Patents by Inventor Shen Chiu

Shen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200145403
    Abstract: An authentication system includes a storage device, an authentication server, a work server, and a user device. The authentication server communicates with the storage device. The work server communicates with the authentication server. The user device communicates with the authentication server and the work server. The user device logins in the authentication server and obtains an authentication token from the authentication server. The authentication server obtains an information from the storage device and transmits the information to the work server. The user device transmits the authentication token to the authentication server through the work server to perform authentication. The work server obtains an authentication result from the authentication server. When the authentication result is correct, the work server performs an operation request of the user device for the information.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 7, 2020
    Inventors: Hung-Chih Chang, Mu-Jen Ting, Po-Shen Chiu
  • Publication number: 20170321748
    Abstract: A threadless linear guide includes a rail, a slide block, a recirculation assembly, and a fixing member. The slide block, the recirculation assembly, and the fixing member are positionable with respect to each other through retention engagements therebetween so that the components can be coupled to each other without screws. A reinforcement plate is provided for reinforcing the strength of the recirculation assembly for the recirculation assembly is generally formed of injecting molding, while the fixing member and the reinforcement plate are made of metal. Thus, with the fixing member and the reinforcement plate enclosing the recirculation assembly, any foreign object jamming in the interior would not cause the rolling bodies to eject out through the recirculation assembly during the operation of rolling bodies.
    Type: Application
    Filed: May 3, 2016
    Publication date: November 9, 2017
    Inventors: Yung-Shen Chiu, Shi-Jin Tao
  • Patent number: 9797444
    Abstract: A threadless linear guide includes a rail, a slide block, a recirculation assembly, and a fixing member. The slide block, the recirculation assembly, and the fixing member are positionable with respect to each other through retention engagements therebetween so that the components can be coupled to each other without screws. A reinforcement plate is provided for reinforcing the strength of the recirculation assembly for the recirculation assembly is generally formed of injecting molding, while the fixing member and the reinforcement plate are made of metal. Thus, with the fixing member and the reinforcement plate enclosing the recirculation assembly, any foreign object jamming in the interior would not cause the rolling bodies to eject out through the recirculation assembly during the operation of rolling bodies.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: October 24, 2017
    Assignee: HIWIN TECHNOLOGIES CORP
    Inventors: Yung-Shen Chiu, Shi-Jin Tao
  • Patent number: 9169501
    Abstract: Disclosed is a method for producing biodegradable polymer and ethanol converted from carbon source by using recombinant microorganisms, comprising the steps of: (A) providing recombinant microorganisms transformed with plasmids containing at least a gene encoding for glycerol utilizing enzyme and a gene encoding for polyhydroxyalkanoate synthase; (B) culturing the recombinant microorganisms in a medium containing glycerol; (C) inducing expression of the genes of step (A), thereby obtaining polyhydroxyalkanoate and ethanol; and (D) recovering the polyhydroxyalkanoate and the ethanol; wherein the recombinant microorganisms have a glycerol utilization rate more than 90% (w/w), and have polyhydroxyalkanoate accumulated therein to a biomass content thereof at least 30% (w/w).
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: October 27, 2015
    Assignee: Yuan Ze University
    Inventors: Chi-Wei Lan, Ho-Shing Wu, Feng-Shen Chiu
  • Publication number: 20140295507
    Abstract: Disclosed is a method for producing biodegradable polymer and ethanol converted from carbon source by using recombinant microorganisms, comprising the steps of: (A) providing recombinant microorganisms transformed with plasmids containing at least a gene encoding for glycerol utilizing enzyme and a gene encoding for polyhydroxyalkanoate synthase; (B) culturing the recombinant microorganisms in a medium containing glycerol; (C) inducing expression of the genes of step (A), thereby obtaining polyhydroxyalkanoate and ethanol; and (D) recovering the polyhydroxyalkanoate and the ethanol; wherein the recombinant microorganisms have a glycerol utilization rate more than 90% (w/w), and have polyhydroxyalkanoate accumulated therein to a biomass content thereof at least 30% (w/w).
    Type: Application
    Filed: June 11, 2014
    Publication date: October 2, 2014
    Inventors: Chi-Wei LAN, Ho-Shing WU, Feng-Shen CHIU
  • Publication number: 20130302867
    Abstract: Disclosed is a method for producing biodegradable polymer and biomass fuel converted from carbon source by using recombinant microorganisms, comprising the steps of: (A) providing recombinant microorganisms transformed with plasmids containing at least a gene encoding for glycerol utilizing enzyme and a gene encoding for polyhydroxyalkanoate synthase; (B) culturing the recombinant microorganisms in a medium containing glycerol; (C) inducing expression of the genes of step (A), thereby obtaining polyhydroxyalkanoate and ethanol; and (D) recovering the polyhydroxyalkanoate and the ethanol; wherein the recombinant microorganisms have a glycerol utilization rate more than 90% (w/w), and have polyhydroxyalkanoate accumulated therein to a biomass content thereof at least 30% (w/w).
