Patents by Inventor Shelley Yong

Shelley Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for fabricating an integrated circuit package on a printed circuit board
    Patent number: 7306133
    Abstract: A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: December 11, 2007
    Assignee: ST Assembly Test Services Ltd.
    Inventors: Yonggang Jin, Shelley Yong, Puay Gek Chua, Won Sun Shin
  • System for fabricating an integrated circuit package on a printed circuit board
    Publication number: 20040211817
    Abstract: A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.
    Type: Application
    Filed: April 16, 2004
    Publication date: October 28, 2004
    Applicant: ST ASSEMBLY TEST SERVICES LTD.
    Inventors: Yonggang Jin, Shelley Yong, Puay Gek Chua, Won Sun Shin