Patents by Inventor Sheng-Chang Hsu
Sheng-Chang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923433Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.Type: GrantFiled: March 9, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-Liang Pan, Yungtzu Chen, Chung-Chieh Lee, Yung-Chang Hsu, Chia-Yang Hung, Po-Chuan Wang, Guan-Xuan Chen, Huan-Just Lin
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Publication number: 20240069299Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
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Patent number: 11567400Abstract: In accordance with some embodiments of the present disclosure, an inspection method of a photomask includes performing a first inspection process, unloading the photomask from the inspection system, and performing a second inspection process. In the first inspection process, a common Z calibration map of an objective lens of an optical module with respect to the photomask is generated and stored, and a first image of the photomask is captured by using an image sensor while focusing the objective lens of the optical module based on the common Z calibration map. The photomask is unloaded from the inspection system. In the second inspection process, the photomask is loaded on the inspection system and a second image of the photomask is captured by using an image sensor while focusing an objective lens of an optical module based on the common Z calibration map generated in the first inspection process.Type: GrantFiled: May 26, 2021Date of Patent: January 31, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsun-Cheng Tang, Cheng-Ming Lin, Sheng-Chang Hsu, Hao-Ming Chang, Way-Len Chang
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Publication number: 20220113631Abstract: A method for cleaning is provided. The method includes: removing a pellicle frame from a top surface of a photomask by debonding an adhesive between the photomask and the pellicle frame, wherein a first portion of the adhesive is remained on the top surface of the photomask, and removing the first portion of the adhesive on the top surface of the photomask, including applying an alkaline solution to the top surface of the photomask, and performing a mechanical impact to the photomask.Type: ApplicationFiled: December 23, 2021Publication date: April 14, 2022Inventors: YU-HSIN HSU, HAO-MING CHANG, SHAO-CHI WEI, SHENG-CHANG HSU, CHENG-MING LIN
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Patent number: 11209736Abstract: A method for manufacturing a photomask is provided. The method includes: receiving a substrate having a hard mask disposed thereover; forming a patterned photoresist over the hard mask; patterning the hard mask using the patterned photoresist as a mask; and removing the patterned photoresist. The removing of the patterned photoresist includes: oxidizing organic materials over the substrate; applying an alkaline solution onto the patterned photoresist; and removing the patterned photoresist by mechanical impact. A method for cleaning a substrate and a photomask are also provided.Type: GrantFiled: February 14, 2019Date of Patent: December 28, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yu-Hsin Hsu, Hao-Ming Chang, Shao-Chi Wei, Sheng-Chang Hsu, Cheng-Ming Lin
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Publication number: 20210278760Abstract: In accordance with some embodiments of the present disclosure, an inspection method of a photomask includes performing a first inspection process, unloading the photomask from the inspection system, and performing a second inspection process. In the first inspection process, a common Z calibration map of an objective lens of an optical module with respect to the photomask is generated and stored, and a first image of the photomask is captured by using an image sensor while focusing the objective lens of the optical module based on the common Z calibration map. The photomask is unloaded from the inspection system. In the second inspection process, the photomask is loaded on the inspection system and a second image of the photomask is captured by using an image sensor while focusing an objective lens of an optical module based on the common Z calibration map generated in the first inspection process.Type: ApplicationFiled: May 26, 2021Publication date: September 9, 2021Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsun-Cheng Tang, Cheng-Ming Lin, Sheng-Chang Hsu, Hao-Ming Chang, Way-Len Chang
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Patent number: 11048163Abstract: In accordance with some embodiments of the present disclosure, an inspection method of a photomask includes performing a first inspection process, unloading the photomask from the inspection system, and performing a second inspection process. In the first inspection process, a common Z calibration map of an objective lens of an optical module with respect to the photomask is generated and stored, and a first image of the photomask is captured by using an image sensor while focusing the objective lens of the optical module based on the common Z calibration map. The photomask is unloaded from the inspection system. In the second inspection process, the photomask is loaded on the inspection system and a second image of the photomask is captured by using an image sensor while focusing an objective lens of an optical module based on the common Z calibration map generated in the first inspection process.Type: GrantFiled: December 5, 2017Date of Patent: June 29, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsun-Cheng Tang, Cheng-Ming Lin, Sheng-Chang Hsu, Hao-Ming Chang, Waylen Chang
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Publication number: 20210096086Abstract: A method for defect inspection includes receiving a substrate having a plurality of patterns; obtaining a gray scale image of the substrate, wherein the gray scale image includes a plurality of regions, and each of the regions has a gray scale value; comparing the gray scale value of each region to a gray scale references to define a first group, a second group and an Nth group, wherein each of the first group, the second group and the Nth group has at least a region; performing a calculation to obtain a score; and when the score is greater than a value, the substrate is determined to have an ESD defect, and when the score is less than the value, the substrate is determined to be free of the ESD defect.Type: ApplicationFiled: April 7, 2020Publication date: April 1, 2021Inventors: TSUN-CHENG TANG, HAO-MING CHANG, SHENG-CHANG HSU, CHENG-MING LIN
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Publication number: 20200133118Abstract: A method for manufacturing a photomask is provided. The method includes: receiving a substrate having a hard mask disposed thereover; forming a patterned photoresist over the hard mask; patterning the hard mask using the patterned photoresist as a mask; and removing the patterned photoresist. The removing of the patterned photoresist includes: oxidizing organic materials over the substrate; applying an alkaline solution onto the patterned photoresist; and removing the patterned photoresist by mechanical impact. A method for cleaning a substrate and a photomask are also provided.Type: ApplicationFiled: February 14, 2019Publication date: April 30, 2020Inventors: YU-HSIN HSU, HAO-MING CHANG, SHAO-CHI WEI, SHENG-CHANG HSU, CHENG-MING LIN
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Patent number: 10508953Abstract: A method for processing a substrate is provided. The method includes supplying a first flow of a chemical solution into a processing chamber, configured to process the substrate, via a first dispensing nozzle. The method further includes producing a first thermal image of the first flow of the chemical solution. The method also includes performing an image analysis on the first thermal image. In addition, the method includes moving the substrate into the processing chamber when the result of the analysis of the first thermal image is within the allowable deviation from the baseline.Type: GrantFiled: April 18, 2017Date of Patent: December 17, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Min-An Yang, Hao-Ming Chang, Shao-Chi Wei, Kuo-Chin Lin, Sheng-Chang Hsu, Li-Chih Lu, Cheng-Ming Lin
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Patent number: 10459332Abstract: A method of fabricating a photomask includes providing a mask blank; removing a portion of the resist layer to form a patterned resist layer exposing a portion of the cooling layer; patterning the cooling layer by using the patterned resist layer as an etching mask; patterning the opaque layer; and removing the patterned resist layer and the patterned cooling layer. The mask blank includes a light-transmitting substrate and an opaque layer, a cooling layer, and a resist layer sequentially stacked thereon, wherein the cooling layer has a thermal conductivity ranging between 160 and 5000 and an effective atomic number ranging between 5 and 14.Type: GrantFiled: March 28, 2017Date of Patent: October 29, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hao-Ming Chang, Chih-Ming Chen, Cheng-Ming Lin, Sheng-Chang Hsu, Shao-Chi Wei, Hsao Shih, Li-Chih Lu
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Publication number: 20190137869Abstract: In accordance with some embodiments of the present disclosure, an inspection method of a photomask includes performing a first inspection process, unloading the photomask from the inspection system, and performing a second inspection process. In the first inspection process, a common Z calibration map of an objective lens of an optical module with respect to the photomask is generated and stored, and a first image of the photomask is captured by using an image sensor while focusing the objective lens of the optical module based on the common Z calibration map. The photomask is unloaded from the inspection system. In the second inspection process, the photomask is loaded on the inspection system and a second image of the photomask is captured by using an image sensor while focusing an objective lens of an optical module based on the common Z calibration map generated in the first inspection process.Type: ApplicationFiled: December 5, 2017Publication date: May 9, 2019Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsun-Cheng Tang, Cheng-Ming Lin, Sheng-Chang Hsu, Hao-Ming Chang, Waylen Chang
