Patents by Inventor Shen-Feng CHEN

Shen-Feng CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9558312
    Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: January 31, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Lee-Chung Lu, Wen-Hao Chen, Yuan-Te Hou, Shen-Feng Chen, Meng-Fu You
  • Publication number: 20150248517
    Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.
    Type: Application
    Filed: May 18, 2015
    Publication date: September 3, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Lee-Chung LU, Wen-Hao CHEN, Yuan-Te HOU, Shen-Feng CHEN, Meng-Fu YOU
  • Patent number: 9035361
    Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: May 19, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Lee-Chung Lu, Wen-Hao Chen, Yuan-Te Hou, Shen-Feng Chen, Meng-Fu You
  • Publication number: 20130234212
    Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.
    Type: Application
    Filed: April 26, 2013
    Publication date: September 12, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Lee-Chung LU, Wen-Hao CHEN, Yuan-Te HOU, Shen-Feng CHEN, Meng-Fu YOU
  • Patent number: 8431968
    Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: April 30, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Lee-Chung Lu, Wen-Hao Chen, Yuan-Te Hou, Shen-Feng Chen, Meng-Fu You
  • Publication number: 20120025273
    Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.
    Type: Application
    Filed: July 28, 2010
    Publication date: February 2, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Lee-Chung LU, Wen-Hao CHEN, Yuan-Te HOU, Shen-Feng CHEN, Meng-Fu YOU