Abstract: A heat dissipation structure for an electronic device is adhered on the electronic device to conduct heat dissipation. The heat dissipation structure includes at least one heat dissipation structure element. Each heat dissipation structure element includes a high thermal conductivity material element and a thermal conductivity insulating medium which is disposed between the high thermal conductivity material element and outside area to provide insulation and thermal conductivity function. The thermal conductivity insulating medium is made of a combination of ceramic and polymers. The thermal conductivity insulating medium has an additional heat conductivity effect of a third dimensional heat dissipation that replaces the thin strip made of PET, manufactured as “Mylar”, widely used in the electronic components for insulation. The heat dissipation area is increased greatly and a high efficient heat dissipation effect is achieved.

Abstract: A material vacuum stirring and dispersing device includes a closed container for stirring solid and liquid under vacuum condition, making it possible to stir materials evenly, without forming material balls to enhance the quality of the mixture. The device further includes a material feeder positioned on the closed container for feeding solid or powder materials evenly into the closed container in which is placed the liquid, and a stirring member having a straight shaft extending out and in the closed container with a plurality of stirring leaves fixed on a lower end of the straight shaft in the container. The straight shaft is rotated by a rotating device placed outside of the closed container and is movable up and down as well so as to make the stirring leaves rotate and also move and down to stir completely the solid with the liquid in the closed container.