Patents by Inventor Shen Yanwei

Shen Yanwei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11236868
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: February 1, 2022
    Assignee: Feit Electric Company, Inc.
    Inventor: Shen Yanwei
  • Publication number: 20210018148
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 21, 2021
    Inventor: Shen Yanwei
  • Patent number: 10823340
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: November 3, 2020
    Assignee: Feit Electric Company, Inc.
    Inventor: Shen Yanwei
  • Publication number: 20200088356
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Inventor: Shen Yanwei
  • Patent number: 10520139
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: December 31, 2019
    Assignee: Feit Electric Company, Inc.
    Inventor: Shen Yanwei
  • Publication number: 20180313500
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 1, 2018
    Inventor: Shen Yanwei
  • Patent number: 9964258
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: May 8, 2018
    Assignee: FEIT ELECTRIC COMPANY, INC.
    Inventor: Shen Yanwei
  • Patent number: 9951932
    Abstract: Various embodiments provide a light emitting diode (LED) module. In one embodiment, the LED module comprises a circuit board; a peripheral metal board abutting and about said circuit board; an electrical insulation layer on both a first surface and a second surface of said circuit board and said peripheral metal board; electrical traces on said electrical insulation layer; and one or more LEDs mounted on said electrical traces and said electrical insulation layer over said peripheral metal board.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: April 24, 2018
    Assignee: FEIT ELECTRIC COMPANY, INC.
    Inventor: Shen Yanwei
  • Publication number: 20170159891
    Abstract: Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.
    Type: Application
    Filed: February 12, 2016
    Publication date: June 8, 2017
    Inventor: Shen Yanwei
  • Publication number: 20170159916
    Abstract: Various embodiments provide a light emitting diode (LED) module. In one embodiment, the LED module comprises a circuit board; a peripheral metal board abutting and about said circuit board; an electrical insulation layer on both a first surface and a second surface of said circuit board and said peripheral metal board; electrical traces on said electrical insulation layer; and one or more LEDs mounted on said electrical traces and said electrical insulation layer over said peripheral metal board.
    Type: Application
    Filed: February 12, 2016
    Publication date: June 8, 2017
    Inventor: Shen Yanwei