Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion and a driving assembly. The fixed portion has a main axis and includes a case and a bottom. The case is made of a non-metal material. The bottom is connected to the case. The case and the bottom are arranged along the main axis. The movable portion moves relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a fixed portion, a movable portion, a driving assembly and a circuit assembly. The fixed portion has a main axis and a polygonal structure surrounding the main axis. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit assembly is electrically connected to the driving assembly.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical element driving mechanism having an optical axis includes a fixed portion, a movable portion, and a driving assembly. The movable portion is connected to the fixed portion. The driving assembly drives the movable portion to move in a direction that is parallel to the optical axis relative to the fixed portion, when viewed in the direction that is parallel to the optical axis, the optical element driving mechanism is a rectangular structure with a first side, a second side, a third side, and a fourth side, the first side and the third side are opposite, and the first side is adjacent to the second side and the fourth side.

Abstract: A driving mechanism is provided, including a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding an optical element, wherein the optical element defines an optical axis. The driving assembly is configured to drive the movable part to move relative to the fixed part.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical element driving mechanism is provided that includes a fixed assembly, a movable assembly, a driving assembly, and a circuit assembly. The movable assembly is configured to be connected to an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable member to move relative to the fixed assembly. The circuit assembly is electrically connected to the driving assembly, and the circuit assembly includes an electrical connection element having a resin material.

Abstract: An optical element driving mechanism having an optical axis includes a fixed portion, a movable portion, and a driving assembly. The movable portion is connected to the fixed portion. The driving assembly drives the movable portion to move in a direction that is parallel to the optical axis relative to the fixed portion, when viewed in the direction that is parallel to the optical axis, the optical element driving mechanism is a rectangular structure with a first side, a second side, a third side, and a fourth side, the first side and the third side are opposite, and the first side is adjacent to the second side and the fourth side.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a fixed portion, a movable portion, a driving assembly and a circuit assembly. The fixed portion has a main axis and a polygonal structure surrounding the main axis. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit assembly is electrically connected to the driving assembly.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical element driving mechanism is provided that includes a fixed assembly, a movable assembly, a driving assembly, and a circuit assembly. The movable assembly is configured to be connected to an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable member to move relative to the fixed assembly. The circuit assembly is electrically connected to the driving assembly, and the circuit assembly includes an electrical connection element having a resin material.

Abstract: A scheduled task executing method is used in a computer system and a peripheral device. The computer system has a time generator for generating time information and a memory. When the computer system is in a working state, a user input interface is provided, a scheduled time is set via the user input interface, and the scheduled time is automatically stored in the memory. When the computer system is in a power off state, electricity is continuously supplied to the time generator and the memory. If the time information and the scheduled time comply with a specified relation, a power control signal is generated. In response to the power control signal, the computer is switched from the power off state to the working state. When the computer system is in the working status, the peripheral device is activated to execute a scheduled task item corresponding to the scheduled time.

Abstract: Disclosed is an assembly structure of chip scale package, which can effectively avoid various yield and quality problems resulted from the poor control of epoxy during the process of chip scale package. A buffer zone whose planar size is smaller than that of the chip is disposed on the substrate, and the chip is then affixed to the buffer zone utilizing epoxy. Since the planar size of the buffer zone is smaller than that of the chip, the contamination of golden fingers and bonding pads due to the poor control of epoxy can be avoided, and furthermore the yield problems resulted from failed wire bonding and poor soldering are avoided. The assembly structure can be further applied to vertical stacking of multiple chips. A packaging method for the chip scale package is also provided.

Abstract: A method to seal a leading edge of an enamel pot by applying a layer of thermoplastic silicone on the leading edge of the enamel pot and then capping the leading edge with a hoop is disclosed. The thermoplastic silicone isolates the leading edge from being directly exposed to air so as to minimize the possibility of being subject to oxidation.