    Type: Application
    Filed: May 11, 2012
    Publication date: November 14, 2013
    Inventors: Chi-Wei Lan, Ho-Shing Wu, Feng-Shen Chiu
  • Patent number: 7735940
    Abstract: A volume-adjustable unit including a first layer, a second layer, and multiple inner paper layers disposed between the first and second layers. Each inner paper layer has two opposing sides, and each of the two opposing sides is adhered to an adjacent layer of the each inner paper layer through an adhesive layer. The adhesive layer includes multiple adhesive strips which are substantially in parallel, are spaced apart from each other and are arranged in such a way that each section of the each inner paper layer adheres to at most one adjacent layer on one of the two opposing sides through an adhesive strip, whereby multiple hexagonal columns are formed by the inner paper layers as the unit is stretched-out. The unit can be used to prepare a volume-adjustable frame of a piece of light furniture and transported from one place to another in smaller volume.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: June 15, 2010
    Inventor: Chi-Shen Chiu
  • Publication number: 20070096609
    Abstract: A volume-adjustable unit comprising a first layer, a second layer, and multiple inner paper layers subsequently disposed between the first and second layers, each inner paper layer has two opposing sides, and each of the two opposing sides is adhered to an adjacent layer of the each inner paper layer through an adhesive layer, the adhesive layer comprises multiple adhesive strips, the multiple adhesive strips are formed subsequently and substantially in parallel spaced apart from each other and are arranged in such a way that each section of the each inner paper layer adheres to at most one adjacent layer on one of the two opposing sides through an adhesive strip, whereby multiple hexagonal columns are formed by the inner paper layers as the unit is stretched-out. The unit can be used to prepare a volume-adjustable frame of a piece of furniture that is relatively light and can be transported from one place to another without taking up a lot of space.
    Type: Application
    Filed: October 27, 2005
    Publication date: May 3, 2007
    Inventor: Chi-Shen Chiu
  • Patent number: 6849523
    Abstract: A process for separating IC dies from a wafer substrate. In one embodiment, complete separation channels are initially cut through the wafer between dies along one axis. Next, partial separation channels are cut into the wafer along an intersecting axis, leaving wafer material connecting adjacent dies. In another embodiment, partial separation channels are cut into the wafer along one axis, after which complete separation channels are cut through the wafer along the intersecting axis. In still another embodiment, partial separation channels are cut along both axes.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: February 1, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Te-Tsung Chao, Shu-Shen Chiu
  • Publication number: 20040180514
    Abstract: A process for separating IC dies from a wafer substrate. In one embodiment, complete separation channels are initially cut through the wafer between dies along one axis. Next, partial separation channels are cut into the wafer along an intersecting axis, leaving wafer material connecting adjacent dies. In another embodiment, partial separation channels are cut into the wafer along one axis, after which complete separation channels are cut through the wafer along the intersecting axis. In still another embodiment, partial separation channels are cut along both axes.
    Type: Application
    Filed: March 12, 2003
    Publication date: September 16, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Te-Tsung Chao, Shu-Shen Chiu
  • Patent number: 6750072
    Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: June 15, 2004
    Assignee: National Research Council of Canada
    Inventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-ying Song
  • Publication number: 20030211648
    Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.
    Type: Application
    Filed: April 7, 2003
    Publication date: November 13, 2003
    Inventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-Ying Song
  • Patent number: 6576490
    Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: June 10, 2003
    Assignee: National Research Council of Canada
    Inventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-ying Song
  • Publication number: 20030092212
    Abstract: The present invention relates to a method for micro-fabricating a pixelless thermal imaging device. The imaging device up-converts a sensed 2-dimensional M/FIR image into a 2-dimensional image in the NIR to visible spectrum in dependence thereupon. A plurality of layers forming an integrated QWIP-LED wafer are crystallographically grown on a surface of a first substrate. The layers comprise an etch stop layer, a bottom contact layer, a plurality of layers forming a QWIP and a LED, and a top contact layer. At the top of the QWIP-LED wafer an optical coupler such as a diffraction grating for coupling at least a portion of incident M/FIR light into modes having an electric field component perpendicular to quantum wells of the QWIP is provided. In following processing steps the first substrate and the etch stop layer are removed. Various different thermal imaging devices are manufactured by changing the order of manufacturing steps, omitting some steps or using different materials.
    Type: Application
    Filed: December 14, 2001
    Publication date: May 15, 2003
    Inventors: Margaret Buchanan, Martin Byloos, Shen Chiu, Emmanuel Dupont, Mae Gao, Hui Chun Liu, Chun-Ying Song