Abstract: An Android penetration method and device for implementing silent installation based on accessibility services. The method includes: acquiring a second target application by adding a load program to a first target application and adding penetration permissions using an Android decompilation technology; and implementing silent installation of the second target application using an accessibility service technology.

Abstract: A detection device adapted to verify or determine a welding quality includes a housing, a moving assembly, a mounting bracket, and a rotating assembly. The moving assembly is movably installed on the housing and is adapted to be moved up and down in a vertical direction. The mounting bracket is fixed to the housing. The rotating assembly includes a rotating member rotatably connected to the mounting bracket and movably connected to the moving assembly, and a contact probe fixed to the rotating member. The contact probe is adapted to make sliding contact with a second component welded on a first component and to push the moving assembly to move in the vertical direction through the rotating member.

Abstract: A label printing and attaching system includes a label printing device and a label attaching device. The label printing device has an ink tape supply mechanism for supplying an ink tape with a label pattern. A label tape supply mechanism of the label printing device is adapted to supply a label tape that includes a carrier tape and blank label paper adhered to the carrier tape. The label printing device further includes a heat transfer machine adapted to heat transfer the label pattern on the ink tape onto the blank label paper of the label tape to obtain a desired label. The label attaching device has a label picker adapted to pick up the label with the printed label pattern from the label tape, and a moving device adapted to move the label picker to place the picked label with the printed label pattern onto a product.

Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.

Abstract: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.

Abstract: Provided herein are compounds of formula (A): or a pharmaceutically acceptable salt thereof, wherein X, R1, R2, R3, R4, Ry, and Rz are as defined herein. Also provided herein is a pharmaceutically acceptable composition comprising a compound of formula (A), or a pharmaceutically acceptable salt thereof, as well as methods of using a compound of formula (A), or a pharmaceutically acceptable salt thereof, to treat various diseases and conditions mediated by nicotinamide phosphoribosyltransferase (NAMPT).

Abstract: Information handling system thermal management of processing components, such as CPU, GPU and/or memory, by a liquid cooling system is protected by a leak detection enclosure having a leak detection sensor disposed in an interior. The leak detection enclosure has a frame coupled to a cold plate that encloses the leak detection sensor and cooling fluid hose fittings so that leaked fluid is trapped within the enclosure for detection by the leak detection sensor. A planar cover couples to the frame upper side over the leak detection circuit and the cooling fluid hose fittings to provide ready assembly and an inexpensive adaptable form factor.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: The road simulation device includes a frame structure and a transmission structure. The transmission structure includes a first test bench, a second test bench, a third test bench and a fourth test bench. A first sliding plate structure of the first test bench slides in a first direction and a second direction, a second sliding plate structure of the second test bench slides in the first direction, and a third sliding plate structure of the third test bench slides in the second direction. The first sliding plate structure and the first base structure, the second sliding plate structure and the second base structure, the third sliding plate structure and the third base structure, as well as the fourth baffle plate structure and the fourth base structure are connected by spherical hinges. Damages to the frame structure caused by huge acting force generated by rigid connection during testing can be avoided.

Abstract: The road simulation device includes a frame structure and a transmission structure. The transmission structure includes a first test bench, a second test bench, a third test bench and a fourth test bench. A first sliding plate structure of the first test bench slides in a first direction and a second direction, a second sliding plate structure of the second test bench slides in the first direction, and a third sliding plate structure of the third test bench slides in the second direction. The first sliding plate structure and the first base structure, the second sliding plate structure and the second base structure, the third sliding plate structure and the third base structure, as well as the fourth baffle plate structure and the fourth base structure are connected by spherical hinges. Damages to the frame structure caused by huge acting force generated by rigid connection during testing can be avoided.

Abstract: An apparatus comprising a module, a hook assembly coupled to the module and configured to be rotated from a deployed position to a storage position when the module is fully inserted into a chassis and a spring coupled between the module and the hook assembly, wherein the spring is configured to extend the hook assembly from the storage position to the deployed position when the module is not fully inserted into the chassis.

Abstract: This disclosure involves development and deployment platforms for decision algorithms. For example, a computing system provides software development interface to a client device. The system sets, based on an input from the client device via the interface, a decision engine to a test mode that causes the decision engine to operate on test data stored in a first database and that prevents the decision engine from applying operations from the client device to production data stored in a second database. The system also configures the decision engine in the test mode to execute a different decision algorithms on the test data. The system also sets, based on another input via the interface, the decision engine to a deployment mode that causes the decision engine to operate on the production data. The system configures the decision engine in the deployment mode to execute one or more of the tested decision algorithms.

Abstract: An apparatus comprising a module, a hook assembly coupled to the module and configured to be rotated from a deployed position to a storage position when the module is fully inserted into a chassis and a spring coupled between the module and the hook assembly, wherein the spring is configured to extend the hook assembly from the storage position to the deployed position when the module is not fully inserted into the chassis.

Abstract: A cam mounting mechanism (“CMM”) includes a detachable mounting tray (“tray”) that includes a base and two side walls. Each side wall includes engagement notches that receive a respective engagement member of a sled enclosure of a server chassis. The CMM includes two internal sliding rails (“IRRs”), each being attached to an internal surface of a respective side wall of the tray by a respective fastener that extends through a respective slide slot of the IRR, and each including the respective slide slots and multiple guide slots. Each slide slot enables the IRR to slide longitudinally relative to the side wall. Each guide slot slidably receives a respective engagement member and is shaped to constrain the tray to vertical movement relative to the sled enclosure while constraining the IRR to longitudinal movement. The CMM includes a cam handle that rotates in order to drive both IRRs to move in unison.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: This disclosure involves development and deployment platforms for decision algorithms. For example, a computing system provides software development interface to a client device. The system sets, based on an input from the client device via the interface, a decision engine to a test mode that causes the decision engine to operate on test data stored in a first database and that prevents the decision engine from applying operations from the client device to production data stored in a second database. The system also configures the decision engine in the test mode to execute a different decision algorithms on the test data. The system also sets, based on another input via the interface, the decision engine to a deployment mode that causes the decision engine to operate on the production data. The system configures the decision engine in the deployment mode to execute one or more of the tested decision algorithms.

Abstract: A FinFET device may include a dummy FinFET structure laterally adjacent an active FinFET structure to reduce stress imbalance and the effects of stress imbalance on the active FinFET structure. The FinFET device comprises an active FinFET comprising a plurality of semiconductor fins, and a dummy FinFET comprising a plurality of semiconductor fins. The active FinFET and the dummy FinFET are laterally spaced from each other by a spacing that is related to the fin pitch of the active FinFET.

Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.

Abstract: A substrate-retaining device with improved thermal uniformity is provided. In an exemplary embodiment, the substrate-retaining device includes a substantially circular first surface with a defined perimeter, a plurality of contact regions disposed at the perimeter, and a plurality of noncontact regions also disposed at the perimeter. The contact regions are interspersed with the noncontact regions. Within each of the noncontact regions, the first surface extends past where the first surface ends within each of the contact regions. In some such embodiments, each region of the plurality of contact regions includes a contact surface disposed above the first surface.