Abstract: An anti-surge resistor and a fabrication method thereof are provided. The current anti-surge resistor includes a substrate made by a varistor material, a resistance layer disposed on the substrate, a first terminal electrode, and a second terminal electrode. In the fabrication method of the current anti-surge resistor, at first, the substrate made by the varistor material is provided. Then, the resistance layer is formed on the substrate to provide a main body, in which the main body includes the substrate and the resistance layer, and has two opposite terminals. Thereafter, the first terminal electrode is formed on one terminal of the main body, and the second terminal electrode is formed on the other terminal of the main body.

Abstract: A thin-film chip resistor-capacitor includes a substrate, a resistor layer, a dielectric layer, a thin-film capacitor layer, a first terminal electrode and a second terminal electrode. The resistor layer is disposed on the substrate. The dielectric layer is disposed on the resistor layer. The thin-film capacitor layer is disposed on the dielectric layer and includes first and second capacitor electrodes that are physically separated with respect to each other. The first terminal electrode is disposed on a first side edge of the substrate and is coupled to the resistor layer and the first capacitor electrode. The second terminal electrode is disposed on a second side edge of the substrate opposite to the first side edge and is coupled to the resistor layer and the second capacitor electrode.

Abstract: A method of fabricating resistors in igniter is provided. The method includes punching an alloy material to obtain a plurality of alloy components. The alloy components are disposed on a substrate, and electrodes are disposed on the substrate. Resistors in igniter are obtained by disposing electrodes on the substrate such that two electrically connecting regions of each alloy component are physically contacting and electrically connecting to the electrodes, respectively. The resulting resistors in igniter have uniform size and stable shape hence showing great ignition performance.

Abstract: A high-power resistor and a fabrication method thereof are provided. The method includes: providing a resistance substrate including resistance alloy material and a copper metal layer; forming a cuprous oxide layer on the resistance substrate by using the copper metal layer; sticking the resistance substrate to a ceramic substrate, in which the cuprous oxide layer is located between the resistance substrate and the ceramic substrate; performing a sintering process on the resistance substrate and the ceramic substrate to form a composite substrate; forming a plurality of terminal electrodes on the composite substrate to form the high-power resistor. Therefore, the high-power resistor includes the composite substrate and the terminal electrodes. The composite substrate includes a bonding layer disposed between the ceramic substrate and the resistance substrate to bond the resistance alloy material on the ceramic substrate, in which the bonding layer includes sintered cuprous oxide.

Abstract: An anti-surge resistor and a fabrication method thereof are provided. The current anti-surge resistor includes a substrate made by a varistor material, a resistance layer disposed on the substrate, a first terminal electrode, and a second terminal electrode. In the fabrication method of the current anti-surge resistor, at first, the substrate made by the varistor material is provided. Then, the resistance layer is formed on the substrate to provide a main body, in which the main body includes the substrate and the resistance layer, and has two opposite terminals. Thereafter, the first terminal electrode is formed on one terminal of the main body, and the second terminal electrode is formed on the other terminal of the main body.

Abstract: A method of fabricating resistors in igniter is provided. The method includes punching an alloy material to obtain a plurality of alloy components. The alloy components are disposed on a substrate, and electrodes are disposed on the substrate. Resistors in igniter are obtained by disposing electrodes on the substrate such that two electrically connecting regions of each alloy component are physically contacting and electrically connecting to the electrodes, respectively. The resulting resistors in igniter have uniform size and stable shape hence showing great ignition performance.

Abstract: Current sensing resistors and a method of manufacturing the same are disclosed in the present invention. A composite material is firstly provided in the method. Then, a first portion of an alloy substrate of the composite material is removed along a first direction to form a plurality of first trenches. Next, a second portion of the alloy substrate of the composite material is removed along a second direction to form a plurality of second trenches, and a third portion of the alloy substrate of the composite material is further removed along the first direction to form the current sensing resistors. The current sensing resistors with small dimensions and an extremely low temperature coefficient of resistance can be produced rapidly by the method of the present invention.

Abstract: A method for fabricating a micro resistance layer and a method for fabricating a micro resistor are provided. The method for fabricating a micro resistance layer includes: providing a substrate; forming a first resistance layer on the substrate by using a screen printing process or a sputtering process; dividing the first resistance layer into second resistance layers, wherein each one of the product regions includes a second resistance layer, and an area of each one of the product regions is smaller than 0.4*0.2 mm2; and trimming the second resistance layer of each one of the product regions according to a predetermined resistance value to enable the pattern of each one of the second resistance layers to correspond to the predetermined resistance value. The method for fabricating a micro resistor uses the method for fabricating a micro resistance layer for fabrication of the micro resistor.

Abstract: A fuse resistor includes a substrate, an insulation layer, a fuse element, a protection layer, a first electrode, and a second electrode. The insulation layer covers a surface of the substrate. The fuse element is disposed on a portion of the insulation layer. The fuse element includes a first electrode portion, a melting portion, and a second electrode portion, in which the first electrode portion and the second electrode portion are respectively connected to two opposite ends of the melting portion. The protection layer covers the fuse element and the insulation layer, in which the protection layer has a cavity located on the melting portion. The first electrode is electrically connected to the first electrode portion. The second electrode is electrically connected to the second electrode portion.

