Tyler WEAVER
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Publication number: 20220068677Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.Type: ApplicationFiled: August 3, 2021Publication date: March 3, 2022Inventors: Jacob Newman, Andrew J. Constant, Michael R. Rice, Paul B. Reuter, Shay Assaf, Sushant S. Koshti
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Patent number: 11232965Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.Type: GrantFiled: October 2, 2019Date of Patent: January 25, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Jacob Newman, Ulrich Oldendorf, Martin Aenis, Andrew J. Constant, Shay Assaf, Jeffrey C. Hudgens, Alexander Berger, William Tyler Weaver
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Patent number: 11204312Abstract: Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.Type: GrantFiled: March 13, 2020Date of Patent: December 21, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Ami Sade, Todd Egan, Shay Assaf, Jacob Newman
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Publication number: 20210285865Abstract: Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.Type: ApplicationFiled: March 13, 2020Publication date: September 16, 2021Applicant: Applied Materials, Inc.Inventors: Ami Sade, Todd Egan, Shay Assaf, Jacob Newman
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Publication number: 20210090917Abstract: Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.Type: ApplicationFiled: September 22, 2020Publication date: March 25, 2021Applicant: Applied Materials, Inc.Inventors: William T. Weaver, Andrew J. Constant, Shay Assaf, Jacob Newman
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Patent number: 10818525Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.Type: GrantFiled: June 4, 2019Date of Patent: October 27, 2020Assignee: Applied Materials, Inc.Inventors: Shay Assaf, Andrew Constant, Jacob Newman, Charles Carlson, William Tyler Weaver, Stephen Hickerson
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Patent number: 10665494Abstract: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.Type: GrantFiled: January 31, 2018Date of Patent: May 26, 2020Assignee: Applied Materials, Inc.Inventors: Niranjan Kumar, Seshadri Ramaswami, Shay Assaf, Amikam Sade, Andy Constant, Maureen Breiling
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Publication number: 20200111692Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.Type: ApplicationFiled: October 2, 2019Publication date: April 9, 2020Inventors: Jacob NEWMAN, Ulrich OLDENDORF, Martin AENIS, Andrew J. CONSTANT, Shay ASSAF, Jeffrey C. HUDGENS, Alexander BERGER, William Tyler WEAVER
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Publication number: 20190295872Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.Type: ApplicationFiled: June 4, 2019Publication date: September 26, 2019Inventors: Shay ASSAF, Andrew CONSTANT, Jacob NEWMAN, Charles CARLSON, William Tyler WEAVER, Stephen HICKERSON
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Publication number: 20190237352Abstract: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.Type: ApplicationFiled: January 31, 2018Publication date: August 1, 2019Inventors: Niranjan KUMAR, Seshadri RAMASWAMI, Shay ASSAF, Amikam SADE, Andy CONSTANT, Maureen BREILING
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Patent number: 10361104Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.Type: GrantFiled: July 26, 2017Date of Patent: July 23, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Shay Assaf, Andrew Constant, Jacob Newman, Charles Carlson, William Tyler Weaver, Stephen Hickerson
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Publication number: 20180254207Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.Type: ApplicationFiled: July 26, 2017Publication date: September 6, 2018Inventors: Shay ASSAF, Andrew CONSTANT, Jacob NEWMAN, Charles CARLSON, William Tyler WEAVER, Stephen HICKERSON
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Patent number: 9959610Abstract: A method and apparatus for detecting substrate misalignment (i.e., position displacement error) and/or substrate support misalignment. According to certain aspects, a method for detecting a misalignment of an object in a processing system is provided. The method generally includes obtaining a first image of the object, determining first values associated with pixels in at least one region of the first image, calculating at least one of a center of gravity value of the pixels in the at least one region or an average weight of the pixels in the at least one region, and detecting a misalignment of the object based on at least one of the calculated center of gravity or average weight of the pixels in the at least one region.Type: GrantFiled: October 13, 2015Date of Patent: May 1, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Leonid M. Tertitski, Schubert S. Chu, Shay Assaf, Kim R. Vellore, Zhepeng Cong
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Publication number: 20160125589Abstract: A method and apparatus for detecting substrate misalignment (i.e., position displacement error) and/or substrate support misalignment. According to certain aspects, a method for detecting a misalignment of an object in a processing system is provided. The method generally includes obtaining a first image of the object, determining first values associated with pixels in at least one region of the first image, calculating at least one of a center of gravity value of the pixels in the at least one region or an average weight of the pixels in the at least one region, and detecting a misalignment of the object based on at least one of the calculated center of gravity or average weight of the pixels in the at least one region.Type: ApplicationFiled: October 13, 2015Publication date: May 5, 2016Inventors: Leonid M. TERTITSKI, Schubert S. CHU, Shay ASSAF, Kim R. VELLORE, Zhepeng CONG