Abstract: A system is disclosed. The system includes a load, a voltage regulator circuit coupled to the load a power supply, a load coupled to the power supply to receive one or more voltages from the power supply, and a digital bus, coupled between the power supply and the load. The digital bus transmits power consumption measurements from the load to the power supply and transmits power consumption measurements from the power supply to the load.

Abstract: A multi-core die is provided that allows packets to be communicated across the die using resources of a packet switched network and a circuit switched network.

Abstract: In one embodiment, the present invention includes a method for performing dynamic testing of a many-core processor including a plurality of cores, manipulating data obtained from the dynamic testing into profile information of the many-core processor, and storing the profile information in a non-volatile memory. The non-volatile memory may be within the many-core processor, in some embodiments. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes a method for performing dynamic testing of a many-core processor including a plurality of cores, manipulating data obtained from the dynamic testing into profile information of the many-core processor, and storing the profile information in a non-volatile memory. The non-volatile memory may be within the many-core processor, in some embodiments. Other embodiments are described and claimed.

Abstract: A system is disclosed. The system includes a load, a voltage regulator circuit coupled to the load a power supply, a load coupled to the power supply to receive one or more voltages from the power supply, and a digital bus, coupled between the power supply and the load. The digital bus transmits power consumption measurements from the load to the power supply and transmits power consumption measurements from the power supply to the load.

Abstract: According to embodiments of the disclosed subject matter in this application, a power management system with multiple voltage regulator (“VRs”) may be used to supply power to cores in a many-core processor. Each VR may supply power to a core or a part of a core. Different VRs may provide multiple voltages to a core/part in the many-core processor. The value of the output voltage of a VR may be modulated under the direction of the core/part to which the voltage regulator supplies power. In one embodiment, the multiple VRs may be integrated with cores in a single die. In another embodiment, the power management system with multiple VRs may be on a die (“the VR die”) separate from the die of the many-core processor. The VR die may be included in the same package as the many-core processor die.

Abstract: A multi-core die is provided that allows packets to be communicated across the die using resources of a packet switched network and a circuit switched network.

Abstract: A system is disclosed. The system includes a load, a voltage regulator circuit coupled to the load a power supply, a load coupled to the power supply to receive one or more voltages from the power supply, and a digital bus, coupled between the power supply and the load. The digital bus transmits power consumption measurements from the load to the power supply and transmits power consumption measurements from the power supply to the load.

Abstract: According to embodiments of the disclosed subject matter, cores in a many-core processor may be periodically tested to obtain and/or refresh their dynamic profiles. The dynamic profile of a core may include information on its maximum operating frequency, power consumption, power leakage, functional correctness, and other parameters, as well as the trending information of these parameters. Once a dynamic profile has been created for each core, cores in a many-core processor may be grouped into different bins according to their characteristics. Based on dynamic profiles and the grouping information, the operating system (“OS”) or other software may allocate a task to those cores that are most suitable for the task. The interconnect fabric in the many-core processor may be reconfigured to ensure a high level of connectivity among the selected cores. Additionally, cores may be re-allocated and/or re-balanced to a task in response to changes in the environment.

Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.

Abstract: In one embodiment, the present invention includes a method for performing dynamic testing of a many-core processor including a plurality of cores, manipulating data obtained from the dynamic testing into profile information of the many-core processor, and storing the profile information in a non-volatile memory. The non-volatile memory may be within the many-core processor, in some embodiments. Other embodiments are described and claimed.

Abstract: Methods and associated structures of forming a microelectronic device are described. Those methods comprise forming a plurality of substantially randomly oriented CNT's on a substrate, and forming at least one source/drain pair, wherein the at least one source/drain pair is coupled to the plurality of substantially randomly oriented CNT's.

Abstract: According to embodiments of the disclosed subject matter, cores in a many-core processor may be periodically tested to obtain and/or refresh their dynamic profiles. The dynamic profile of a core may include information on its maximum operating frequency, power consumption, power leakage, functional correctness, and other parameters, as well as the trending information of these parameters. Once a dynamic profile has been created for each core, cores in a many-core processor may be grouped into different bins according to their characteristics. Based on dynamic profiles and the grouping information, the operating system (“OS”) or other software may allocate a task to those cores that are most suitable for the task. The interconnect fabric in the many-core processor may be reconfigured to ensure a high level of connectivity among the selected cores. Additionally, cores may be re-allocated and/or re-balanced to a task in response to changes in the environment.

Abstract: According to embodiments of the disclosed subject matter in this application, a power management system with multiple voltage regulator (“VRs”) may be used to supply power to cores in a many-core processor. Each VR may supply power to a core or a part of a core. Different VRs may provide multiple voltages to a core/part in the many-core processor. The value of the output voltage of a VR may be modulated under the direction of the core/part to which the voltage regulator supplies power. In one embodiment, the multiple VRs may be integrated with cores in a single die. In another embodiment, the power management system with multiple VRs may be on a die (“the VR die”) separate from the die of the many-core processor. The VR die may be included in the same package as the many-core processor die.

Abstract: In general, in one aspect, the disclosure describes a semiconductor device that includes a functional circuit and a dc-to-dc power converter. The power converter converts, regulates, and filters a DC input voltage to produce a DC output voltage and provides the DC output voltage to the functional circuit. The dc-to-dc power converter has an operating frequency above 10 MHz.

Abstract: In some embodiments, the invention involves a system having a first group of integrated circuits connected in a truncated ring fashion, wherein the truncated ring includes a truncated region to allow for additional integrated circuits to be added to the ring. In some embodiments, the invention involves a system having a group of integrated circuits connected in a pseudo ring fashion, wherein the pseudo ring is created by data flow of bi-directional signaling between the integrated circuits. In some embodiments, the invention involves a system having a group of integrated circuits connected in a pseudo differential arrangement in which multiple conductors carrying signals share a common reference signal conductor.

Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.

Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a power management die bonded to the CPU die in a three dimensional packaging layout.

Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator/converter die bonded to the CPU die in a three dimensional packaging layout.

Abstract: An ultracapacitor formed on a semiconductor substrate includes a plurality conductive layers with intervening dielectric layers. These layers form a plurality of capacitors which may be connected in parallel to store a charge for powering an electronic circuit or for performing a variety of integrated circuit applications. A plurality of ultracapacitors of this type may be connected in series or may be designed in stacked configuration for attaining a specific charge distribution profile.