Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a memory device surrounded by a dielectric structure disposed over a substrate. The memory device includes a data storage structure disposed between a bottom electrode and a top electrode. A bottom electrode via couples the bottom electrode to a lower interconnect. A top electrode via couples the top electrode to an upper interconnect. A bottommost surface of the top electrode via is directly over the top electrode and has a first width that is smaller than a second width of a bottommost surface of the bottom electrode via.

Abstract: A device configured to bond an electronic component includes a carrying platform, a pressing element, a closed space generating mechanism, a gas extracting mechanism, and an energy generating mechanism. The carrying platform is configured to carry a target substrate and a carrying substrate carrying the electronic component on the target substrate. The pressing element is made of a flexible material. The closed space generating mechanism is capable of putting the pressing element onto the carrying platform, so as to form a closed space between the pressing element and the carrying platform. The gas extracting mechanism is configured to extract gas from the closed space. The energy generating mechanism is disposed near the carrying platform, and configured to generate energy toward the carrying platform. A method for bonding an electronic component and a method for manufacturing a light-emitting diode (LED) display are also provided.

Abstract: A device for removing electronic components includes a mounting platform, an energy beam generating appliance and a guiding mechanism. The mounting platform is adapted to mount a substrate in place. The energy beam generating appliance generates and emits an energy beam onto the mounting platform. The guiding mechanism guides the energy beam to a specific position on the mounting platform according to a signal. A method using the device to remove electronic components and a method including the aforesaid removal method to manufacture LED panels are further provided.

Abstract: An apparatus for transferring an electronic component is configured to transfer an electronic component on a flexible carrier to a target substrate. The apparatus includes a first frame, a second frame, an abutment module, an actuator, and a negative pressure generating device. The abutment module includes an abutting component and a guide. The guide guides a movement of the abutting component. The actuator actuates the abutment module so that the abutting component and the guide are respectively moved between a start position and an end position of an abutment path. The negative pressure generating device is pumped through the abutment module. When the abutment module abuts against the flexible carrier, a negative pressure is generated between the abutment module and the flexible carrier by the negative pressure generating device. The abutting component and the guide are moved simultaneously in at least a portion of the abutment path.

Abstract: An electronic component transferring apparatus is configured to transfer an electronic component on a flexible carrier onto a target substrate. The electronic component transferring apparatus includes a first frame configured to carry the flexible carrier, a second frame configured to carry the target substrate, an abutting component arranged adjacent to the flexible carrier, an actuating mechanism, an energy generating device, and an optical sensing module. The actuating mechanism is configured to actuate the abutting component and move the abutting component in a direction of the flexible carrier, such that an abutting end of the abutting component abuts against the flexible carrier. The energy generating device is configured to generate an energy beam penetrating at least a portion of the abutting component and being directed towards the flexible carrier from the abutting end of the abutting component. The optical sensing module is configured to perform sensing through the abutting component.

Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

Abstract: An electronic component transfer apparatus is configured to transfer an electronic component on a flexible carrier to a target substrate. The electronic component transfer apparatus includes a first frame, a second frame, an abutting component, an actuating mechanism, an energy generating device, an image capture device, and a data processing module. The first frame is configured to carry the flexible carrier. The second frame is configured to carry the target substrate. The abutting component is disposed adjacent to the flexible carrier. The actuating mechanism is configured to actuate the abutting component, so that the abutting end of the abutting component abuts against the flexible carrier. The energy generating device generates an energy beam. The image capture device captures an image through the abutting component. The data processing module receives and computes the image to determine whether to adjust the relative position between the abutting end and the flexible carrier.

Abstract: A transferring apparatus configured to transfer a plurality of electronic components on a carrier film to a substrate. The transferring apparatus includes a controller and an abutting module. The abutting module is electrically connected to the controller, and includes an abutting element and a negative pressure generating device. The controller is configured to control the abutting element to move towards the substrate so as to abut the carrier film but not to penetrate through the carrier film, whereby the abutting element pushes the carrier film so as to push at least one of the electronic components to the substrate. The controller is configured to control the negative pressure generating device to suck air towards a direction opposite to a direction of the abutting element pushing the carrier film, so as to generate negative pressure to suck the carrier film. A method for transferring an electronic component is also provided.

Abstract: A method for transferring chips and a method for manufacturing an LED display are introduced. The method for manufacturing the LED display includes the method for transferring chips. The method for transferring chips includes providing a carrier substrate on which multiple LED chips are carried; providing a target substrate on which wires capable of forming circuits with the LED chips are disposed; transferring the LED chips carried on the carrier substrate onto the wires; galvanizing the wires to trigger at least partial of the LED chips to generate light by the circuits formed; checking the LED chips forming the circuit and fixing the LED chips generating light on the wire; and removing LED chips which fail to generate light.

Abstract: A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a substrate-carrying module for carrying a chip-carrying structure, a chip-transferring module, and a system control module. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters, and a micro heater control chip. The chip-transferring module is configured for transferring a chip onto two corresponding ones of the conductive materials, and the chip-transferring module includes a motion sensing chip. When chip movement information of the chip that is provided by the motion sensing chip is transmitted to the system control module, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials by control of the system control module according to the chip movement information of the chip.

Abstract: A chip-carrying structure and a chip-bonding method are provided. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters disposed on or inside the circuit substrate, and a micro heater control chip electrically connected to the micro heaters. Therefore, when a chip is disposed on two corresponding ones of the conductive materials, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials according to chip movement information of the chip.

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract: A modular circuit device is provided with a first circuit module including a circuit board and first and first bridge elements. The circuit board includes a substrate, a female header, and a pin header. The substrate includes a first projection at one end with the female header disposed thereon, and a second projection at the other end with the pin header disposed thereon. The first bridge member includes a bottom recess, two cavities on two sides of the bottom recess respectively, and a socket on one end of the first bridge member. The first bridge element includes a bottom recess, two cavities on two sides of the bottom recess respectively, and a projecting element at the other end of the first bridge element. The first projection is disposed in the cavities of the first bridge member. The second projection is in the cavities of the first bridge element.

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.

Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract: A video decoding method includes receiving video data and transforming the video data from a Huffman tree to at least one full tree and at least one one-side tree. One microcode corresponding to the video coding standard that has encoded the received video data is read where a format of the read microcode is determined. The method further includes reading video data from the transformed video data according to the consuming length of the read microcode if the format of the read microcode is a leaf, and decoding the read video data according to the decoding field of the read microcode to output a decoding result.