Abstract: A DC-DC power converter has an auxiliary tank cascaded to share an efficiency tank's inductor, capacitor, and transformer. Switching transistors pump the auxiliary tank at startup to provide a boost current. The switching frequency is reduced in steps and the voltage gain and power of the converter sensed until the voltage gain matches a voltage gain calculated for the efficiency tank. Then tank switchover occurs and transistors to the efficiency tank are pumped with the last switching frequency used by the auxiliary tank, and the auxiliary tank is not pumped. Since the voltage gains before and after tank switchover are equal, no output voltage deviation or current spike occurs. A voltage sag or failure switches back to the auxiliary tank at a switching frequency determined by a dynamic contour line where the voltage gains of the two tanks are equal for the current power state.

Abstract: A low-core-loss transformer for high transfer ratio and high power density applications can have five pillars including four corner pillars and at least one center pillar between magnetic metal plates. The center pillar provides an additional flux path to reduce thermal and core losses and improve efficiency. Magnetic flux density may be further reduced by having multiple central pillars in an N-track configuration in several kinds of symmetrical arrangements. The low-core-loss transformer achieves a flexible voltage transfer ratio. The ratio can be either even or odd numbers. An odd ratio design is able to fulfill the requirement of future data centers to supply a 400-volt high-distribution power bus. The transformer windings can be traces on a Printed Circuit Board (PCB) that integrate electronic components for a compact and modular design.

Abstract: A power device package includes a substrate, a high side power device, a low side power device and a driver device. The substrate includes a top surface, a bottom surface and a plurality of vias that extend through the substrate. The high side and low side power devices are disposed on the top surface of the substrate and connected with each other. The driver device is disposed on the bottom surface of the substrate and electrically connected with the high side and low side power devices through the vias to drive the high side and low side power devices in response to a control signal. The distance between the driver device and the high side and low side power devices is determined by the thickness of the substrate such that that a parasitic inductance between the driver device and the high side power device or the low side power device is reduced.

Abstract: A power device package includes a substrate, a high side power device, a low side power device and a driver device. The substrate includes a top surface, a bottom surface and a plurality of vias that extend through the substrate. The high side and low side power devices are disposed on the top surface of the substrate and connected with each other. The driver device is disposed on the bottom surface of the substrate and electrically connected with the high side and low side power devices through the vias to drive the high side and low side power devices in response to a control signal. The distance between the driver device and the high side and low side power devices is determined by the thickness of the substrate such that that a parasitic inductance between the driver device and the high side power device or the low side power device is reduced.