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Publication number: 20180299768Abstract: A photo mask assembly including a photo mask, a first adhesive layer adhered with the photo mask, a pellicle frame and a pellicle is provided. The pellicle frame includes a plurality of recesses for accommodating the first adhesive layer. The pellicle frame is adhered with the photo mask through the first adhesive layer accommodated in the plurality of recesses. The pellicle is disposed on the pellicle frame. The pellicle frame is between the pellicle and the first adhesive layer. An optical apparatus including the above-mentioned photo mask assembly is also provided.Type: ApplicationFiled: April 13, 2017Publication date: October 18, 2018Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shao-Chi Wei, Cheng-Ming Lin, Sheng-Chang Hsu, Yu-Hsin Hsu, Hao-Ming Chang
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Patent number: 10101651Abstract: A photo mask assembly including a photo mask, a first adhesive layer adhered with the photo mask, a pellicle frame and a pellicle is provided. The pellicle frame includes a plurality of recesses for accommodating the first adhesive layer. The pellicle frame is adhered with the photo mask through the first adhesive layer accommodated in the plurality of recesses. The pellicle is disposed on the pellicle frame. The pellicle frame is between the pellicle and the first adhesive layer. An optical apparatus including the above-mentioned photo mask assembly is also provided.Type: GrantFiled: April 13, 2017Date of Patent: October 16, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: SHao-Chi Wei, Cheng-Ming Lin, Sheng-Chang Hsu, Yu-Hsin Hsu, Hao-Ming Chang
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Publication number: 20180284601Abstract: A method of fabricating a photomask includes providing a blank mask; removing a portion of the resist layer to form a patterned resist layer exposing a portion of the cooling layer; patterning the cooling layer by using the patterned resist layer as an etching mask; patterning the opaque layer; and removing the patterned resist layer and the patterned cooling layer. The blank mask includes a light-transmitting substrate and an opaque layer, a cooling layer, and a resist layer sequentially stacked thereon, wherein the cooling layer has a thermal conductivity ranging between 160 and 5000 and an effective atomic number ranging between 5 and 14.Type: ApplicationFiled: March 28, 2017Publication date: October 4, 2018Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hao-Ming Chang, Chih-Ming Chen, Cheng-Ming Lin, Sheng-Chang Hsu, Shao-Chi Wei, Hsao Shih, Li-Chih Lu
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Publication number: 20180161828Abstract: A method for processing a substrate is provided. The method includes supplying a first flow of a chemical solution into a processing chamber, configured to process the substrate, via a first dispensing nozzle. The method further includes producing a first thermal image of the first flow of the chemical solution. The method also includes performing an image analysis on the first thermal image. In addition, the method includes moving the substrate into the processing chamber when the result of the analysis of the first thermal image is within the allowable deviation from the baseline.Type: ApplicationFiled: April 18, 2017Publication date: June 14, 2018Inventors: Min-An YANG, Hao-Ming CHANG, Shao-Chi WEI, Kuo-Chin LIN, Sheng-Chang HSU, Li-Chih LU, Cheng-Ming LIN
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Patent number: 8732262Abstract: A method to reduce link-up time between nodes in a communication system is provided. The method includes determining a node in the communication system is in a HANDSHAKE state; randomly configuring the node in one of a master mode and a slave mode based on a determination that the node is in the HANDSHAKE state; determining if the node is in a LINK-UP state with a selected node in the communication system based on the random configuring of the node; and randomly re-configuring the node in one of the master mode and the slave mode based on a negative determination that the node is in the LINK-UP state with the selected node.Type: GrantFiled: August 30, 2011Date of Patent: May 20, 2014Assignee: ADC DSL Systems, Inc.Inventors: Yiu Lam Chan, Clifton Powers, Laxman R. Anne, Derli Chan, Manish Sharma, Sheng-Chang Hsu
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Publication number: 20130054725Abstract: A method to reduce link-up time between nodes in a communication system is provided. The method includes determining a node in the communication system is in a HANDSHAKE state; randomly configuring the node in one of a master mode and a slave mode based on a determination that the node is in the HANDSHAKE state; determining if the node is in a LINK-UP state with a selected node in the communication system based on the random configuring of the node; and randomly re-configuring the node in one of the master mode and the slave mode based on a negative determination that the node is in the LINK-UP state with the selected node.Type: ApplicationFiled: August 30, 2011Publication date: February 28, 2013Applicant: 100-ADC DSL SYSTEMS, INC.Inventors: Yiu Lam Chan, Clifton Powers, Laxman R. Anne, Derli Chan, Manish Sharma, Sheng-Chang Hsu