Patents by Inventor Sheng C. Liao

Sheng C. Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual row quad flat no-lead semiconductor package
    Patent number: 9666510
    Abstract: Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: May 30, 2017
    Assignee: Marvell World Trade Ltd.
    Inventors: Chenglin Liu, Sheng C. Liao, Shiann-Ming Liou
  • DUAL ROW QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
    Publication number: 20160358845
    Abstract: Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.
    Type: Application
    Filed: August 22, 2016
    Publication date: December 8, 2016
    Inventors: Chenglin Liu, Sheng C. Liao, Shiann-Ming Liou
  • Dual row quad flat no-lead semiconductor package
    Patent number: 9425139
    Abstract: Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: August 23, 2016
    Assignee: Marvell World Trade Ltd.
    Inventors: Chenglin Liu, Sheng C. Liao, Shiann-Ming Liou
  • DUAL ROW QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
    Publication number: 20140069703
    Abstract: Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.
    Type: Application
    Filed: September 10, 2013
    Publication date: March 13, 2014
    Applicant: Marvell World Trade Ltd.
    Inventors: Chenglin Liu, Sheng C. Liao, Shiann-Ming Liou