Patents by Inventor She-Fen Tien

She-Fen Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME
    Publication number: 20120080693
    Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.
    Type: Application
    Filed: December 7, 2011
    Publication date: April 5, 2012
    Applicant: TOUCH MICRO-SYSTEM TECHNOLOGY CORPORATION
    Inventors: Hung-Yi LIN, Kuan-Jui HUANG, Yen-Ting KUNG, She-Fen TIEN
  • Light emitting diode package and method of making the same
    Patent number: 8129206
    Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: March 6, 2012
    Assignee: Touch Micro-System Technology Corp.
    Inventors: Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien
  • Method for making light emitting diode chip package
    Patent number: 7732233
    Abstract: The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: June 8, 2010
    Assignee: Touch Micro-System Technology Corp.
    Inventors: Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien
  • LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME
    Publication number: 20100090245
    Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.
    Type: Application
    Filed: June 9, 2009
    Publication date: April 15, 2010
    Inventors: Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien
  • CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
    Publication number: 20090273004
    Abstract: A chip package structure and method thereof uses a semiconductor substrate as a package substrate, which improve heat dissipation. Also, the chip package structure is incorporated with a planarization structure, which renders the chip and the package substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, electrical connections in series or in parallel between chips can be easily implemented by virtue of the planar patterned conductive layer.
    Type: Application
    Filed: June 16, 2009
    Publication date: November 5, 2009
    Inventors: Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien
  • LIGHT EMITTING DIODE CHIP PACKAGE AND METHOD OF MAKING THE SAME
    Publication number: 20090267108
    Abstract: The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.
    Type: Application
    Filed: June 10, 2009
    Publication date: October 29, 2009
    Inventors: Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien