Abstract: A heat dissipating apparatus used in non-forced convection includes a cooling plate assembly, an upper shielding plate, a lower shielding plate, a metal base, and heat pipes. The cooling plate assembly has a cutting opening. The upper and the lower shielding plates cover the cutting opening above and below the cooling plate assembly, respectively. The metal base is disposed below the lower shielding plate and has plural cooling fins. Each heat pipe has an evaporator section, a first condenser section, and a second condenser section. Each evaporator section is fixed to the metal base. Each condenser passes through the cooling plate assembly and is closed to two sides of the cutting opening. Therefore, the wind resistance is reduced and the friction between air flow and the cooling plates is decreased, which further enhances the whole performance of heat conduction and dissipation.

Abstract: A heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers is disclosed to include a radiation fin set, a heat-dissipation spacer placed on the radiation fin set and defining opposing first surface and second surface, a first heat dissipation layer including multiple first heat pipes with respective first segments thereof placed on the first surface of the heat-dissipation spacer, and a second heat dissipation layer including multiple second heat pipes with respective first segments thereof placed on the second surface of the heat-dissipation spacer. At least a part of the first segment of at least one first heat pipe of the first heat dissipation layer is disposed overlapped on at least a part of the first segment of at least one second heat pipe of the second heat dissipation layer in a parallel manner.

Abstract: A heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers is disclosed to include a radiation fin set, a heat-dissipation spacer placed on the radiation fin set and defining opposing first surface and second surface, a first heat dissipation layer including multiple first heat pipes with respective first segments thereof placed on the first surface of the heat-dissipation spacer, and a second heat dissipation layer including multiple second heat pipes with respective first segments thereof placed on the second surface of the heat-dissipation spacer. At least a part of the first segment of at least one first heat pipe of the first heat dissipation layer is disposed overlapped on at least a part of the first segment of at least one second heat pipe of the second heat dissipation layer in a parallel manner.

Abstract: A thermoelectric-cooling-chip-based heat-dissipating system includes a partition board; a thermoelectric cooling chip having a hot side and a cold side located at two opposite sides of the partition board; a cool-air zone containing an air passage, a first fan, and a first heatsink set, wherein the first heatsink set is deposited on the cold side of the thermoelectric cooling chip, and the first fan and the first heatsink set are located in the air passage, so that the first fan blows air around the first heatsink set to move along the air passage; and a heat-dissipating zone containing a second fan and a second heatsink set, wherein the second fan blows air toward the second heatsink set, and the second heatsink set is deposited on the hot side of the thermoelectric cooling chip; wherein, the cool-air zone and the heat-dissipating zone are isolated from each other.

Abstract: A heat-dissipating structure includes a heat-dissipating partition, a first heat-dissipating layer, and a second heat-dissipating layer. The heat-dissipating partition a first surface and a second surface that are opposite to each other. The first heat-dissipating layer includes a plurality of first heat pipes, each of which is disposed on the first surface of the heat-dissipating partition. The second heat-dissipating layer includes a plurality of second heat pipes, each of which is disposed on the second surface of the heat-dissipating partition. Each of the first heat pipes of the first heat-dissipating layer has at least one part overlapping at least one part of one of the second heat pipe of the second heat-dissipating layer. Thereby, heat from a to-be-cooled article can be quickly dissipated through the first heat-dissipating layer, the heat-dissipating partition, and the second heat-dissipating layer.