Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heatsink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heat-sink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heat-sink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses a against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heat-sink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses a against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.