Abstract: A transfer carrier is adapted to be connected to an electrode of a micro light-emitting element and transfer the micro light-emitting element. A transfer carrier includes a transfer substrate and a plurality of metal bonding pads. The metal bonding pads are disposed on the transfer substrate, and every two metal bonding pads that are adjacent to each other are spaced apart from each other through a gap.

Abstract: A display panel including a substrate, a buffer insulating layer, a plurality of pads, and a plurality of light emitting diodes is provided. The substrate has a display area and a peripheral area adjacent to the display area. The buffer insulating layer is disposed on the substrate. The Young's modulus of the buffer insulating layer is less than 10 GPa. The pads are located on the buffer insulating layer and disposed on the display area of the substrate. The light emitting diodes are electrically connected to the pads and bonding to the display area of the substrate by the pads. The buffer insulating layer is located between the light emitting diodes and the substrate. A normal projection of the light emitting diodes on the substrate is at least partially overlapped with a normal projection of the buffer insulating layer on the substrate.

Abstract: A micro device includes an epitaxial structure, an insulating layer, and a light-transmissive layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connected to the top surface and the bottom surface. The insulating layer covers the peripheral surface and the bottom surface of the epitaxial structure and exposes a portion of the peripheral surface. The light-transmissive layer covers the top surface of the epitaxial structure and is extended over at least a portion of the portion of the peripheral surface.

Abstract: A micro component structure includes a substrate, a micro component and a fixing structure. The micro component and the fixing structure are disposed on the substrate. The micro component has a spacing from the substrate. The fixing structure includes a first supporting layer and a second supporting layer. The micro component is connected to the substrate through the fixing structure. The first supporting layer is connected to the micro component and located between the second supporting layer and the micro component. A refractive index of the first supporting layer is greater than a refractive index of the second supporting layer.

Abstract: A micro device includes an epitaxial structure, an overcoat layer, and a first light-guiding structure. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connecting the top surface and the bottom surface. The insulating layer covers at least the bottom surface and part of the peripheral surface of the epitaxial structure. The overcoat layer includes a contact portion and an extension portion. The contact portion conformally covers the insulating layer and the peripheral surface and the bottom surface of the epitaxial structure, and the extension portion connects the contact portion and extends in a direction away from the peripheral surface. The display apparatus includes a circuit substrate and a plurality of the above-mentioned micro devices. The micro devices are disposed and are correspondingly electrically connected to the first pads and the second pads of circuit substrate.

Abstract: A structure with micro device includes a substrate, at least one micro device, and at least one holding structure. The micro device includes an epitaxial structure and an overcoat layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connecting the top surface and the bottom surface. The overcoat layer includes a contact portion and an extension portion. The contact portion covers the peripheral surface and the bottom surface of the epitaxial structure. The extension portion connects the contact portion and extends in a direction away from the peripheral surface. The holding structure includes at least one connecting portion, at least one sacrificial portion and at least one holding portion. The connecting portion is disposed on the top surface of the epitaxial structure and the extension portion of the overcoat layer. The sacrificial portion connects the connecting portion and the holding portion.

Abstract: A micro component structure includes a substrate, a micro component and a fixing structure. The micro component and the fixing structure are disposed on the substrate. The micro component has a spacing from the substrate. The fixing structure includes a first supporting layer and a second supporting layer. The micro component is connected to the substrate through the fixing structure. The first supporting layer is connected to the micro component and located between the second supporting layer and the micro component. A refractive index of the first supporting layer is greater than a refractive index of the second supporting layer.

Abstract: A transfer carrier is adapted to be connected to an electrode of a micro light-emitting element and transfer the micro light-emitting element. A transfer carrier includes a transfer substrate and a plurality of metal bonding pads. The metal bonding pads are disposed on the transfer substrate, and every two metal bonding pads that are adjacent to each other are spaced apart from each other through a gap.

Abstract: A micro semiconductor chip, a micro semiconductor structure, and a display device are provided. The micro semiconductor chip includes an epitaxial layer, a first electrode, a second electrode and a side light guide element. The epitaxial layer has a top surface, a bottom surface and a side surface. The first electrode and the second electrode are disposed on the bottom surface of the epitaxial layer. The side light guide element disposed on the side surface has a connecting portion and an extending portion. The connecting portion is in contact with a part of the extending portion, and the extending portion extends away from the side surface of the epitaxial layer. The extending portion has a top surface and a bottom surface, wherein a plane containing the top surface of the epitaxial layer forms an acute angle ?1 with a plane containing the top surface of the extending portion.

Abstract: A method of manufacturing micro light-emitting element array is disclosed. A transfer substrate and at least one metal bonding pad are provided, and the metal bonding pad is disposed on the transfer substrate. A growth substrate and a plurality of micro light-emitting elements are provided. The micro light-emitting elements are disposed on the growth substrate, and a surface of each of the micro light-emitting elements away from the growth substrate having at least one electrode. The metal bonding pad is molten at a heating temperature, and the electrode is connected to the metal bonding pad. Then, the growth substrate is removed.

Abstract: A micro semiconductor chip, a micro semiconductor structure, and a display device are provided. The micro semiconductor chip includes an epitaxial layer, a first electrode, a second electrode and a side light guide element. The epitaxial layer has a top surface, a bottom surface and a side surface. The first electrode and the second electrode are disposed on the bottom surface of the epitaxial layer. The side light guide element disposed on the side surface has a connecting portion and an extending portion. The connecting portion is in contact with a part of the extending portion, and the extending portion extends away from the side surface of the epitaxial layer. The extending portion has a top surface and a bottom surface, wherein a plane containing the top surface of the epitaxial layer forms an acute angle ?1 with a plane containing the top surface of the extending portion.

