Patents by Inventor Shen Chiu
Shen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200145403Abstract: An authentication system includes a storage device, an authentication server, a work server, and a user device. The authentication server communicates with the storage device. The work server communicates with the authentication server. The user device communicates with the authentication server and the work server. The user device logins in the authentication server and obtains an authentication token from the authentication server. The authentication server obtains an information from the storage device and transmits the information to the work server. The user device transmits the authentication token to the authentication server through the work server to perform authentication. The work server obtains an authentication result from the authentication server. When the authentication result is correct, the work server performs an operation request of the user device for the information.Type: ApplicationFiled: October 31, 2019Publication date: May 7, 2020Inventors: Hung-Chih Chang, Mu-Jen Ting, Po-Shen Chiu
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Publication number: 20170321748Abstract: A threadless linear guide includes a rail, a slide block, a recirculation assembly, and a fixing member. The slide block, the recirculation assembly, and the fixing member are positionable with respect to each other through retention engagements therebetween so that the components can be coupled to each other without screws. A reinforcement plate is provided for reinforcing the strength of the recirculation assembly for the recirculation assembly is generally formed of injecting molding, while the fixing member and the reinforcement plate are made of metal. Thus, with the fixing member and the reinforcement plate enclosing the recirculation assembly, any foreign object jamming in the interior would not cause the rolling bodies to eject out through the recirculation assembly during the operation of rolling bodies.Type: ApplicationFiled: May 3, 2016Publication date: November 9, 2017Inventors: Yung-Shen Chiu, Shi-Jin Tao
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Patent number: 9797444Abstract: A threadless linear guide includes a rail, a slide block, a recirculation assembly, and a fixing member. The slide block, the recirculation assembly, and the fixing member are positionable with respect to each other through retention engagements therebetween so that the components can be coupled to each other without screws. A reinforcement plate is provided for reinforcing the strength of the recirculation assembly for the recirculation assembly is generally formed of injecting molding, while the fixing member and the reinforcement plate are made of metal. Thus, with the fixing member and the reinforcement plate enclosing the recirculation assembly, any foreign object jamming in the interior would not cause the rolling bodies to eject out through the recirculation assembly during the operation of rolling bodies.Type: GrantFiled: May 3, 2016Date of Patent: October 24, 2017Assignee: HIWIN TECHNOLOGIES CORPInventors: Yung-Shen Chiu, Shi-Jin Tao
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Patent number: 9169501Abstract: Disclosed is a method for producing biodegradable polymer and ethanol converted from carbon source by using recombinant microorganisms, comprising the steps of: (A) providing recombinant microorganisms transformed with plasmids containing at least a gene encoding for glycerol utilizing enzyme and a gene encoding for polyhydroxyalkanoate synthase; (B) culturing the recombinant microorganisms in a medium containing glycerol; (C) inducing expression of the genes of step (A), thereby obtaining polyhydroxyalkanoate and ethanol; and (D) recovering the polyhydroxyalkanoate and the ethanol; wherein the recombinant microorganisms have a glycerol utilization rate more than 90% (w/w), and have polyhydroxyalkanoate accumulated therein to a biomass content thereof at least 30% (w/w).Type: GrantFiled: June 11, 2014Date of Patent: October 27, 2015Assignee: Yuan Ze UniversityInventors: Chi-Wei Lan, Ho-Shing Wu, Feng-Shen Chiu
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Publication number: 20140295507Abstract: Disclosed is a method for producing biodegradable polymer and ethanol converted from carbon source by using recombinant microorganisms, comprising the steps of: (A) providing recombinant microorganisms transformed with plasmids containing at least a gene encoding for glycerol utilizing enzyme and a gene encoding for polyhydroxyalkanoate synthase; (B) culturing the recombinant microorganisms in a medium containing glycerol; (C) inducing expression of the genes of step (A), thereby obtaining polyhydroxyalkanoate and ethanol; and (D) recovering the polyhydroxyalkanoate and the ethanol; wherein the recombinant microorganisms have a glycerol utilization rate more than 90% (w/w), and have polyhydroxyalkanoate accumulated therein to a biomass content thereof at least 30% (w/w).Type: ApplicationFiled: June 11, 2014Publication date: October 2, 2014Inventors: Chi-Wei LAN, Ho-Shing WU, Feng-Shen CHIU
