Patents by Inventor Shena Jia

Shena Jia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210236961
    Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang
  • Publication number: 20210138513
    Abstract: An apparatus for cleaning semiconductor substrates includes a chamber (101), a chuck (102), a liquid collector (104), an enclosing wall (105), at least one driving mechanism (106), at least one internal dispenser (111), and at least one external dispenser (118). The chamber (101) has a top wall (1011), a side wall (1012) and a bottom wall (1013). The chuck (102) is disposed in the chamber (101) for holding a semiconductor substrate (103). The liquid collector (104) surrounds the chuck (102). The enclosing wall (105) surrounds the liquid collector (104). The at least one driving mechanism (106) drives the enclosing wall (105) to move up and down, wherein when the at least one driving mechanism (106) drives the enclosing wall (105) to move up, a seal room (110) is formed by the liquid collector (104), the enclosing wall (105), the top wall (1011) of the chamber (101), and the bottom wall (1013) of the chamber (101). The at least one internal dispenser (111) is disposed inside the seal room (110).
    Type: Application
    Filed: March 6, 2017
    Publication date: May 13, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Xiaofeng Tao, Fuping Chen, Shena Jia, Xi Wang, Xiaoyan Zhang, Xuejun Li
  • Patent number: 11000782
    Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: May 11, 2021
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang
  • Patent number: 10770315
    Abstract: A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle (102) connecting with a carrier (101); a megasonic/ultrasonic device (105) fixing on the carrier (101); and a sensor (104) detecting the distance between the megasonic/ultrasonic device (105) and the carrier (101) to determine whether the megasonic/ultrasonic device (105) is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: September 8, 2020
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Zhenming Chu, Xi Wang, Hui Wang, Shena Jia, Jun Wu, Fuping Chen, Xuejun Li
  • Publication number: 20190273003
    Abstract: A method and apparatus for cleaning semiconductor wafer, combining batch cleaning and single wafer cleaning together. The method includes: taking at least two wafers from a cassette in a load port and putting said wafers into a first tank filled with chemical solution; after processing said wafers in the first tank, taking said wafers out of the first tank and keeping said wafers wet; putting said wafers into a second tank filled with liquid; after processing said wafers in the second tank, taking said wafers out of the second tank and keeping said wafers wet; putting one of said wafers on a chuck inside a single wafer cleaning module; rotating the chuck while applying chemical solution on said wafer; applying deionized water on said wafer; drying said wafer; taking said wafer out of the single wafer cleaning module and putting said wafer back to the cassette in the load port.
    Type: Application
    Filed: April 8, 2019
    Publication date: September 5, 2019
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Liangzhi Xie, Shena Jia, Xi Wang, Xiaoyan Zhang
  • Patent number: 10297472
    Abstract: A method and apparatus (100) for cleaning semiconductor wafer are provided, combining batch cleaning and single wafer cleaning together.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: May 21, 2019
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Liangzhi Xie, Shena Jia, Xi Wang, Xiaoyan Zhang
  • Publication number: 20180353876
    Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.
    Type: Application
    Filed: December 9, 2015
    Publication date: December 13, 2018
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang
  • Publication number: 20180308729
    Abstract: The substrate can be selectively transferred by a vacuum or edge grip method according to the process characteristics, using a single substrate transfer robot equipped in the front end module. Additionally, after the process, the substrate can be loaded using the buffer chamber, for the cooling process and transfer of the substrate.
    Type: Application
    Filed: May 27, 2016
    Publication date: October 25, 2018
    Inventors: Dai Kyu CHOI, Hui WANG, Xi WANG, Xiaoyan ZHANG, Shena JIA
  • Publication number: 20180033654
    Abstract: A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle (102) connecting with a carrier (101); a megasonic/ultrasonic device (105) fixing on the carrier (101); and a sensor (104) detecting the distance between the megasonic/ultrasonic device (105) and the carrier (101) to determine whether the megasonic/ultrasonic device (105) is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.
    Type: Application
    Filed: September 8, 2015
    Publication date: February 1, 2018
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Zhenming Chu, Xi Wang, Hui Wang, Shena Jia, Jun Wu, Fuping Chen, Xuejun Li
  • Publication number: 20150332940
    Abstract: A method and apparatus (100) for cleaning semiconductor wafer are provided, combining batch cleaning and single wafer cleaning together.
    Type: Application
    Filed: November 28, 2012
    Publication date: November 19, 2015
    Applicant: ACM Reasearch (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Liangzhi Xie, Shena Jia, Xi Wang, Xiaoyan Zhang