Abstract: Vertical field emission devices are described with very small cathode to anode separations. Preferred cathodes have sharp edge emitters extending, outward perpendicular to the surface of the underlying substrate. These sharp edge emitters are produced within planar photolithography by coating sacrificial conformal walls and anisotropic etching. Microencapsulation is used to produce a sealed cavity at low pressure which includes the space between the anode and cathode. The field emission components can be adapted for the production of light emitting, field emission diodes. The individual cathode emitters can be integrated with solid state components on the substrate with each cathode being independently addressable. Arrays of closely packed light emitting, field emission diodes of the present invention are particularly suitable for use in displays. These displays would be useful for flat-panel computer displays and high definition television.