Patents by Inventor Shen-Yu Chang

Shen-Yu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a polishing pad
    Patent number: 8480773
    Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: July 9, 2013
    Assignee: IV Technologies Co., Ltd.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
  • METHOD OF FABRICATING A POLISHING PAD
    Publication number: 20110241258
    Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.
    Type: Application
    Filed: June 14, 2011
    Publication date: October 6, 2011
    Applicant: IV Technologies Co., Ltd.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
  • Polishing pad and method thereof
    Patent number: 8016647
    Abstract: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: September 13, 2011
    Assignee: IV Technologies Co., Ltd.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
  • Polishing Pad and Method Thereof
    Publication number: 20070259612
    Abstract: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.
    Type: Application
    Filed: March 20, 2007
    Publication date: November 8, 2007
    Applicant: IV TECHNOLOGIES CO., LTD.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih