Abstract: A control method of a memory device includes: controlling a flash memory controller to transmit a command to a flash memory module; determining whether the flash memory controller is in an idle state; in response to the flash memory controller being in the idle state, determining whether an idle time of the idle state exceeds a threshold value, wherein the threshold value is less than a time required for the flash memory module to complete executing a write command or an erase command; and in response to the idle time exceeding the threshold value, controlling the flash memory controller to enter a power saving mode to turn off a part of components in the flash memory controller.

Abstract: Embodiments include a Schottky barrier diode (SBD) structure and method of forming the same, the SBD structure including a current blockage feature to inhibit current from leaking at an interface with a shallow trench isolation regions surrounding an anode region of the SBD structure.

Abstract: A mobile device supporting wideband operations includes a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, a sixth radiation element, and a seventh radiation element. The first radiation element has a feeding point. The second radiation element and the third radiation element are coupled to the first radiation element. The first radiation element is coupled through the fourth radiation element to a ground voltage. The fifth radiation element is coupled to the fourth radiation element. The sixth radiation element is coupled to the ground voltage. The sixth radiation element is adjacent to the first radiation element and the third radiation element. The seventh radiation element is coupled to the sixth radiation element. The seventh radiation element extends away from the third radiation element.

Abstract: A mobile device supporting wideband operations includes a first metal mechanism element, a dielectric substrate, a feeding radiation element, a ground element, a second metal mechanism element, and a nonconductive antenna window. The first metal mechanism element includes a main portion and a sidewall portion. The sidewall portion has a slot. The dielectric substrate is adjacent to the sidewall portion of the first metal mechanism element. The feeding radiation element extends across the slot of the first metal mechanism element. An antenna structure is formed by the slot of the first metal mechanism element, the dielectric substrate, the feeding radiation element, and the ground element. The second metal mechanism element is disposed opposite from the main portion of the first metal mechanism element. The nonconductive antenna window is connected between the sidewall portion of the first metal mechanism element and the second metal mechanism element.

Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device transmits a device information of the first member device to the Bluetooth host device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device further establishes a connection with the first member device to conduct pairing procedure to generate a first cypher key after receiving a selection command. The first member device further establishes a connection with the Bluetooth host device to conduct pairing procedure to generate a second cypher key.

Abstract: A semiconductor package includes a first heat dissipation plate, a second heat dissipation plate, a plurality of heat generating assemblies, and a plurality of fixture components. The first heat dissipation plate has a first upper surface and a first lower surface. The first heat dissipation plate includes first through holes extended from the first upper surface to the first lower surface. The second heat dissipation plate has a second upper surface and a second lower surface. The second heat dissipation plate includes second through holes extended from the second upper surface to the second lower surface. The heat generating assemblies are disposed between the first heat dissipation plate and the second heat dissipation plate. The fixture components include fix screws and nuts. The fix screws penetrate through the first heat dissipation plate and the second heat dissipation plate along the first through holes and the second through holes.

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

Abstract: A touch screen may be formed from a display and perimeter touch electrodes. Touches detected at one or more of the perimeter touch electrodes can be imputed to touch on a region of the display of the touch screen adjacent to the perimeter touch electrodes. In some examples, the perimeter touch electrodes comprise segmented frit metal arranged around the perimeter of the display (e.g., frit metal used to encapsulate the display). In some examples, the perimeter touch electrodes can be coupled to one or more touch sensing circuits via switching circuitry. In some examples, the switching circuitry can be operated based on control signals shared with the display circuitry.

Abstract: A fixing assembly for mounting UV lamps includes a base, a first gear and a plurality of mounting modules. The first gear is arranged on one side of the base; the mounting modules are arranged around the first gear. The mounting module includes a first driving assembly, a second driving assembly and a support frame. The first driving assembly is used to drive the second driving assembly and the support frame to move circumferentially around the first gear in a considerably horizontal plane, and the second driving component is used to drive the support to move back in a considerably vertical direction. The support frame is used for mounting UV lamp. The flexibility of the fixing assembly is improved. The UV lamp may comprehensively irradiate and cure the photosensitive adhesive.

Abstract: An information handling system may include a processor, a memory device, a PMU, and a camera formed into a chassis of the information handling system. The camera includes a lens, a shutter to block the capture of an image by the camera, shutter driver hardware to actuate shutter movement between an open state and a closed state, and a shutter position sensor to detect the position of the shutter. The information handling system includes a microcontroller unit operatively coupled to the camera to receive input describing a set state of the shutter received from user toggle input, compare the set state of the shutter to a detected state of the shutter detected by the shutter position sensor and take remedial action to actuate the shutter driver hardware to change the detected state of the shutter when the detected state of the shutter differs from the set state of the shutter.

