Abstract: Embodiments of the invention provide hinging and latching hardware and arrangements for enclosures for electronic components. In one embodiment, first and second brackets can be secured to an enclosure frame on first and second sides, respectively, of a door opening. Both brackets can be configured to receive a hinge pin and engage a latching mechanism, such that the brackets can be hingedly secure the door to the enclosure and latch the closed with the door in at least two different orientations. In one embodiment, hinging and latching hardware for an enclosure can include a door wing configured to be secured to an enclosure door, and first and second frame wings configured to be secured to an enclosure frame on different sides of a door opening. The hardware can accordingly provide first and second hinging and latching configurations for the door, with the door in first and second orientations, respectively.

Abstract: Embodiments of the invention provide enclosures for electronic components and methods for manufacturing the same. In one embodiment, the enclosure includes first and second sidewalls formed from a single elongated piece of sheet metal. The first sidewall, the second sidewall, a third sidewall, and a fourth sidewall define an interior space of the enclosure. At least one of the first and second sidewalls includes an edge region folded inwardly relative to the interior space to form a mounting channel. The enclosure further includes a backwall coupled with first edges of the sidewalls and a door hingedly coupled with a second edge of at least one of the sidewalls.

Abstract: Enclosures for electronic components and methods for manufacturing the same are shown. In one embodiment, the enclosure includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall defining an interior space of the enclosure. A first mounting channel and a second mounting channel can be coupled to each one of the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall. A side channel can be removably coupled to the first mounting channel and the second mounting channel. A mounting panel can be removably coupled to the side channel, the mounting panel providing a flat surface extending away from the side channel towards a sidewall opposite a sidewall nearest the side channel and adapted to support electronic components.

Abstract: Embodiments of the invention provide enclosures for electronic components and methods for manufacturing the same. In one embodiment, the enclosure includes first and second sidewalls formed from a single elongated piece of sheet metal. The first sidewall, the second sidewall, a third sidewall, and a fourth sidewall define an interior space of the enclosure. At least one of the first and second sidewalls includes an edge region folded inwardly relative to the interior space to form a mounting channel. The enclosure further includes a backwall coupled with first edges of the sidewalls and a door hingedly coupled with a second edge of at least one of the sidewalls.