Abstract: A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.

Abstract: A wire clamp system is disclosed that includes a wire clamp and a wire tie. The wire clamp includes a clamping section having slots configured to receive a wire tie and secure a wire bundle within the clamping section. The wire clamp may be connected to an electrical plug or receptacle connector housing.

Abstract: A connector for mounting an LED to a printed circuit board (PCB) includes a hollow cylindrical body portion with an interior sidewall that defines a hollow cavity at one end to receive the LED threaded base section. The second end has a plurality of conductive contact elements with which to electrically contact the LED. A first electrical contact element includes at least one prong extending partially into the cavity. The prong is flexible for the threaded portion to pass the prong for insertion, and partially return to electrically engage the threaded portion to maintain the threaded portion inside the cavity. The prong also permits removal of the LED rotationally with respect to the cavity. The contact elements are in electrical communication with the LED and the threaded base section when the threaded base section is inserted within the body portion.

Abstract: A wire clamp system is disclosed that includes a wire clamp and a wire tie. The wire clamp includes a clamping section having slots configured to receive a wire tie and secure a wire bundle within the clamping section. The wire clamp may be connected to an electrical plug or receptacle connector housing.

Abstract: A surface mount poke in connector is disclosed for mounting upon a surface of a printed circuit board, and is particularly applicable for printed circuit boards supporting LEDs. The connector has a securing means for engaging an inserted wire lead without the use of solder.

Abstract: A connector for mounting an LED to a printed circuit board (PCB) includes a hollow cylindrical body portion with an interior sidewall that defines a hollow cavity at one end to receive the LED threaded base section. The second end has a plurality of conductive contact elements with which to electrically contact the LED. A first electrical contact element includes at least one prong extending partially into the cavity. The prong is flexible for the threaded portion to pass the prong for insertion, and partially return to electrically engage the threaded portion to maintain the threaded portion inside the cavity. The prong also permits removal of the LED rotationally with respect to the cavity. The contact elements are in electrical communication with the LED and the threaded base section when the threaded base section is inserted within the body portion.

Abstract: A rotary joint and a method for making a rotary joint are disclosed. The rotary joint includes a cylindrical core having an external surface including at least two circumferentially oriented groove regions and a partition region intermediate the groove regions. At least a portion of the surface of a groove region is electrically conductive and at least a portion of the surface of the partition region is electrically insulating. A method for making the rotary joint includes molding the cylindrical core from a plateable resin and molding over at least some of the plateable resin with a non-plateable resin. A conductive material is plated over the plateable resin to form a rotary joint of unitary structure, eliminating the numerous components and assembly steps associated with conventional rotary joints.

Abstract: A surface mount poke in connector is disclosed for mounting upon a surface of an electrical device such as printed circuit board, and is particularly applicable for printed circuit boards supporting LEDs. The connector includes a contact having an engaging mechanism for securing a first and second wire leads to the contact. The contact further has attachment points for connecting the connector to an electrical device surface by soldering.

Abstract: A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.

Abstract: A surface mount device having a surface mount foot and a method for making the same is disclosed. The method includes providing a piece of pre-plated conductive stock of a conductive base material and a corrosion-resistant conductive plating material different from the conductive base material at least partially overlying the conductive base material. The stock is cut and formed to create a surface mount device having a surface mount foot extending therefrom. The surface mount foot has a top surface, a plated bottom surface and an at least one unplated side surface intermediate the top and bottom surfaces. The plated bottom surface is swaged to create a new plated coined edge surface intermediate the unplated side surface and the plated bottom surface of the surface mount foot.

Abstract: A surface mount poke in connector is disclosed for mounting upon a surface of an electrical device such as printed circuit board, and is particularly applicable for printed circuit boards supporting LEDs. The connector includes a contact having an engaging mechanism for securing a first and second wire leads to the contact. The contact further has attachment points for connecting the connector to an electrical device surface by soldering.

Abstract: A surface mount poke in connector is disclosed for mounting upon a surface of a printed circuit board, and is particularly applicable for printed circuit boards supporting LEDs. The connector has a securing means for engaging an inserted wire lead without the use of solder.

Abstract: A rotary joint and a method for making a rotary joint are disclosed. The rotary joint includes a cylindrical core having an external surface including at least two circumferentially oriented groove regions and a partition region intermediate the groove regions. At least a portion of the surface of a groove region is electrically conductive and at least a portion of the surface of the partition region is electrically insulating. A method for making the rotary joint includes molding the cylindrical core from a plateable resin and molding over at least some of the plateable resin with a non-plateable resin. A conductive material is plated over the plateable resin to form a rotary joint of unitary structure, eliminating the numerous components and assembly steps associated with conventional rotary joints.

Abstract: A metallization module for applying a metal layer on the screen of a CRT faceplate panel is described. The metallization module comprises a vacuum chamber having sidewalls, a base, an adaptor plate, and a lid. The adaptor plate is positioned between the lid and the sidewalls of the metallization module. Evacuation of the vacuum chamber causes atmospheric pressure to act against the outside surface of the lid, forming an airtight seal between the lid, the adaptor plate, and the top lip of the sidewalls. A plurality adjustable rods in conjunction with the adaptor plate are used to support the faceplate panel within the metallization module.

Abstract: A metallization module for applying a metal layer on the screen of a CRT faceplate panel is described. The metallization module comprises a vacuum chamber having sidewalls, a base, an adaptor plate, and a lid. The adaptor plate is positioned between the lid and the sidewalls of the metallization module. Evacuation of the vacuum chamber causes atmospheric pressure to act against the outside surface of the lid, forming an airtight seal between the lid, the adaptor plate, and the top lip of the sidewalls. A plurality adjustable rods in conjunction with the adaptor plate are used to support the faceplate panel within the metallization module.