Abstract: A cross reality system enables any of multiple devices to efficiently and accurately access previously stored maps and render virtual content specified in relation to those maps. The cross reality system may include a cloud-based localization service that responds to requests from devices to localize with respect to a stored map. The request may include one or more sets of feature descriptors extracted from an image of the physical world around the device. Those features may be posed relative to a coordinate frame used by the local device. The localization service may identify one or more stored maps with a matching set of features. Based on a transformation required to align the features from the device with the matching set of features, the localization service may compute and return to the device a transformation to relate its local coordinate frame to a coordinate frame of the stored map.

Abstract: A mobile device supporting wideband operations includes a first radiation element, a second radiation element, a third radiation element, and a dielectric substrate. The first radiation element has a feeding point. The second radiation element is coupled to the ground voltage. The first radiation element is at least partially surrounded by the second radiation element. The feeding point is coupled through the third radiation element to the ground voltage. The first radiation element, the second radiation element, and the third radiation element are disposed on the dielectric substrate. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.

Abstract: An anti-diffusion substrate structure includes a substrate, a substrate circuit layer, and a chip. The substrate has multiple through holes. Within each of the through holes includes a first metal layer and an anti-diffusion layer plated on the first metal layer. The anti-diffusion layer is an Electroless Palladium Immersion Gold (EPIG) layer or an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) layer. The substrate circuit layer is mounted on the substrate and extended on the anti-diffusion layer within each of the through holes. The substrate circuit layer is made of a second metal layer, and a composition of the second metal layer is different from a composition of the first metal layer. The chip is electrically connected to the substrate circuit layer. The anti-diffusion layer is able to better prevent material of the first metal layer from migrating or diffusing to the second metal layer.

Abstract: Semiconductor structures are provided. The semiconductor structure includes a substrate and nanostructures formed over the substrate. In addition, the nanostructures includes channel regions and source/drain regions. The semiconductor structure further includes a gate structure vertically sandwiched the channel regions of the nanostructures and a contact wrapping around and vertically sandwiched between the source/drain regions of the nanostructures.

Abstract: End-to-end neural image compression using deep reinforcement learning (DRL) is performed by at least one processor and includes encoding an input, generating encoded representations of the input, generating a set of quantization keys using a first neural network, based on a set of previous quantization states, wherein each quantization key in the set of quantization keys and each previous quantization state in the set of previous quantization states correspond to the encoded representations of the input, generating a set of dequantized numbers representing dequantized representations of the encoded representations of the input, based on the set of quantization keys, using a second neural network, and generating a reconstructed output, based on the set of dequantized numbers.

Abstract: An optoelectronic semiconductor element is provided. The optoelectronic semiconductor element includes a semiconductor stack and a first metal layer. The semiconductor stack includes a first portion and a second portion stacked in sequence, with the second portion including an active region. The first metal layer is located on the first portion and is electrically connected to the first portion. A top-view outline of the first portion shows a first pattern, a top-view outline of the second portion shows a second pattern, and a top-view outline of the first metal layer shows a third pattern. The area ratio of the third pattern to the first pattern is from 0.5% to 10%.

Abstract: A phase error compensation circuit and a method for compensating a phase error between a reference clock and a feedback clock are provided. The phase error compensation circuit includes a first programmable delay circuit, a second programmable delay circuit and at least one swapping circuit. The first programmable delay circuit provides a first delay. The second programmable delay circuit provides a second delay. At a present cycle, the first delay is unchanged, wherein the swapping circuit applies the first delay to the feedback clock for generating a compensated feedback clock and applies the second delay to the reference clock for generating a compensated reference clock. At a next cycle, the second delay is unchanged, where the swapping circuit applies the second delay to the feedback clock for generating the compensated feedback clock and applies the first delay to the reference clock for generating the compensated reference clock.

Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.

Abstract: A semiconductor structure includes a first device unit and a second device unit, each of which includes channel features spaced apart from each other, and a dielectric wall disposed between the first and second device units. The dielectric wall includes a first part which includes a plurality of first portions that are in direct contact with the channel features of the first device unit, and a second part which includes a plurality of second portions that are in direct contact with the channel features of the second device unit. At least one of the first and second parts carries positive or negative charges.

Abstract: Embodiments ralte to a multi-mode demosaicing circuit able to receive and demosaic image data in a different raw image formats, such as Bayer raw image format and Quad Bayer raw image format. The multi-mode demosaicing circuit demosaics Quad Bayer image data by interpolating a green channel of the image data along each of a plurality of directions, generating a gradient of the image data along each of the plurality of directions, modifying the interpolated green channels based on respective gradients to generate full-resolution green channel image data, which is combined with red and blue image data to generate the demosaiced image data. Interpolation is performed for non-green pixels based on neighboring green pixels along a specified direction, modified by a residual value based upon valued of one or more nearby same-color pixels and a correlation between values of the same color pixels and neighboring green pixels.