Abstract: Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.

Abstract: Various air conditioner systems and methods are presented. An air ventilation chamber assembly may include a first chamber and a second chamber through which air is circulated into an environment to be cooled. A cooling element of a heat pump, may pass through the first chamber of the air ventilation chamber assembly, wherein the cooling element does not pass through the second chamber of the air ventilation chamber assembly. A Peltier cooler may be present that has a cold side and a hot side. The cold side may be is thermodynamically coupled with a surface of the second chamber.

Abstract: Various embodiments of air conditioner units are detailed. Such air conditioner units may use multiple air ventilation chambers arranged on both an indoor and outdoor portion of the air conditioner unit. A through-unit window may be present that permits an unobstructed view through the air conditioner unit between the first air ventilation chamber and the second air ventilation chamber.

Abstract: Described are devices for automatically adapting electrical polarity from a power source to a specified output polarity for use by an electrical load. In one implementation, power adaptation circuitry comprising one or more bridge circuits accept electrical power of unspecified polarity and output specified polarity. The bridge circuit may comprise a plurality of field-effect transistors (FETs) configured such that a particular subset of the FETs are energized to conduct electric current to the outputs when a particular polarity is applied at inputs.

Abstract: Various embodiments of air conditioner units are detailed. Such air conditioner units may use multiple air ventilation chambers arranged on both an indoor and outdoor portion of the air conditioner unit. A through-unit window may be present that permits an unobstructed view through the air conditioner unit between the first air ventilation chamber and the second air ventilation chamber.

Abstract: Various air conditioner systems and methods are presented. An air ventilation chamber assembly may include a first chamber and a second chamber through which air is circulated into an environment to be cooled. A cooling element of a heat pump, may pass through the first chamber of the air ventilation chamber assembly, wherein the cooling element does not pass through the second chamber of the air ventilation chamber assembly. A Peltier cooler may be present that has a cold side and a hot side. The cold side may be is thermodynamically coupled with a surface of the second chamber.

Abstract: A circuit protection device includes a housing, which includes first and second electrodes. The device includes a conductive slider inside the housing. At a first location within the housing, the slider provides an electrical connection between the first and second electrodes. At a second location within the housing, the slider does not provide the electrical connection. A spring is secured to and stretched between the slider and an inner side of the housing such that the spring is held in tension in an expanded state. The slider is held at the first location by a solder between the slider and the first and second electrodes. After the device is armed, detection of an over-temperature condition causes the solder to begin to melt and the spring to compress and pull the slider to the second location within the housing, thus severing the electrical connection between the first and second electrodes.

Abstract: Described in this disclosure are battery contacts for use in electronic devices usable without soldering to a circuit board. The battery contact includes one or more contact features supported by leaf springs. The contact features touch a corresponding pad on the circuit board at time of assembly, providing an electrically conductive pathway. One or more of the battery contacts may include a spring-biased member configured to apply pressure to one or more batteries.

Abstract: Described in this disclosure is a battery retention device which may include an integral gasket configured to provide an interface between a portion of a battery compartment and a circuit board. The battery retention device may comprise an elastomeric material and one or more retention features configured to prevent Euler buckling in batteries positioned in tandem with one another.

Abstract: A circuit protection device includes a housing, which includes first and second electrodes. The device includes a conductive slider inside the housing. At a first location within the housing, the slider provides an electrical connection between the first and second electrodes. At a second location within the housing, the slider does not provide the electrical connection. A spring is secured to and stretched between the slider and an inner side of the housing such that the spring is held in tension in an expanded state. The slider is held at the first location by a solder between the slider and the first and second electrodes. After the device is armed, detection of an over-temperature condition causes the solder to begin to melt and the spring to compress and pull the slider to the second location within the housing, thus severing the electrical connection between the first and second electrodes.

Abstract: A shock resistant device. A printed circuit board comprising electronics and a frequency reference is rigidly mounted to a central support member. The electronics can be mounted to both surfaces of the printed circuit board. The central support member is mounted to an enclosure via wire rope isolators. The central support member is designed to maximize rigidity at minimum mass. The central support member can comprise a thin wall metal mesh or honeycomb. At least a portion of the central support member directly contacts the printed circuit board beneath the frequency reference.

Abstract: A shock resistant device. A printed circuit board comprising electronics and a frequency reference is rigidly mounted to a central support member. The electronics can be mounted to both surfaces of the printed circuit board. The central support member is mounted to an enclosure via wire rope isolators. The central support member is designed to maximize rigidity at minimum mass. The central support member can comprise a thin wall metal mesh or honeycomb. At least a portion of the central support member directly contacts the printed circuit board beneath the frequency reference.