Abstract: An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.

Abstract: A stress reduction interposer is provided for disposition between first and second solder materials of first and second electronic devices, respectively. The stress reduction interposer includes a plate element having a central portion and a periphery surrounding the central portion and being formed to define first cavities having an upper area limit at the periphery and a second cavity having a lower area limit, which is higher than the upper area limit, at the central portion and third and fourth solder materials being disposable in the second cavity and in the first cavities, respectively, to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second and fourth solder materials.

Abstract: A stress reduction interposer is provided for disposition between first and second solder materials of first and second electronic devices, respectively. The stress reduction interposer includes a plate element having a central portion and a periphery surrounding the central portion and being formed to define first cavities having an upper area limit at the periphery and a second cavity having a lower area limit, which is higher than the upper area limit, at the central portion and third and fourth solder materials being disposable in the second cavity and in the first cavities, respectively, to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second and fourth solder materials.

Abstract: An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.

Abstract: A lid includes a frame, a window which is transmissive to radiation and has a peripheral edge sealingly coupled to the frame, and thermal insulating structure which thermally insulates the peripheral edge of the window. In one embodiment, the thermal insulating structure includes a ring which is made of a thermal insulating material, and extends around the window. In a different embodiment, the thermal insulating structure includes an annular gap between the window and frame, the gap extending around the window. The lid may be part of a housing with a sealed chamber therein, where the window facilitates travel of radiation between the chamber and a location external to the housing.

Abstract: A micro-electro-mechanical (MEMS) switch (10, 110) has an electrode (22, 122) covered by a dielectric layer (23, 123), and has a flexible conductive membrane (31, 131) which moves between positions spaced from and engaging the dielectric layer. At least one of the membrane and dielectric layer has a textured surface (138) that engages the other thereof in the actuated position. The textured surface reduces the area of physical contact through which electric charge from the membrane can tunnel into and become trapped within the dielectric layer. This reduces the amount of trapped charge that could act to latch the membrane in its actuated position, which in turn effects a significant increase in the operational lifetime of the switch.