Abstract: A misoperation-preventing method for use in a mobile terminal having a touch screen, includes: monitoring a distance between the mobile terminal and an object in a surrounding environment, after the mobile terminal transitions from a standby state to an active state; determining if the distance satisfies a preset distance condition; and disabling the touch screen if it is determined that the distance satisfies the preset distance condition.

Abstract: A method of fabricating a light emitting diode packaging structure provides a metallized ceramic heat dissipation substrate and a reflector layer, and a metallized ceramic heat dissipation substrate which is bonded with the reflector layer through an adhesive. The reflector layer has an opening for a surface of the metallized ceramic heat dissipation substrate to be exposed therefrom. The reflector layer may be formed with ceramic or polymer plastic material, to enhance the refractory property and the reliability of the package structure. In addition, the packaging structure may make use of existing packaging machine for subsequent electronic component packaging, without increasing the fabrication cost.

Abstract: A hinge mechanism includes a first rotation assembly, a second rotation assembly substantially parallel to the first rotation assembly, a first connection member, and a second connection member. The first and second rotation assemblies include a first and second pivoting shafts and a first and second brackets sleeved on the first and second pivoting shafts, respectively, and both the first and second brackets includes an engaging portion eccentrically formed on one end respectively thereof. The first connection member includes two pivotal portions. The pivotal portions are rotatably connected to the engaging portions of the first bracket and the second bracket, respectively. The second connection member is sleeved on the first pivoting shaft and the second pivoting shaft.

Abstract: A method of electroplating and depositing metal includes: providing an insulation substrate formed with conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the first conductive layer uncovered by the resist layer as a to-be-plated area; disposing the insulation substrate in a first electroplating solution and depositing a first metal layer on the to-be-plated area; removing the resist layer and the portion of the first conductive layer; forming a second conductive layer on a second surface of the insulation substrate; forming a mask layer on the second conductive layer; disposing the insulation substrate in a second electroplating solution and depositing a second metal layer on the first metal layer of the to-be-plated area; and removing the mask layer and the second conductive layer.

Abstract: A method for fabricating a conductive structure of a substrate includes the steps of: providing an insulating substrate having opposite first and second surfaces and forming an insulating adhesive film on the second surface of the insulating substrate; forming at least a through hole penetrating the insulating substrate and the insulating adhesive film and forming a conductive foil on the insulating adhesive film so as to cover the through hole; and forming a shielding material on the conductive foil and the second surface of the insulating substrate and performing an electrochemical deposition process through the conductive foil so as to fill the through hole with a conductive material along a direction towards the first surface of the insulating substrate, thereby preventing the formation of voids in the through hole and hence reducing the overall resistance and preventing a blister effect from occurring.

Abstract: A method of manufacturing a metallized ceramic substrate includes forming a metal layer on a ceramic substrate, and forming on the metal layer a resist having a first patterned resist opening and a second patterned resist opening for the metal layer to be exposed therefrom. A first width of the first patterned resist opening is greater than the thickness of the metal layer, and a second width of the second patterned resist opening is less than the thickness of the metal layer. A wet-etching process is conducted, to form in the first patterned resist opening a patterned metal layer opening and form in the second patterned resist opening a patterned metal layer dent. Therefore, an internal stress between the metal layer and the ceramic substrate is reduced, and the yield rate and reliability of the metallized ceramic substrate is increased.

Abstract: A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.

Abstract: A system is provided for detecting a liquid sample, and includes: a flow cell assembly formed with a sample receiving space therein, and inlet and outlet channels extending to the sample receiving space for guiding the liquid sample into and away from the sample receiving space; a sensor device including a sample detecting unit that is disposed in the sample receiving space, and that is operable to detect the liquid sample and to generate a detection signal accordingly, and a signal conducting unit that is connected electrically to the sensor device for conducting the detection signal therefrom; and a liquid introducing unit and a liquid discharging unit coupled to the inlet and outlet channels and cooperating therewith to form an introducing path and a discharging path for introducing the liquid sample into and for discharging the liquid sample from the sample receiving space, respectively.

Abstract: An embodiment of a hinge assembly includes a main body defining a shaft hole, a connecting shaft including an inserting end rotatably received in the shaft hole, and an expansion member forming a tapered portion and axially positioned in the shaft hole. An end surface of the inserting end toward the expansion member defines a tapered hole corresponding to the tapered portion, and the tapered portion is pressed into the tapered hole to expand the inserting end to resist the inner surface of the shaft hole, thus rotatably connecting the connecting shaft to the main body.

Abstract: A multi-directional hinge mechanism includes a pair of first rotating assemblies, a second rotating assembly and a connecting member, and is capable of functioning on two perpendicularly-opposed axes.

