Patents by Inventor Sheng-Chi Cheng

Sheng-Chi Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071999
    Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tseng Hsing Lin, Chien-Hsun Lee, Tsung-Ding Wang, Jung-Wei Cheng, Hao-Cheng Hou, Sheng-Chi Lin, Jeng-An Wang, Yao-Cheng Wu
  • Patent number: 5817382
    Abstract: The invention relates to a method of manufacturing film sheets provided with adhesive means, to be used for wrapping products, such as, for instance, flowers and plants, wherein a band of film is provided with a series of imprints in an adhesive material, which imprints form the adhesive means, whereafter the film band is cut into film sheets to be used separately. The invention moreover relates to an apparatus for the manufacture of film sheets provided with adhesive means, to be used for wrapping products, such as, for instance, flowers and plants.
    Type: Grant
    Filed: February 20, 1996
    Date of Patent: October 6, 1998
    Assignee: Jei Lee Corporation
    Inventor: Sheng Chi Cheng
  • Patent number: 4795601
    Abstract: The present invention pertains to an improved method for rapidly forming a decorative container for use as a covering for a similarly shaped object, which method comprises:(a) providing a thin sheet of metallized thermoplastic heat shrinkage polymer material;(b) optionally imprinting a design or other matter upon the sheet of polymer;(c) optionally cutting said sheet to the dimensions approximating the dimensions of the base and side walls of said object;(d) placing the sheet over a heated form having a temperature of between about 80.degree. and 110.degree. C.(e) placing a complementary heated form also having a temperature of between about 80.degree. and 110.degree. C.(f) fitting the heated forms of substep (d) and (e) together having the thermoplastic sheet therebetween;(g) maintaining the temperature of between about 80.degree. and 100.degree. C.
    Type: Grant
    Filed: August 19, 1987
    Date of Patent: January 3, 1989
    Assignees: Sheng-Chi Cheng, Robert Mann, Robert Mann Packaging, Inc.
    Inventor: Sheng-Chi Cheng