Abstract: A wedge assembly for securing a circuit board in an electronic package gi positive surface contact and excellent heat transfer between the multi-layer board and the electronic package as well as positive lock under vibration and shock. A housing, which may be mounted on a multi-layer board, contains a wedge member having two ramped ends within an open cavity having a single ramped end. Means such as a ramped anvil which slides within the cavity under force from a screw is provided within the cavity for adjusting the wedge member relative to the housing to provide positive contact between the electronic package and the multi-layer board.