Abstract: An ignition resistor includes an ignition structure, an insulation substrate, a carrying base, and first and second conductor layers. The ignition structure includes an ignition portion, and first and second electrode portions respectively connected to two opposite ends of the ignition portion. The insulation substrate is disposed on the ignition structure and includes a filling portion including a hole exposing the ignition portion and configured to accommodate an ignition material, and a sidewall surrounding the hole. The carrying base is disposed under the ignition structure. The carrying base includes first and second electrodes respectively corresponding to the first and second electrode portions. The first and second electrodes and the ignition structure are located on two opposite sides of the carrying base. The first and second conductive layers electrically connect the first electrode portion and the first electrode, and the second electrode portion and the second electrode respectively.

Abstract: An ignition resistor includes an ignition structure, an insulation substrate, a carrying base, and first and second conductor layers. The ignition structure includes an ignition portion, and first and second electrode portions respectively connected to two opposite ends of the ignition portion. The insulation substrate is disposed on the ignition structure and includes a filling portion including a hole exposing the ignition portion and configured to accommodate an ignition material, and a sidewall surrounding the hole. The carrying base is disposed under the ignition structure. The carrying base includes first and second electrodes respectively corresponding to the first and second electrode portions. The first and second electrodes and the ignition structure are located on two opposite sides of the carrying base. The first and second conductive layers electrically connect the first electrode portion and the first electrode, and the second electrode portion and the second electrode respectively.

Abstract: A fuse resistor includes a substrate, an insulation layer, a fuse element, a protection layer, a first electrode, and a second electrode. The insulation layer covers a surface of the substrate. The fuse element is disposed on a portion of the insulation layer. The fuse element includes a first electrode portion, a melting portion, and a second electrode portion, in which the first electrode portion and the second electrode portion are respectively connected to two opposite ends of the melting portion. The protection layer covers the fuse element and the insulation layer, in which the protection layer has a concave located on the melting portion. The first electrode is electrically connected to the first electrode portion. The second electrode is electrically connected to the second electrode portion.

Abstract: A method for manufacturing a resistor is described. First and second division lines are formed in a first surface of a substrate to define device areas. First and second electrodes are formed on the first surface and respectively on the device areas. Third electrodes, fourth electrodes, and resistive layers are formed on a second surface of the substrate and respectively on the device areas. The substrate is diced from the second surface by a cutting tool to form bar structures to expose opposite first and second side surfaces of the device areas. First and second terminal electrodes are formed to respectively cover the first and second side surfaces. The bar structures are diced from the second surface by the cutting tool to separate the device areas. The cutting tool is aligned with the first and second division lines respectively while dicing the substrate and the bar structures.

Abstract: In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.

Abstract: A method for manufacturing a shunt resistor is described. In this method, a first electrode plate and a second electrode plate are provided. The first electrode plate includes a first carrying portion having a first hole. The second electrode plate includes a second carrying portion having a second hole. A resistor plate is placed between the first and second electrode plates. The resistor plate has a first through hole and a second through hole respectively on the first hole and the second hole. A first rivet is pressed into the first through hole and the first hole. A second rivet is pressed into the second through hole and the second hole. Current is applied to the first rivet and the second rivet to weld the first rivet, the first electrode plate and the resistor plate, and to weld the second rivet, the second electrode plate and the resistor plate.

Abstract: A method for manufacturing a shunt resistor is described. In this method, a first electrode plate and a second electrode plate are provided. The first electrode plate includes a first carrying portion having a first hole. The second electrode plate includes a second carrying portion having a second hole. A resistor plate is placed between the first and second electrode plates. The resistor plate has a first through hole and a second through hole respectively on the first hole and the second hole. A first rivet is pressed into the first through hole and the first hole. A second rivet is pressed into the second through hole and the second hole. Current is applied to the first rivet and the second rivet to weld the first rivet, the first electrode plate and the resistor plate, and to weld the second rivet, the second electrode plate and the resistor plate.

Abstract: In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.

Abstract: A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability.

Abstract: A method of electroplating and depositing metal includes: providing an insulation substrate formed with conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the first conductive layer uncovered by the resist layer as a to-be-plated area; disposing the insulation substrate in a first electroplating solution and depositing a first metal layer on the to-be-plated area; removing the resist layer and the portion of the first conductive layer; forming a second conductive layer on a second surface of the insulation substrate; forming a mask layer on the second conductive layer; disposing the insulation substrate in a second electroplating solution and depositing a second metal layer on the first metal layer of the to-be-plated area; and removing the mask layer and the second conductive layer.

Abstract: A method of making a package substrate includes steps of forming a plurality of trenches on a first surface of a metal plate, placing insulation material in the trenches, removing metal plate material under the second surface of the metal plate, and exposing the insulation material in the trenches from substrate. The resulting substrate body includes a conductive portion made of the metal plate, and an insulation portion made of the insulation material. The bonding layers on the opposite sides of the substrate are conducted by the conductive portion for heat dissipation, and are separated from one another by the insulation portion.