Abstract: The present invention belongs to a spiro phosphine-oxazoline and preparation method and application thereof, particularly, publishes a novel spiro phosphine-oxazoline and the preparation method of its iridium complex. The substituted 7-diaryl phosphino-7?-carboxy-1,1?-Lo-dihydro-indene is used as the starting raw material to synthesize the novel spiro phosphine-oxazoline of the present invention through a two-step reaction. The novel spiro phosphine-oxazoline and the iridium precursor are complexed to become a complex, and then through ion exchange, an iridium/phosphine spiro-oxazoline complex with different anions can be obtained. The present invention overcomes the shortcomings of the existing technology. The cheap readily available amino alcohol is used as the raw material to synthesize the novel spiro phosphine-oxazoline, on the fourth position of the oxazoline ring of which there is no substitutent.

Abstract: A method of selective metallization on a ceramic substrate includes selectively forming an active brazing material on a predetermined area of a surface of a ceramic substrate, attaching the metal layer to the ceramic substrate with the active brazing material, performing a brazing process on the active brazing material, forming an etching stop layer on the metal layer and performing an etching process, and removing the etching stop layer. The method can be applied to a severe environment, and the conchoidal fracture between the ceramic substrate and the metal layer can also be avoided. The present invention not only simplifies the process but also improves the product yield.

Abstract: A method of fabricating a substrate having a plurality of conductive through holes is disclosed. Release films are formed on opposite sides of a substrate, and a plurality of through holes penetrating the release films and the substrate are formed. A first metal layer is formed on the release films and the sidewall of each of the through holes prior to removing the release films and the first metal layer thereon. A second metal layer is formed on the first metal layer on the sidewalls of the through holes by electroless plating. Compared to the prior art, the method is simpler and cheaper to carry out while the conductive through holes and a surface circuit layer thereof are fabricated separately, thereby avoiding disadvantage of forming a circuit layer on the surface of the substrate too thick.

Abstract: A method of fabricating alight emitting diode packaging structure provides a metallized ceramic heat dissipation substrate and a reflector layer, and the metallized ceramic heat dissipation substrate is bonded with the reflector layer through an adhesive. The reflector layer has an opening for a surface of the metallized ceramic heat dissipation substrate to be exposed therefrom. The reflector layer may be formed with ceramic or polymer plastic material, to enhance the refractory property and the reliability of the package structure. In addition, the packaging structure of the present invention may make use of existing packaging machine for subsequent electronic component packaging, without increasing the fabrication cost.

Abstract: A method of manufacturing a metallized ceramic substrate includes forming a metal layer on a ceramic substrate, and forming on the metal layer a resist having a first patterned resist opening and a second patterned resist opening for the metal layer to be exposed therefrom. A first width of the first patterned resist opening is greater than the thickness of the metal layer, and a second width of the second patterned resist opening is less than the thickness of the metal layer. A wet-etching process is conducted, to form in the first patterned resist opening a patterned metal layer opening and form in the second patterned resist opening a patterned metal layer dent. Therefore, an internal stress between the metal layer and the ceramic substrate is reduced, and the yield rate and reliability of the metallized ceramic substrate is increased.

Abstract: A multi-directional hinge mechanism includes a pair of first rotating assemblies, a second rotating assembly and a connecting member, and is capable of functioning on two perpendicularly-opposed axes.

Abstract: A method of making a package substrate includes steps of forming a plurality of trenches on a first surface of a metal plate, placing insulation material in the trenches, removing metal plate material under the second surface of the metal plate, and exposing the insulation material in the trenches from substrate. The resulting substrate body includes a conductive portion made of the metal plate, and an insulation portion made of the insulation material. The bonding layers on the opposite sides of the substrate are conducted by the conductive portion for heat dissipation, and are separated from one another by the insulation portion.

Abstract: A swivel-hinge assembly includes a main plate, a knuckle on the main plate, a first pivot shaft rotatably engaged in the knuckle, at least one end of the first pivot shaft exposed out of the knuckle and a peg positioned on the end of the first pivot shaft exposed out of the knuckle. The peg includes a limiting portion protruding out of the first pivot shaft and abutting an edge of the knuckle, wherein when the first pivot shaft is rotated and reaches a predetermined position the limiting portion of the peg abuts the main plate thereby preventing further rotation of the first pivot shaft.

Abstract: A method for making a fluorescent gold nano-material having a gold nanocluster and thiol ligands on a surface of the gold nanocluster includes reacting a mixture of a gold-containing compound, an alkyl alcohol, and a thiol compound.

Abstract: A system is provided for detecting a liquid sample, and includes: a flow cell assembly formed with a sample receiving space therein, and inlet and outlet channels extending to the sample receiving space for guiding the liquid sample into and away from the sample receiving space; a sensor device including a sample detecting unit that is disposed in the sample receiving space, and that is operable to detect the liquid sample and to generate a detection signal accordingly, and a signal conducting unit that is connected electrically to the sensor device for conducting the detection signal therefrom; and a liquid introducing unit and a liquid discharging unit coupled to the inlet and outlet channels and cooperating therewith to form an introducing path and a discharging path for introducing the liquid sample into and for discharging the liquid sample from the sample receiving space, respectively.