Patents by Inventor Shen-Huang Hsu

Shen-Huang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090277614
    Abstract: The heat conduction structure includes a first heat conduction plate, a second heat conduction plate and at least one heat pipes. The second heat conduction plate is positioned below the first heat conduction plate. A pair of walls extends from two opposite edges of the second heat conduction plate. The walls connect to a bottom surface of the first heat conduction plate. A receiving space is defined between the first heat conduction plate and the second heat conduction plate. At least one heat pipe is arranged in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate. Each heat pipe has a heat absorbing section and a plurality of heat emitting sections extending from each heat absorbing section. A plurality of heat dissipating passages is defined between the at least one heat pipe and the walls. The heat emitting sections are partially positioned in the heat dissipating passages.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 12, 2009
    Inventors: Shih-Yuan LIN, Chien-Hsing Wu, Chia-Hsun Lin, Shen-Huang Hsu