Patents by Inventor Shen-An Hsu

Shen-An Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973001
    Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20240122078
    Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
  • Publication number: 20240119170
    Abstract: Provided is a system and platform for Machine Learning (ML) based Data Discovery and Classification. The system and platform comprising components of a user console, a ML agent, and a ML data engine. By way of a ML pipeline, sensitive data is obfuscated that would otherwise by in the clear when transmitted to a centralized server. The ML model pipeline decouples embedding from model training. In a first step, the ML Agent runs on data endpoint machine or proxy to convert clear text data to embedding vectors. In a second step, the ML data engine runs on a centralized server to train models using the embedding vectors. The separation of pipeline components and respective handling of workflow requests and messages associated therewith prevents the transfer of clear data in the open. Other embodiments disclosed.
    Type: Application
    Filed: October 6, 2022
    Publication date: April 11, 2024
    Applicant: THALES DIS CPL USA, INC.
    Inventors: Feng XU, Haochong SHEN, Yen-Fen HSU, Sudhir KUMAR
  • Publication number: 20240108820
    Abstract: An atomization device and a method of predicting atomization time for the same are provided. The atomization device includes a control module, an atomization module and a breathing sensing module. The method includes: configuring the breath sensing module to detect inhalations of a user using the atomization device, so as to generate initial breath data correspondingly; and configuring the control module to perform: comparing inhalation data of the initial breath data with a valid inhalation standard to obtain valid inhalation data and filter noise; statistically analyzing the valid inhalation data to generate a predicted value of inhalation time; calculating an atomization time according to the predicted value of the inhalation time; and generating a driving signal to drive the atomization module to perform atomization according to the atomization time.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 4, 2024
    Inventors: CHIEN-SHEN TSAI, SHIH-CHAO LUO, YUAN-MING HSU, CHUN-CHIA JUAN
  • Publication number: 20240104309
    Abstract: A method includes receiving an input for a large language model (LLM) from a user. The method also includes generating one or more token embeddings based on the input. The method further includes generating one or more prompt embeddings based on the input using a contextual prompt generator (CPG), the one or more prompt embeddings representing new or updated information that is not contained in existing knowledge of the LLM. The method also includes providing the one or more token embeddings and the one or more prompt embeddings to the LLM. In addition, the method includes outputting a prediction based on the one or more token embeddings and the one or more prompt embeddings using the LLM, wherein the prediction reflects the new or updated information represented by the one or more prompt embeddings.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 28, 2024
    Inventors: Yen-Chang Hsu, Harshavardhan Kamarthi, Yilin Shen, Hongxia Jin
  • Patent number: 11943939
    Abstract: An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Kai Hsu, Jerry Chang Jui Kao, Chin-Shen Lin, Ming-Tao Yu, Tzu-Ying Lin, Chung-Hsing Wang
  • Publication number: 20240096731
    Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
  • Publication number: 20240096822
    Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Chia-Kuei HSU, Ming-Chih YEW, Shu-Shen YEH, Che-Chia YANG, Po-Yao LIN, Shin-Puu JENG
  • Publication number: 20240096778
    Abstract: A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Inventors: Ya-Huei LEE, Shu-Shen YEH, Kuo-Ching HSU, Shyue-Ter LEU, Po-Yao LIN, Shin-Puu JENG
  • Publication number: 20220143177
    Abstract: The present disclosure provides a novel method for modulating mucosal immune response, comprising administering an antigen to a mucosal site of a subject in need thereof, and administering an immunomodulator to a different anatomical mucosal site of said subject. The antigen may be administered to sublingual mucosa and the immunomodulator may be administered to intranasal mucosa. An immune response involving production of IgG and IgA against the antigen may be elicited.
    Type: Application
    Filed: March 18, 2020
    Publication date: May 12, 2022
    Inventors: Yu-Shen HSU, Mingi CHANG, Ssu-Wei KANG
  • Publication number: 20210346491
    Abstract: The present disclosure provides a method for the treatment or prophylaxis of coronavirus infection, comprising administering a therapeutically effective amount of an immunomodulator to a subject in need thereof or at risk of coronavirus infection. A vaccine composition comprising a pharmaceutically effective amount of an immunomodulator is also provided.
    Type: Application
    Filed: May 7, 2021
    Publication date: November 11, 2021
    Inventors: YU-SHEN HSU, SSU-WEI KANG, MING-I CHANG
  • Patent number: 11172282
    Abstract: An earphone has a housing, a sound output hole, a first touch sensor, a second touch, a third touch sensor, and a microprocessor. The microprocessor is coupled to the first touch sensor, the second touch sensor and the third touch sensor for determining whether the earphone is worn on an ear according to the sensing result of the first touch sensor, determining whether the earphone is held in hand according to the sensing result of the second touch sensor, and providing a corresponding control function according to the sensing result of the third touch sensor.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: November 9, 2021
    Assignee: ITE Tech. Inc.
