Patents by Inventor Shen-Yuan MAO

Shen-Yuan MAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package and method for forming the same
    Patent number: 8900913
    Abstract: An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: December 2, 2014
    Inventors: Chuan-Jin Shiu, Po-Shen Lin, Shen-Yuan Mao, Cheng-Chi Peng
  • CHIP PACKAGE AND METHOD FOR FORMING THE SAME
    Publication number: 20130045549
    Abstract: An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.
    Type: Application
    Filed: August 17, 2012
    Publication date: February 21, 2013
    Inventors: Chuan-Jin SHIU, Po-Shen LIN, Shen-Yuan MAO, Cheng-Chi PENG