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Publication number: 20130302867Abstract: Disclosed is a method for producing biodegradable polymer and biomass fuel converted from carbon source by using recombinant microorganisms, comprising the steps of: (A) providing recombinant microorganisms transformed with plasmids containing at least a gene encoding for glycerol utilizing enzyme and a gene encoding for polyhydroxyalkanoate synthase; (B) culturing the recombinant microorganisms in a medium containing glycerol; (C) inducing expression of the genes of step (A), thereby obtaining polyhydroxyalkanoate and ethanol; and (D) recovering the polyhydroxyalkanoate and the ethanol; wherein the recombinant microorganisms have a glycerol utilization rate more than 90% (w/w), and have polyhydroxyalkanoate accumulated therein to a biomass content thereof at least 30% (w/w).Type: ApplicationFiled: May 11, 2012Publication date: November 14, 2013Inventors: Chi-Wei Lan, Ho-Shing Wu, Feng-Shen Chiu
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Patent number: 7735940Abstract: A volume-adjustable unit including a first layer, a second layer, and multiple inner paper layers disposed between the first and second layers. Each inner paper layer has two opposing sides, and each of the two opposing sides is adhered to an adjacent layer of the each inner paper layer through an adhesive layer. The adhesive layer includes multiple adhesive strips which are substantially in parallel, are spaced apart from each other and are arranged in such a way that each section of the each inner paper layer adheres to at most one adjacent layer on one of the two opposing sides through an adhesive strip, whereby multiple hexagonal columns are formed by the inner paper layers as the unit is stretched-out. The unit can be used to prepare a volume-adjustable frame of a piece of light furniture and transported from one place to another in smaller volume.Type: GrantFiled: October 27, 2005Date of Patent: June 15, 2010Inventor: Chi-Shen Chiu
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Publication number: 20070096609Abstract: A volume-adjustable unit comprising a first layer, a second layer, and multiple inner paper layers subsequently disposed between the first and second layers, each inner paper layer has two opposing sides, and each of the two opposing sides is adhered to an adjacent layer of the each inner paper layer through an adhesive layer, the adhesive layer comprises multiple adhesive strips, the multiple adhesive strips are formed subsequently and substantially in parallel spaced apart from each other and are arranged in such a way that each section of the each inner paper layer adheres to at most one adjacent layer on one of the two opposing sides through an adhesive strip, whereby multiple hexagonal columns are formed by the inner paper layers as the unit is stretched-out. The unit can be used to prepare a volume-adjustable frame of a piece of furniture that is relatively light and can be transported from one place to another without taking up a lot of space.Type: ApplicationFiled: October 27, 2005Publication date: May 3, 2007Inventor: Chi-Shen Chiu
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Patent number: 6849523Abstract: A process for separating IC dies from a wafer substrate. In one embodiment, complete separation channels are initially cut through the wafer between dies along one axis. Next, partial separation channels are cut into the wafer along an intersecting axis, leaving wafer material connecting adjacent dies. In another embodiment, partial separation channels are cut into the wafer along one axis, after which complete separation channels are cut through the wafer along the intersecting axis. In still another embodiment, partial separation channels are cut along both axes.Type: GrantFiled: March 12, 2003Date of Patent: February 1, 2005Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Te-Tsung Chao, Shu-Shen Chiu
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Publication number: 20040180514Abstract: A process for separating IC dies from a wafer substrate. In one embodiment, complete separation channels are initially cut through the wafer between dies along one axis. Next, partial separation channels are cut into the wafer along an intersecting axis, leaving wafer material connecting adjacent dies. In another embodiment, partial separation channels are cut into the wafer along one axis, after which complete separation channels are cut through the wafer along the intersecting axis. In still another embodiment, partial separation channels are cut along both axes.Type: ApplicationFiled: March 12, 2003Publication date: September 16, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Te-Tsung Chao, Shu-Shen Chiu
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Patent number: 6750072Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.Type: GrantFiled: April 7, 2003Date of Patent: June 15, 2004Assignee: National Research Council of CanadaInventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-ying Song
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Publication number: 20030211648Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.Type: ApplicationFiled: April 7, 2003Publication date: November 13, 2003Inventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-Ying Song
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Patent number: 6576490Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.Type: GrantFiled: December 14, 2001Date of Patent: June 10, 2003Assignee: National Research Council of CanadaInventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-ying Song
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Publication number: 20030092212Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.Type: ApplicationFiled: December 14, 2001Publication date: May 15, 2003Inventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-Ying Song