Abstract: This technology provides systems and methods for a vehicle computing system (VCS) for autonomous driving. This VCS furnishes End-to-End models that provide sensing, prediction, planning, decision-making, and control functions. The VCS executes vehicle control algorithms, trains general AI models, and makes inferences from those AI models. Specifically, a computing subsystem of the VCS performs computation methods that train a tensor-centered model and/or make inferences from a tensor-centered model. Additionally, the VCS gathers data from a roadside unit network, an onboard unit, a cloud platform, a traffic control center/traffic control unit, and a traffic operations center (TOC), thereby enhancing the safety and efficiency of autonomous driving.

Abstract: A high-power thin film resistor includes a substrate, a resistance layer, an internal electrode layer, a passivation layer and a thermal conductive layer. The resistance layer is disposed on the substrate, and the internal electrode layer has a middle internal electrode area and two terminal internal electrode areas. The resistance layer is divided into a middle resistance area and two terminal resistance areas by the middle internal electrode area and the two terminal internal electrode areas. The passivation layer covers portions of the resistance layer and the internal electrode layer. The thermal conductive layer is disposed on the passivation layer, wherein the thermal conductive layer has two thermal conductors and a gap between the two thermal conductors. The middle internal resistance area and the two terminal resistance areas form a series resistance, and the two terminal resistance areas have the same resistance value.

Abstract: A high-power chip resistor includes a resistance layer, a first thermal conductive layer, an adhesion layer, internal electrodes, a first protection layer and a second thermal conductive layer. The first thermal conductive layer includes first thermal conductors and a first gap between the first thermal conductors. The adhesion layer is disposed between the resistance layer and the first thermal conductive layer to adhere them. The internal electrodes are disposed on two terminals of the resistance layer. The first protection layer covers the resistance layer and portions of upper surfaces of the internal electrodes. The second thermal conductive layer is disposed on the first protection layer and includes two second thermal conductors and a second gap between the second thermal conductors. The second thermal conductors contact other portions of upper surfaces located at two terminals of the internal electrodes and not covered by the first protection layer.

Abstract: The invention provides systems and methods for a vehicle-based cloud computing system (VCCS) for autonomous driving. This VCCS builds world models based on a series of complex scenario data to optimize sensing, prediction, planning, decision making, and control for autonomous driving. The VCCS can execute vehicle control algorithms, train general AI models, and make inferences to optimize autonomous driving. Specifically, it dynamically adjusts driving strategies based on long tail scenarios including but not limited to weather, work zone information, and traffic status, ensuring safe and efficient vehicle operation. Additionally, the VCCS can gather supplementary data from (a) a roadside unit (RSU) network, (b) another OBU, (c) a cloud platform, (d) a traffic control center/traffic control unit (TCC/TCU), and (e) a traffic operations center (TOC), thereby further improving control and efficiency in complex driving environments.

Abstract: A chip resistor includes a substrate, first to fourth electrodes, a resistance layer, a resin electrode layer, first and second insulating protective layers, and first and second external electrode layers. The first and second electrodes are respectively disposed on two opposite edge areas of a front surface of the substrate. The resistance layer extends from the first electrode to the second electrode. The first insulating protective layer completely covers the resistance layer. The resin electrode layer includes first to third portions respectively covering the first and second electrodes, and a portion of the first insulating protective layer. The second insulating protective layer completely covers the third portion and partially covers the first and second portions. The third and fourth electrodes are disposed on a back surface of the substrate. The first and second external electrode layers respectively connect the first and third electrodes, and the second and fourth electrodes.

Abstract: A chip resistor includes a substrate, first and second conductive structures in the substrate, first to third front electrodes and first to third back electrodes respectively on front and back surfaces of the substrate, first and second resistance layers respectively on the front and back surfaces, and first and second external electrode layers. The first to third front electrodes are opposite to the first to third back electrodes. The first back electrode and the first front electrode are connected to the first conductive structure. The first resistance layer is connected to the second front electrode and the second conductive structure. The second resistance layer is connected to the first and third back electrodes and the first and second conductive structures. The first and second external electrode layers respectively connect the first front electrode and the first back electrode, and the second front electrode and the second back electrode.

Abstract: Provided herein is technology relating to aspects of a Distributed Driving System (DDS) for managing Connected and Automated Vehicles (CAV) and particularly, but not exclusively, to systems, designs, and methods for a Device Allocation System (DAS) configured to allocate and distribute resources to devices of a Distributed Driving Systems (DDS).

Abstract: Provided herein is a technology for an Autonomous Vehicle Cloud System (AVCS). This AVCS provides sensing, data fusion, prediction, decision-making, and/or control instructions for specific vehicles at a microscopic level based on data from one or more of other vehicles, roadside unit (RSU), cloud-based platform, and traffic control center/traffic control unit (TCC/TCU). Specifically, the AVs can be effectively and efficiently operated and controlled by the AVCS. The AVCS provides individual vehicles with detailed time-sensitive control instructions for fulfilling driving tasks, including car following, lane changing, route guidance, and other related information. The AVCS is configured to predict individual vehicle behavior and provide planning and decision-making at a microscopic level. In addition, the AVCS is configured to provide one or more of virtual traffic light management, travel demand assignment, traffic state estimation, and platoon control.

Abstract: Instead of having a constant boundary, artificial reality (XR) applications that can run in boundaryless mode (e.g., in augmented or mixed reality) can be given controls by selective boundary system on an XR system to customize partial boundaries. For example, an application can specify to select particular boundaries when certain object types are in the real-world environment. In another example, an application can transition to different boundary modes when certain application events occur (e.g., when transitioning from virtual reality to mixed reality). On the backend, the selective boundary system can provide the application with an API that exposes boundary information. Based on this information, the application can use the API to create new boundaries or turn on or off certain boundaries based on requests by the application.

