Abstract: The present invention is a conveyor belt cleaning apparatus, comprising: a case, wherein the case is designed to secure to a conveyor belt assembly; a frame member, wherein the frame member is secured to the case; at least one applicator attached to the frame member; tubing attached to the frame member and directly in contact with the applicator; at least one pump connected to the tubing; a solution reservoir connected to the at least one pump.

Abstract: The present invention is a conveyor belt cleaning apparatus, comprising: a case, wherein the case is designed to secure to a conveyor belt assembly; a frame member, wherein the frame member is secured to the case; at least one applicator attached to the frame member; tubing attached to the frame member and directly in contact with the applicator; at least one pump connected to the tubing; a solution reservoir connected to the at least one pump.

Abstract: A conveyor belt cleaning apparatus, comprising; a case, wherein the case is designed to secure to a conveyor belt assembly; a frame member, wherein the frame member is secured to the case; at least one spray nozzle attached to the frame member; at least one pump connected to the at least one spray nozzle; a solution reservoir connected to the at least one pump; at least one applicator attached to the frame member and positioned relative to the at least one spray nozzle.

Abstract: A conveyor belt cleaning apparatus, comprising; a case, wherein the case is designed to secure to a conveyor belt assembly; a frame member, wherein the frame member is secured to the case; at least one spray nozzle attached to the frame member; at least one pump connected to the at least one spray nozzle; a solution reservoir connected to the at least one pump; at least one applicator attached to the frame member and positioned relative to the at least one spray nozzle.

Abstract: An EUV photoresist composition includes paramagnetic particles that are adapted to block EUV radiation. The magnetic manipulation of the paramagnetic particles within a deposited layer of EUV photoresist can beneficially impact focus control and the achievable line width roughness during subsequent photolithographic processing. A spin-coating apparatus for dispensing the EUV photoresist composition onto a substrate includes a plurality of concentric electromagnets located beneath the substrate that influence the distribution of the paramagnetic particles in the photoresist layer.

Abstract: An EUV photoresist composition includes paramagnetic particles that are adapted to block EUV radiation. The magnetic manipulation of the paramagnetic particles within a deposited layer of EUV photoresist can beneficially impact focus control and the achievable line width roughness during subsequent photolithographic processing. A spin-coating apparatus for dispensing the EUV photoresist composition onto a substrate includes a plurality of concentric electromagnets located beneath the substrate that influence the distribution of the paramagnetic particles in the photoresist layer.

Abstract: Semiconductor substrates and methods for processing semiconductor substrates are provided. A method for processing a semiconductor substrate includes providing a semiconductor substrate having an outer edge, a central region, and a peripheral region between the outer edge and the central region. The semiconductor substrate also has an upper surface. The method includes forming an amorphous material over the upper surface of the semiconductor substrate in the peripheral region. Also, the method includes irradiating the upper surface of the semiconductor substrate, wherein the amorphous material inhibits cracking at the outer edge of the semiconductor substrate.

Abstract: Semiconductor substrates and methods for fabricating integrated circuits are provided. A method for fabricating an integrated circuit includes providing a semiconductor substrate having an outer edge, a central region, and a peripheral region between the outer edge and the central region. The semiconductor substrate also has an upper surface. The method includes forming an amorphous material over the upper surface of the semiconductor substrate in the peripheral region. Also, the method includes irradiating the upper surface of the semiconductor substrate, wherein the amorphous material inhibits cracking at the outer edge of the semiconductor substrate.