Patents by Inventor Shei-Kung Shi

Shei-Kung Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5630947
    Abstract: The present invention relates to the preparation of a multichip module comprising one or more thin film probes. The thin film probes are useful in in situ probe testing of IC chips. An assembly comprising the multichip module and a circuit board having IC chips in a number corresponding to the number of thin film probes is also claimed.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: May 20, 1997
    Inventors: Shei-Kung Shi, Fu-Hsiang Tseng, Chong-Kai Kuo
  • Patent number: 5626971
    Abstract: The present invention relates to a multichip module comprising one or more thin film probes. The thin film probes are useful in in situ probe testing of IC chips. An assembly comprising the multichip module and a circuit board having IC chips in a number corresponding to the number of thin film probes is also claimed.
    Type: Grant
    Filed: April 24, 1995
    Date of Patent: May 6, 1997
    Inventors: Shei-Kung Shi, Fu-Hsiang Iseng, Chong-Kai Kuo
  • Patent number: 4787404
    Abstract: A low flow rate-low pressure atomizer device is disclosed which is so dimensioned and operated as to accelerate a gas to substantially sonic velocity and cause it to break up a cleaning liquid into small droplets and accelerate these droplets to at least half the velocity of said gas to create shear stress at a surface closely adjacent the exit end of said device, thereby to remove contaminants or the like from said surface.
    Type: Grant
    Filed: June 12, 1987
    Date of Patent: November 29, 1988
    Assignee: International Business Machines Corporation
    Inventors: Donald H. Klosterman, Sofia M. Laskowski, Scott V. Knee, Shei-Kung Shi