Patents by Inventor Sheldon Hiemstra

Sheldon Hiemstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic die stack having at least one rotated microelectronic die
    Patent number: 10985136
    Abstract: A microelectronic package may be fabricated having a microelectronic die stack attached to a microelectronic substrate, wherein the microelectronic die stack may include a first microelectronic die having an active surface and an opposing back surface, a first side and an opposing second side, wherein the first microelectronic die may include a plurality of primary bond pads on the active surface proximate the first side and at least one secondary bond pad on the active surface proximate the second side. The microelectronic die stack may further include a second microelectronic die having an active surface and an opposing back surface, wherein the back surface of the second microelectronic die is attached to the active surface of the first microelectronic die and wherein the second microelectronic die is rotated relative to the first microelectronic die to expose the at least one secondary bond pad of the first microelectronic die.
    Type: Grant
    Filed: December 11, 2016
    Date of Patent: April 20, 2021
    Assignee: Intel Corporation
    Inventor: Sheldon Hiemstra
  • MICROELECTRONIC DIE STACK HAVING AT LEAST ONE ROTATED MICROELECTRONIC DIE
    Publication number: 20190279959
    Abstract: A microelectronic package may be fabricated having a microelectronic die stack attached to a microelectronic substrate, wherein the microelectronic die stack may include a first microelectronic die having an active surface and an opposing back surface, a first side and an opposing second side, wherein the first microelectronic die may include a plurality of primary bond pads on the active surface proximate the first side and at least one secondary bond pad on the active surface proximate the second side. The microelectronic die stack may further include a second microelectronic die having an active surface and an opposing back surface, wherein the back surface of the second microelectronic die is attached to the active surface of the first microelectronic die and wherein the second microelectronic die is rotated relative to the first microelectronic die to expose the at least one secondary bond pad of the first microelectronic die.
    Type: Application
    Filed: December 11, 2016
    Publication date: September 12, 2019
    Applicant: INTEL CORPORATION
    Inventor: Sheldon Hiemstra