Abstract: A nebulization medicament delivery device is provided, which includes a mouthpiece opening; an airway; at least one first vent configured to introduce external air into the airway, wherein the mouthpiece opening is in communication with the at least one first vent through the airway; a nebulization module including a mesh and configured for nebulization; a first pressure sensor disposed inside the nebulization medicament delivery device and to be air-tightly isolated from the airway, and configured to detect external air pressure outside the nebulization medicament delivery device; a second pressure sensor disposed adjacent to the airway or within the airway, and configured to detect air pressure inside the airway; and a controller, which drives the nebulization module to perform nebulization based on air pressure difference between the external air pressure and the air pressure inside the airway.

Abstract: Information handling system thermal management of processing components, such as CPU, GPU and/or memory, by a liquid cooling system is protected by a leak detection enclosure having a leak detection sensor disposed in an interior. The leak detection enclosure has a frame coupled to a cold plate that encloses the leak detection sensor and cooling fluid hose fittings so that leaked fluid is trapped within the enclosure for detection by the leak detection sensor. A planar cover couples to the frame upper side over the leak detection circuit and the cooling fluid hose fittings to provide ready assembly and an inexpensive adaptable form factor.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: The road simulation device includes a frame structure and a transmission structure. The transmission structure includes a first test bench, a second test bench, a third test bench and a fourth test bench. A first sliding plate structure of the first test bench slides in a first direction and a second direction, a second sliding plate structure of the second test bench slides in the first direction, and a third sliding plate structure of the third test bench slides in the second direction. The first sliding plate structure and the first base structure, the second sliding plate structure and the second base structure, the third sliding plate structure and the third base structure, as well as the fourth baffle plate structure and the fourth base structure are connected by spherical hinges. Damages to the frame structure caused by huge acting force generated by rigid connection during testing can be avoided.

Abstract: The road simulation device includes a frame structure and a transmission structure. The transmission structure includes a first test bench, a second test bench, a third test bench and a fourth test bench. A first sliding plate structure of the first test bench slides in a first direction and a second direction, a second sliding plate structure of the second test bench slides in the first direction, and a third sliding plate structure of the third test bench slides in the second direction. The first sliding plate structure and the first base structure, the second sliding plate structure and the second base structure, the third sliding plate structure and the third base structure, as well as the fourth baffle plate structure and the fourth base structure are connected by spherical hinges. Damages to the frame structure caused by huge acting force generated by rigid connection during testing can be avoided.

Abstract: An apparatus comprising a module, a hook assembly coupled to the module and configured to be rotated from a deployed position to a storage position when the module is fully inserted into a chassis and a spring coupled between the module and the hook assembly, wherein the spring is configured to extend the hook assembly from the storage position to the deployed position when the module is not fully inserted into the chassis.

Abstract: This disclosure involves development and deployment platforms for decision algorithms. For example, a computing system provides software development interface to a client device. The system sets, based on an input from the client device via the interface, a decision engine to a test mode that causes the decision engine to operate on test data stored in a first database and that prevents the decision engine from applying operations from the client device to production data stored in a second database. The system also configures the decision engine in the test mode to execute a different decision algorithms on the test data. The system also sets, based on another input via the interface, the decision engine to a deployment mode that causes the decision engine to operate on the production data. The system configures the decision engine in the deployment mode to execute one or more of the tested decision algorithms.

Abstract: An apparatus comprising a module, a hook assembly coupled to the module and configured to be rotated from a deployed position to a storage position when the module is fully inserted into a chassis and a spring coupled between the module and the hook assembly, wherein the spring is configured to extend the hook assembly from the storage position to the deployed position when the module is not fully inserted into the chassis.