Abstract: A micro device includes an epitaxial structure, an insulating layer, and a light-transmissive layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connected to the top surface and the bottom surface. The insulating layer covers the peripheral surface and the bottom surface of the epitaxial structure and exposes a portion of the peripheral surface. The light-transmissive layer covers the top surface of the epitaxial structure and is extended over at least a portion of the portion of the peripheral surface.

Abstract: A structure with micro device includes a substrate, at least one micro device, and at least one holding structure. The micro device includes an epitaxial structure and an overcoat layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connecting the top surface and the bottom surface. The overcoat layer includes a contact portion and an extension portion. The contact portion covers the peripheral surface and the bottom surface of the epitaxial structure. The extension portion connects the contact portion and extends in a direction away from the peripheral surface. The holding structure includes at least one connecting portion, at least one sacrificial portion and at least one holding portion. The connecting portion is disposed on the top surface of the epitaxial structure and the extension portion of the overcoat layer. The sacrificial portion connects the connecting portion and the holding portion.

Abstract: A fan frame of an axial-flow fan is provided to reduce the vibration generated during the rotation of the impeller that is transmitted to the outside of the axial-flow fan via the fan frame. The fan frame includes a housing, a base and a plurality of connection members. The base includes a shaft-coupling portion. Each of the plurality of connection members includes two ends respectively connected to the housing and the base. Each of the plurality of connection members is defined with an extension line passing through the two ends of the connection member. Each of the plurality of connection members includes a first bending portion and a second bending portion. The first bending portion extends around a first notch, and the second bending portion extends around a second notch. The extension line extends through the first and second notches.

Abstract: A motor is provided to improve the damp proof or dustproof effect of the conventional motor. The motor includes an isolating housing, a sealing member and an inner assembly. The isolating housing includes first and second housing parts. A through-hole is formed between the first and second housing parts. The through-hole communicates an internal space of the isolating housing with an external space. The sealing member includes a frame portion and a wire receiving portion. The wire receiving portion is integrally formed with the frame portion. The frame portion is arranged between the first and second housing parts. The wire receiving portion is disposed at the through-hole. A lead wire is received in the wire receiving portion, and includes one end extending into the internal space of the isolating housing. The inner assembly is received in the internal space of the isolating housing and electrically connected to the lead wire.

Abstract: A method of manufacturing micro light-emitting element array is disclosed. A transfer substrate and at least one metal bonding pad are provided, and the metal bonding pad is disposed on the transfer substrate. A growth substrate and a plurality of micro light-emitting elements are provided. The micro light-emitting elements are disposed on the growth substrate, and a surface of each of the micro light-emitting elements away from the growth substrate having at least one electrode. The metal bonding pad is molten at a heating temperature, and the electrode is connected to the metal bonding pad. Then, the growth substrate is removed.

Abstract: An antenna structure includes a housing, a first connecting portion, a matching unit, a second connecting portion, and a first switching circuit. The housing defines a slot, a first gap, and a second gap. The housing is divided into a first portion and a second portion by the slot, the first gap, and the second gap. The second portion is grounded. One end of the first connecting portion electrically connected to the first portion and another end of the first connecting portion electrically connected to a feed point through the matching unit. The first portion is divided into a first radiating portion and a second radiating portion by the first connecting portion. One end of the second connecting portion is electrically connected to the first radiating portion and another end of the second connecting portion is grounded through the first switching circuit.

Abstract: A display panel including a substrate, a buffer insulating layer, a plurality of pads, and a plurality of light emitting diodes is provided. The substrate has a display area and a peripheral area adjacent to the display area. The buffer insulating layer is disposed on the substrate. The Young's modulus of the buffer insulating layer is less than 10 GPa. The pads are located on the buffer insulating layer and disposed on the display area of the substrate. The light emitting diodes are electrically connected to the pads and bonding to the display area of the substrate by the pads. The buffer insulating layer is located between the light emitting diodes and the substrate. A normal projection of the light emitting diodes on the substrate is at least partially overlapped with a normal projection of the buffer insulating layer on the substrate.

Abstract: A motor includes a housing, a stator and a rotor. The stator is received in the housing. The rotor includes a shaft and a permanent magnet. The shaft is rotatably coupled to the housing, and one end of the shaft extends out of the housing through a shaft hole. A gap is formed between the shaft and the shaft hole. The permanent magnet is coupled with the shaft and spaced from the stator. A sealing member is arranged on the housing and surrounds the shaft hole. The sealing member includes a blocking portion abutting with a predetermined part of the rotor outside the housing. The blocking portion seals the gap. As such, dustproof and damp-proof functions of the motor are improved.

Abstract: The present disclosure provides an impeller and a mold for manufacting the impeller. The impeller includes a plurality of blades, and there is an overlapped area between two adjacent blades. The mold includes a first part, a second part and a plurality of slide groups. The first part and the second part move in a mold opening direction. At least a portion of each slide group is located in the overlapped area, and each slide group has a first slide block and a second slide block, and a movement direction of the first slide block and the second slide block is perpendicular to the mold opening direction. By using that the movement direction of the slide group is perpendicular to the mold opening direction, the impeller with blades that have the overlapped area may be manufactured. The blades of the impeller may have a special shape.