Abstract: A zoom lens module is provided and includes a liquid lens, a rigid lens, and an actuator. The liquid lens has two side surfaces opposite to each other. An optical axis of the liquid lens passes through the two side surfaces, and at least one of two side surfaces is a deformable side surface. The rigid lens has a shaping surface being not flat. The rigid lens is arranged inside or outside the liquid lens, and the shaping surface faces the deformable side surface. The actuator is connected to one of the liquid lens and the rigid lens to drive the deformable side surface and the shaping surface to move relative to each other, so that the shaping surface contacts and presses the deformable side surface to be deformed.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material encapsulating the semiconductor device, and a redistribution structure disposed over the encapsulating material and the semiconductor device. The semiconductor device includes conductive bumps and a dielectric film encapsulating the conductive bumps, where a material of the dielectric film comprises an epoxy resin and a filler. The conductive bumps are isolated from the encapsulating material by the dielectric film. The redistribution structure is electrically connected to the conductive bumps.

Abstract: A camera device connected to a terminal device, comprising a baseplate, a support frame, a photo shooting component, a flexible flat cable, and a limiting member. The baseplate comprises a first surface, a second surface, and a side surface between the first surface and the second surface. The support frame is disposed on the first surface of the baseplate. The photo shooting component is disposed on the support frame and is electrically connected to the baseplate. The flexible flat cable is disposed on the baseplate, and comprises a first extension section, a second extension section, and a bent section between the first extension section and the second extension section. One end of the first extension section away from the bent section is disposed on the side surface. The bent section is bent around the side surface and extends to the second surface.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material encapsulating the semiconductor device, and a redistribution structure disposed over the encapsulating material and the semiconductor device. The semiconductor device includes an active surface having conductive bumps and a dielectric film encapsulating the conductive bumps, where a material of the dielectric film comprises an epoxy resin and a filler. The conductive bumps are isolated from the encapsulating material by the dielectric film, and the redistribution structure is electrically connected to the conductive bumps. A manufacturing method of a semiconductor package is also provided.

Abstract: A semiconductor package includes a first integrated circuit and a first waveguide. The first integrated circuit includes an optical coupler. The first waveguide is optically coupled to the optical coupler. In some embodiments, the first waveguide protrudes beyond the optical coupler. In some embodiments, the first waveguide is partially overlapped with the optical coupler.

Abstract: A semiconductor package includes a photonic integrated circuit, an electronic integrated circuit and a waveguide. The photonic integrated circuit includes an optical coupler. The electronic integrated circuit is disposed aside the photonic integrated circuit. The waveguide is optically coupled to the optical coupler, wherein the waveguide is disposed at an edge of the photonic integrated circuit and protrudes from the edge of the photonic integrated circuit.

Abstract: A saxophone has a body tube, a high-F #structure, and a side-Bb structure. The body tube has a high-F #tone hole and a side-Bb hole. The high-F #structure opens or closes the high-F #tone hole. The side-Bb structure has a side-Bb tone-hole cover, a side-Bb driving assembly, an auxiliary key, and a main key. The main key is separated from the auxiliary key. The auxiliary key is disposed above a high F #key of the high-F #structure along a vertical line. The auxiliary key and the main key are separately arranged around a centerline of the body tube. The auxiliary key and the main key correspond in height position. Both of the auxiliary key and the main key are connected to the side-Bb driving assembly and drive the side-Bb tone-hole cover to close or open the side-Bb tone hole.

Abstract: A reusable sanitary napkin includes an outer body, a first absorbent fabric component, and a skin-contacting fabric component. The outer body includes a base layer component and a top waterproof layer component. The top waterproof layer component is attached to a top surface of the base layer component, and has a through hole. The first absorbent fabric component is attached to the top surface of the base layer component, and is registered with the through hole. The skin-contacting fabric component is attached between the first absorbent fabric component and the top waterproof layer component. A boundary of the through hole is disposed on the skin-contacting fabric component.

Abstract: A semiconductor package includes a photonic integrated circuit, an electronic integrated circuit and a waveguide. The photonic integrated circuit includes an optical coupler. The electronic integrated circuit is disposed aside the photonic integrated circuit. The waveguide is optically coupled to the optical coupler, wherein the waveguide is disposed at an edge of the photonic integrated circuit and protrudes from the edge of the photonic integrated circuit.

Abstract: A zoom lens module is provided and includes a liquid lens, a rigid lens, and an actuator. The liquid lens has two side surfaces opposite to each other. An optical axis of the liquid lens passes through the two side surfaces, and at least one of two side surfaces is a deformable side surface. The rigid lens has a shaping surface being not flat. The rigid lens is arranged inside or outside the liquid lens, and the shaping surface faces the deformable side surface. The actuator is connected to one of the liquid lens and the rigid lens to drive the deformable side surface and the shaping surface to move relative to each other, so that the shaping surface contacts and presses the deformable side surface to be deformed.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material encapsulating the semiconductor device, and a redistribution structure disposed over the encapsulating material and the semiconductor device. The semiconductor device includes an active surface having conductive bumps and a dielectric film encapsulating the conductive bumps, where a material of the dielectric film comprises an epoxy resin and a filler. The conductive bumps are isolated from the encapsulating material by the dielectric film, and the redistribution structure is electrically connected to the conductive bumps. A manufacturing method of a semiconductor package is also provided.

