Abstract: A method for manufacturing a middle frame assembly for a mobile phone manufactures a middle frame by sheet metal machining processes, forms an antenna on the middle frame by injection-molding processes, and forms an outer frame as a coating on an edge of the middle frame by the other injection-molding processes. The disclosure further provides a middle frame assembly and an electronic device. The method is simple and low in processing cost.

Abstract: A combination milling bit and cutter employed to machine a distal end of a workpiece is provided, in which the milling cutter includes a handle and a cutting portion formed on an end of the handle. The cutting portion includes two cutting edges; at least one of the two cutting edges comprises one cutting sub-edge for milling the distal end of the workpiece to form an end surface, and another cutting sub-edge for chamfering the distal end of the workpiece at both an annular outer chamfering surface and an annular inner chamfering surface on the distal end. The combination milling and cutting cutter device carries out both milling and cutting actions in a single operation.

Abstract: An electronic device enclosure includes a metallic body and a metallic speaker-receiving member. The metallic body includes a first side, a second side, and a crossbeam connecting the first side and the second side. A first connecting portion extends from the second side and parallel to the crossbeam. A distal portion of the first side define a first connecting plane. The first connecting portion defines a first connecting surface. The metallic speaker-receiving member includes a first sidewall and a second sidewall. The first sidewall defines a second connecting portion. A second connecting plane is defined by a bent distal end of the second sidewall. The second connecting plane is welded to the first connecting plane, and the second connecting portion is welded to the first connecting portion to securely attach the metallic speaker-receiving member to the metallic body. Such a configuration allows miniaturization of the electronic device enclosure.

Abstract: An electronic device enclosure includes a metallic body and a metallic speaker-receiving member. The metallic body includes a first side, a second side, and a crossbeam connecting the first side and the second side. A first connecting portion extends from the second side and parallel to the crossbeam. A distal portion of the first side define a first connecting plane. The first connecting portion defines a first connecting surface. The metallic speaker-receiving member includes a first sidewall and a second sidewall. The first sidewall defines a second connecting portion. A second connecting plane is defined by a bent distal end of the second sidewall. The second connecting plane is welded to the first connecting plane, and the second connecting portion is welded to the first connecting portion to securely attach the metallic speaker-receiving member to the metallic body. Such a configuration allows miniaturization of the electronic device enclosure.