    Inventors: Chia-Shen Hsu, Ping-Yuan Wang
  • Patent number: 11137836
    Abstract: The disclosure provides an electronic device, including a body and a mouse body. The body includes an accommodating area. The mouse body includes a touch surface and is detachably disposed in the accommodating area.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: October 5, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Pin-Tang Chiu, Yung-Shen Hsu, Ping-Chang Huang, Ling Tien
  • Patent number: 10921933
    Abstract: A touch detection apparatus and a touch detection method are provided. The touch detection apparatus includes a sensing element and a detection circuit. The touch detection method includes the following steps. At least one touch sensing value is provided by the sensing element. Whether a first object touches the sensing element is determined by the detection circuit according to the at least one touch sensing value and a first reference value in a first stage. If the first object touches the sensing element, a second reference value is calculated by the detection circuit according to the at least one touch sensing value and the detection circuit enters a second stage. Whether a second object touches the first object is determined by the detection circuit according to the at least one touch sensing value and the second reference value in the second stage.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: February 16, 2021
    Assignee: ITE Tech. Inc.
    Inventors: Chih-Hsuan Lo, Chia-Shen Hsu
  • Publication number: 20210041362
    Abstract: The present invention relates to a fluorescent polymer cast on the surface of wells of a plate and a plate comprising the fluorescent polymer. The plate is used in a method for calibrating read-out values of plate readers. The method for calibrating the plate readers can effectively reduce the deviation of read-out values among different plate readers.
    Type: Application
    Filed: October 28, 2020
    Publication date: February 11, 2021
    Inventors: Cheng-Tse LIN, Yi-Ming SUN, Kuei-Shen HSU, Liang-Han CHANG, Yao-Kuang CHUNG, Chin-Yun WU, Chin-Shiou HUANG
  • Publication number: 20210044886
    Abstract: An earphone has a housing, a sound output hole, a first touch sensor, a second touch, a third touch sensor, and a microprocessor. The microprocessor is coupled to the first touch sensor, the second touch sensor and the third touch sensor for determining whether the earphone is worn on an ear according to the sensing result of the first touch sensor, determining whether the earphone is held in hand according to the sensing result of the second touch sensor, and providing a corresponding control function according to the sensing result of the third touch sensor.
    Type: Application
    Filed: August 5, 2020
    Publication date: February 11, 2021
    Inventors: Chia-Shen Hsu, Ping-Yuan Wang
  • Publication number: 20210019013
    Abstract: A touch detection apparatus and a touch detection method are provided. The touch detection apparatus includes a sensing element and a detection circuit. The touch detection method includes the following steps. At least one touch sensing value is provided by the sensing element. Whether a first object touches the sensing element is determined by the detection circuit according to the at least one touch sensing value and a first reference value in a first stage. If the first object touches the sensing element, a second reference value is calculated by the detection circuit according to the at least one touch sensing value and the detection circuit enters a second stage. Whether a second object touches the first object is determined by the detection circuit according to the at least one touch sensing value and the second reference value in the second stage.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 21, 2021
    Applicant: ITE Tech. Inc.
    Inventors: Chih-Hsuan Lo, Chia-Shen Hsu
  • Patent number: 10624962
    Abstract: A detoxified recombinant E. coli heat-labile enterotoxin mutant, LTS61K, is employed as a carrier protein to conjugate polysaccharide. The LTS61K contains a mutated mature sub-unit A (LTA) that includes lysine at amino acid position 61 and a wild-type mature sub-unit B (LTB). Various types of bacterial capsular polysaccharide antigens were chemically conjugated with the LTS61K protein by a reductive amination reaction. The conjugated polysaccharide-LTS61K products were physically, chemically and biochemically identified as soluble form. Rabbits were immunized intramuscularly to determine the immunogenicity of conjugated vaccines by ELISA to detect anti-polysaccharide antigen IgG titers and serum bactericidal assay thereby determining the functional activity of the antibodies. Study results show that conjugated polysaccharide-LTS61K vaccines induce higher polysaccharide-specific IgG titers and greater bactericidal activity in sera than that of polysaccharide alone or polysaccharide mixed with LTS61K.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: April 21, 2020
    Assignee: DEVELOPMENT CENTER FOR BIOTECHNOLOGY
    Inventors: Yu-Shen Hsu, I-Ling Kou, Kuo-Chan Hung, Yuan-Hsin Lu, Ta-Tung Yuan
  • Patent number: D909847
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: February 9, 2021
    Assignee: SUNDOVE INDUSTRIAL CO., LTD.
    Inventor: Yu-Shen Hsu
  • Patent number: D971708
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: December 6, 2022
    Assignee: SUNDOVE INDUSTRIAL CO., LTD.
    Inventor: Yu-Shen Hsu