Abstract: An electronic heat transfer label includes a substrate. A pattern layer is printed on the substrate, and an adhesive is printed on the pattern layer to form a first adhesive layer. A chip is attached onto the first adhesive layer, and an adhesive is printed on the chip to form a second adhesive layer. The second adhesive layer covers the chip, and a hot-melt layer is arranged on the second adhesive layer. A method for preparing the electronic heat transfer label includes: S1: printing an ink on a substrate and drying the ink to form a pattern layer; S2: printing an adhesive on the pattern layer and drying to form a first adhesive layer; S3: attaching a chip onto the first adhesive layer; S4: printing an adhesive onto the first adhesive layer and the chip, and drying to form a second adhesive layer.