Patents by Inventor Shen-Yuan Wu

Shen-Yuan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929547
    Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: March 12, 2024
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Publication number: 20090002996
    Abstract: A heat-dissipating device has a circuit board, two layers of heat-dissipating paste and a heat-dissipating metal block. The circuit board has a light emitting diode mounting segment, multiple through holes, multiple metal rods and multiple electrical nodes. The through holes are defined through the circuit board and are arranged in the light emitting diode mounting segment. The metal rods are mounted respectively in the through holes. The electrical nodes are mounted on the top around the light emitting diode mounting segment. The first layer of heat-dissipating paste is coated on the light emitting diode mounting segment and contacts with the metal rods in the through holes. The heat-dissipating metal block is attached to the bottom of the circuit board. The second layer of heat-dissipating device is mounted between the circuit board and the metal block and contacts with the metal rods.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 1, 2009
    Inventor: Shen-Yuan Wu