Abstract: Provided herein is a technology for an Autonomous Vehicle Intelligent System (AVIS), which facilitates vehicle operations and control for autonomous driving. The AVIS and related methods provide vehicles with vehicle-specific information for a vehicle to perform driving tasks such as car following, lane changing, and route guidance. The AVIS comprises an onboard unit (OBU), wherein the OBU comprises a communication module communicating with one or more of other autonomous vehicles (AV), a roadside unit (RSU), a cloud platform, and a traffic control center/traffic control unit (TCC/TCU). The AVIS implements one or more of the following functions: sensing, prediction, decision-making, and vehicle control using onboard information and vehicle-specific information received from other AVs, the RSU, the cloud platform, and/or the TCC/TCU.

Abstract: The invention provides systems and methods for a computing power allocation system for autonomous driving (CPAS-AD), which is a component of an Intelligent Road Infrastructure System (IRIS). The CPAS-AD incorporates advanced computing capabilities that effectively allocate computational power for sensing, prediction, planning, decision-making, and control functions to enable end-to-end driving functions. In addition to the vehicle, the CPAS-AD can acquire additional computation resources from one or more of: (a) a roadside unit (RSU) network, (b) a cloud platform, (c) a traffic control center/traffic control unit (TCC/TCU), and (d) a traffic operations center (TOC). Additionally, tailored to different traffic scenarios, the CPAS-AD can allocate data and computation resources (including but not limited to CPU and GPU) for vehicle sensing, prediction, planning, decision-making, and control functions, thereby enabling safe and efficient autonomous driving.

Abstract: The invention provides systems and methods for a function-based computing power allocation system (FCPAS), which is a component of an Intelligent Road Infrastructure System (IRIS). The FCPAS incorporates advanced computing capabilities that effectively allocate computational power for prediction, planning, and decision making functions. Specifically, through the FCPAS, an AV can acquire additional computational resources for vehicle prediction, planning, and decision-making functions, thereby enabling safe and efficient autonomous driving. Additionally, tailored to different traffic scenarios, the FCPAS can allocate data and computational resources (including but not limited to CPU and GPU) for vehicle automation.

Abstract: Provided herein is technology relating to automated driving and, more particularly, to an automated driving system comprising a Connected Automated Vehicle Subsystem that interacts in real-time with a Connected Automated Highway Subsystem to provide coordinated sensing; coordinated prediction and decision-making; and coordinated control for transportation management and operations and control of connected automated vehicles.

Abstract: An air conditioning system including a four-way valve including a first port, a second port, a third port and a fourth port, at least the first port and the third port are fluidly isolated; a compressor, an output end and an input end of which are in communication with the first port and the third port respectively; a first evaporator, a first end of which is in communication with the third port; a second evaporator and a condenser, first ends of which are in communication with one of the second port and the fourth port respectively; wherein a second end of the condenser, a second end of the first evaporator, and a second end of the second evaporator are in communication at a first node, and a first throttling valve, a second throttling valve and a third throttling valve are respectively disposed between the condenser and the first node.

Abstract: The present invention relates to a thermistor paste and a manufacturing method thereof. The thermistor paste includes specific contents of thermistor powder, a glass powder, and an organic carrier, in which the organic carrier includes an organic solvent, a binder, and an additive. A thermistor semi-finished product slurry of the present invention has been sintered. The thermistor paste of the present invention excludes a precious metal, such as ruthenium, gold, or platinum, etc., so the production cost can be reduced.

Abstract: A thermal resistor includes a substrate, a thermistor, a front electrode, a passivation protection layer, and an external protection layer. The thermistor does not include an oxide and is made of a base metal. Therefore, it can reduce the production cost. The passivation protection layer is formed by sputtering, physical vapor deposition, or chemical vapor deposition, in which the passivation protection layer conformally covers a surface of the thermistor and can protect the underlying thermistor.

Abstract: Current sensing resistors and a method of manufacturing the same are disclosed in the present invention. A composite material is firstly provided in the method. Then, a first portion of an alloy substrate of the composite material is removed along a first direction to form a plurality of first trenches. Next, a second portion of the alloy substrate of the composite material is removed along a second direction to form a plurality of second trenches, and a third portion of the alloy substrate of the composite material is further removed along the first direction to form the current sensing resistors. The current sensing resistors with small dimensions and an extremely low temperature coefficient of resistance can be produced rapidly by the method of the present invention.

Abstract: This technology provides designs and methods for the vehicle on-board unit (OBU), which facilitates vehicle operations and control for connected automated vehicle highway (CAVH) systems. OBU systems provide vehicles with individually customized information and real-time control instructions for vehicle to fulfill the driving tasks such as car following, lane changing, route guidance. OBU systems also realize transportation operations and management services for both freeways and urban arterials. The OBU composed of the following devices: 1) a vehicle motion state parameter and environment parameter collection unit; 2) a multi-mode communication unit; 3) a location unit; 4) an intelligent gateway unit, and 5) a vehicle motion control unit. The OBU systems realize one or more of the following function categories: sensing, transportation behavior prediction and management, planning and decision making, and vehicle control.

Abstract: The present application relates to a printing chip resistor and a method for producing the same. The printing chip resistor comprises a substrate, a resistor layer, a lower electrode and an upper electrode. The resistor layer is disposed over a top surface of the substrate, the lower electrode is disposed between the substrate and the resistor layer, and the resistor layer is disposed between the upper electrode and the lower electrode. The specific construction of the printing chip resistor facilitates to enlarge conducting cross-section area and shorten conducting length of the chip resistor, thereby meeting requirements of lower resistor value and improving heat dissipation efficacy of the printing chip resistor.