Abstract: A cam mounting mechanism (“CMM”) includes a detachable mounting tray (“tray”) that includes a base and two side walls. Each side wall includes engagement notches that receive a respective engagement member of a sled enclosure of a server chassis. The CMM includes two internal sliding rails (“IRRs”), each being attached to an internal surface of a respective side wall of the tray by a respective fastener that extends through a respective slide slot of the IRR, and each including the respective slide slots and multiple guide slots. Each slide slot enables the IRR to slide longitudinally relative to the side wall. Each guide slot slidably receives a respective engagement member and is shaped to constrain the tray to vertical movement relative to the sled enclosure while constraining the IRR to longitudinal movement. The CMM includes a cam handle that rotates in order to drive both IRRs to move in unison.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: This disclosure involves development and deployment platforms for decision algorithms. For example, a computing system provides software development interface to a client device. The system sets, based on an input from the client device via the interface, a decision engine to a test mode that causes the decision engine to operate on test data stored in a first database and that prevents the decision engine from applying operations from the client device to production data stored in a second database. The system also configures the decision engine in the test mode to execute a different decision algorithms on the test data. The system also sets, based on another input via the interface, the decision engine to a deployment mode that causes the decision engine to operate on the production data. The system configures the decision engine in the deployment mode to execute one or more of the tested decision algorithms.

Abstract: A FinFET device may include a dummy FinFET structure laterally adjacent an active FinFET structure to reduce stress imbalance and the effects of stress imbalance on the active FinFET structure. The FinFET device comprises an active FinFET comprising a plurality of semiconductor fins, and a dummy FinFET comprising a plurality of semiconductor fins. The active FinFET and the dummy FinFET are laterally spaced from each other by a spacing that is related to the fin pitch of the active FinFET.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: A substrate-retaining device with improved thermal uniformity is provided. In an exemplary embodiment, the substrate-retaining device includes a substantially circular first surface with a defined perimeter, a plurality of contact regions disposed at the perimeter, and a plurality of noncontact regions also disposed at the perimeter. The contact regions are interspersed with the noncontact regions. Within each of the noncontact regions, the first surface extends past where the first surface ends within each of the contact regions. In some such embodiments, each region of the plurality of contact regions includes a contact surface disposed above the first surface.

Abstract: A substrate-retaining device with improved thermal uniformity is provided. In an exemplary embodiment, the substrate-retaining device includes a substantially circular first surface with a defined perimeter, a plurality of contact regions disposed at the perimeter, and a plurality of noncontact regions also disposed at the perimeter. The contact regions are interspersed with the noncontact regions. Within each of the noncontact regions, the first surface extends past where the first surface ends within each of the contact regions. In some such embodiments, each region of the plurality of contact regions includes a contact surface disposed above the first surface.

Abstract: A FinFET device may include a dummy FinFET structure laterally adjacent an active FinFET structure to reduce stress imbalance and the effects of stress imbalance on the active FinFET structure. The FinFET device comprises an active FinFET comprising a plurality of semiconductor fins, and a dummy FinFET comprising a plurality of semiconductor fins. The active FinFET and the dummy FinFET are laterally spaced from each other by a spacing that is related to the fin pitch of the active FinFET.

Abstract: A connector assembly includes a female-base and a male-base. The female-base includes a first metal element and a first sleeve element. When in use, the female-base and the male-base are engaged with each other such that the second sleeve element is disposed in interior of the first sleeve element, and that the first metal element contacts the second metal element, so that an electric connection is established for conveyance of power, and of video or audio signal. Thereby, users may use the connector assembly to eliminate the use of extension cords or signal cables, so that risks and worries about connecting too many extension cords may be released. In addition, a great number of electric cords and signal cables behind electronic appliances can be reduced, and arrangement of cords is simplified, let alone a neat and tidy overall appearance of the electronic appliances can be obtained.

Abstract: A wafer temperature control apparatus comprises a first temperature sensor and a second temperature sensor. The first temperature sensor is configured to receive a first temperature signal from a center portion of a backside of a susceptor. The second temperature sensor is configured to receive a second temperature signal from an edge portion of the susceptor. A plurality of controllers are configured to adjust each heating source's output based upon the first temperature signal and the second temperature signal.

Abstract: The present invention relates to application processing and decisioning systems and processes. One embodiment of the invention includes a method for automating decisioning for a credit request associated with an applicant. The method includes providing a user computer interface adapted to receive information associated with an applicant, and further adapted to display and receive information associated with at least one decision rule. The method also includes receiving information associated with an applicant through the user computer interface; receiving information associated with the applicant from at least one data source; and receiving a selection of information associated with a plurality of decision rules through the user computer interface.