Patents by Inventor Sheng-Chang WANG

Sheng-Chang WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240160826
    Abstract: The routing of conductors in the conductor layers in an integrated circuit are routed using mixed-Manhattan-diagonal routing. Various techniques are disclosed for selecting a conductor scheme for the integrated circuit prior to fabrication of the integrated circuit. Techniques are also disclosed for determining the supply and/or the demand for the edges in the mixed-Manhattan-diagonal routing.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 16, 2024
    Inventors: Sheng-Hsiung Chen, Huang-Yu Chen, Chung-Hsing Wang, Jerry Chang Jui Kao
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240147734
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a memory cell overlying a substrate and comprising a top electrode. A sidewall spacer structure is disposed along sidewalls of the memory cell. The sidewall spacer structure comprises a first spacer layer on the memory cell, a second spacer layer around the first spacer layer, and a third spacer layer around the second spacer layer. The second spacer layer comprises a lateral segment adjacent to a vertical segment. The lateral segment abuts the top electrode and has a top surface aligned with or disposed below a top surface of the top electrode. A first conductive structure overlies the memory cell and contacts the lateral segment and the top electrode.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Harry-Hak-Lay Chuang, Hung Cho Wang, Sheng-Chang Chen, Sheng-Huang Huang
  • Publication number: 20240107414
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
  • Patent number: 11923433
    Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Liang Pan, Yungtzu Chen, Chung-Chieh Lee, Yung-Chang Hsu, Chia-Yang Hung, Po-Chuan Wang, Guan-Xuan Chen, Huan-Just Lin
  • Publication number: 20240070364
    Abstract: An integrated circuit includes a first power rail and a second power rail extending in a first direction, and a first power grid stub connected to the first power rail through a first via-connector. The integrated circuit also includes a first vertical conducting line extending in a second direction in a circuit cell between a first vertical cell boundary and a second vertical cell boundary. The first vertical conducting line and the first power grid stub are in a same metal layer and aligned with each other along the second direction.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Inventors: Johnny Chiahao LI, Sheng-Hsiung CHEN, Hui-Zhong ZHUANG, Jerry Chang Jui KAO, Xiangdong CHEN, Chung-Hsing WANG
  • Publication number: 20140083843
    Abstract: Disclosing is a preparation apparatus of a porous alumina plate, including an electrolytic tank, an aluminum substrate, a negative electrode, a thermostatic apparatus, a circulation apparatus, and a power supply. The electrolytic tank includes an accommodating space and connects to a first opening and a second opening of the accommodating space, respectively, and a slot wall of the electrolytic tank is installed with an input tube and an output tube. The accommodating space is used to accommodate an electrolyte. The aluminum substrate and the negative electrode are installed on the first opening and the second opening, respectively, to contact the electrolyte. The thermostatic apparatus is used to maintain a temperature of the electrolyte, and the circulation apparatus is connected to the thermostatic apparatus and the electrolytic tank to circularly transport the electrolyte in the thermostatic apparatus and the electrolytic tank.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 27, 2014
    Applicant: Southern Taiwan University of Science and Technology
    Inventors: Cheng-Hsin CHUANG, Yu-Min SHEN, Sheng-Chang WANG, Sung-Wen TSAI