Abstract: Semiconductor packages are provided. The semiconductor package includes a first redistribution layer structure, a photonic integrated circuit, an electronic integrated circuit, a waveguide and a memory. The photonic integrated circuit is disposed over and electrically connected to the first redistribution layer structure, and includes an optical transceiver and an optical coupler. The electronic integrated circuit is disposed over and electrically connected to the first redistribution layer structure. The waveguide is optically coupled to the optical coupler. The memory is electrically connected to the electronic integrated circuit.

Abstract: A package includes a first die, a second die, a bridge structure, a first redistribution structure, and an encapsulant. The first die and the second die are disposed side by side. The bridge structure is disposed over the first die and the second die. The bridge structure includes a plurality of routing patterns and a plurality of connectors disposed on the plurality of routing patterns. The first redistribution structure is sandwiched between the first die and the bridge structure and is sandwiched between the second die and the bridge structure. The plurality of connectors of the bridge structure is in physical contact with the first redistribution structure. The encapsulant encapsulates the bridge structure. The plurality of routing patterns and the plurality of connectors of the bridge structure are completely spaced apart from the encapsulant.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A semiconductor wafer having an active side and a back side opposite to the active side is provided. A plurality of conductive bumps are provided on the active side. A protection film is laminated on the active side, wherein the protection film includes a dielectric film covering the plurality of conductive bumps and a cover film covering the dielectric film. A thinning process is performed on the back side to form a thinned semiconductor wafer. The cover film is removed from the dielectric film. A singularization process is performed on the thinned semiconductor wafer with the dielectric film to form a plurality of semiconductor devices.

Abstract: A package includes a first redistribution structure, a bridge structure, an adhesive layer, a plurality of conductive pillars, an encapsulant, a first die, and a second die. The bridge structure is disposed on the first redistribution structure. The adhesive layer is disposed between the bridge structure and the first redistribution structure. The conductive pillars surround the bridge structure. A height of the conductive pillars is substantially equal to a sum of a height of the adhesive layer and a height of the bridge structure. The encapsulant encapsulates the bridge structure, the adhesive layer, and the conductive pillars. The first die and the second die are disposed over the bridge structure. The first die is electrically connected to the second die through the bridge structure. The first die and the second die are electrically connected to the first redistribution structure through the conductive pillars.

Abstract: A semiconductor package including a semiconductor die, a molding compound and a redistribution structure is provided. The molding compound laterally wraps around the semiconductor die, wherein the molding compound includes a base material and a first filler particle and a second filler particle embedded in the base material. The first filler particle has a first recess located in a top surface of the first filler particle, and the second filler particle has at least one hollow void therein. The redistribution structure is disposed on the semiconductor die and the molding compound, wherein the redistribution structure has a polymer dielectric layer. The polymer dielectric layer includes a body portion and a first protruding portion protruding from the body portion, wherein the body portion is in contact with the base material and the top surface of the first filler particle, and the first protruding portion fits with the first recess of the first filler particle.

Abstract: Semiconductor packages are provided. The semiconductor package includes a first redistribution layer structure, a photonic integrated circuit, an electronic integrated circuit, a waveguide and a memory. The photonic integrated circuit is disposed over and electrically connected to the first redistribution layer structure, and includes an optical transceiver and an optical coupler. The electronic integrated circuit is disposed over and electrically connected to the first redistribution layer structure. The waveguide is optically coupled to the optical coupler. The memory is electrically connected to the electronic integrated circuit.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A semiconductor wafer having an active side and a back side opposite to the active side is provided. A plurality of conductive bumps are provided on the active side. A protection film is laminated on the active side, wherein the protection film includes a dielectric film covering the plurality of conductive bumps and a cover film covering the dielectric film. A thinning process is performed on the back side to form a thinned semiconductor wafer. The cover film is removed from the dielectric film. A singularization process is performed on the thinned semiconductor wafer with the dielectric film to form a plurality of semiconductor devices.

Abstract: A semiconductor package including a semiconductor die, a molding compound and a redistribution structure is provided. The molding compound laterally wraps around the semiconductor die, wherein the molding compound includes a base material and a first filler particle and a second filler particle embedded in the base material. The first filler particle has a first recess located in a top surface of the first filler particle, and the second filler particle has at least one hollow void therein. The redistribution structure is disposed on the semiconductor die and the molding compound, wherein the redistribution structure has a polymer dielectric layer. The polymer dielectric layer includes a body portion and a first protruding portion protruding from the body portion, wherein the body portion is in contact with the base material and the top surface of the first filler particle, and the first protruding portion fits with the first recess of the first filler particle.

Abstract: A package includes a first redistribution structure, a bridge structure, an adhesive layer, a plurality of conductive pillars, an encapsulant, a first die, and a second die. The bridge structure is disposed on the first redistribution structure. The adhesive layer is disposed between the bridge structure and the first redistribution structure. The conductive pillars surround the bridge structure. A height of the conductive pillars is substantially equal to a sum of a height of the adhesive layer and a height of the bridge structure. The encapsulant encapsulates the bridge structure, the adhesive layer, and the conductive pillars. The first die and the second die are disposed over the bridge structure. The first die is electrically connected to the second die through the bridge structure. The first die and the second die are electrically connected to the first redistribution structure through the conductive pillars.