Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a substrate and at least one contact plug. The substrate has an epi-layer. The contact plug is formed on the epi-layer and includes a silicide cap disposed on the epi-layer; a conductive pillar disposed on the silicide cap such that the conductive pillar electrically connects to the epi-layer via the silicide cap; and a hybrid liner. The hybrid liner surrounds the conductive pillar and includes a lower portion abutting the silicide cap and having a nitride material and an upper portion abutting the conductive pillar and having an oxidized nitride material. Due to the hybrid liner, a semiconductor structure with increased capacitance and decreased resistivity can be obtained.

Abstract: The present disclosure describes a semiconductor device with a nitrided capping layer and methods for forming the same. One method includes forming a first conductive structure in a first dielectric layer on a substrate, depositing a second dielectric layer on the first conductive structure and the first dielectric layer, and forming an opening in the second dielectric layer to expose the first conductive structure and a portion of the first dielectric layer. The method further includes forming a nitrided layer on a top portion of the first conductive structure, a top portion of the portion of the first dielectric layer, sidewalls of the opening, and a top portion of the second dielectric layer, and forming a second conductive structure in the opening, where the second conductive structure is in contact with the nitrided layer.

Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.

Abstract: An antenna module includes two antenna units, two isolation members, and a grounding member. Each antenna unit consists of two feeding ends, two first radiators, and two second radiators. The isolating members are disposed between the first and second portions of each antenna unit. The grounding member is disposed beside the two antenna units and the two isolation members. A first slot is formed among each first radiator, the second radiator, and the grounding member. The two second radiators are connected to the third radiator. A third slot is formed between the second radiator and the second portion. The two antenna units are symmetric to the fourth slot in a mirrored manner, and the two first portions have widths gradually changing along an extending direction of the fourth position.

Abstract: A display panel includes a substrate, multiple display units, an optical layer, a first adhesive layer, and a second adhesive layer. The display units are disposed over the substrate. The optical layer is disposed on the display units. The first adhesive layer contacts a side surface of the substrate. The second adhesive layer is disposed between the first adhesive layer and the optical layer and contacts a surface of the optical layer facing the substrate, and an interface exists between the second adhesive layer and the first adhesive layer.

Abstract: A display panel including a substrate, multiple display units, an encapsulation layer, and a block strip is disclosed. The display units are disposed over the substrate. The encapsulation layer is disposed over the substrate and between the display units. The block strip is disposed between the encapsulation layer and the substrate, and extends along an edge of the substrate.

Abstract: A display panel having a display region and a lead out wiring region adjacent to each other is provided. The display panel includes a circuit substrate, light-emitting elements disposed at the display region and located on the circuit substrate, an encapsulation layer, and a sealing layer. The circuit substrate has opposite top and bottom surfaces and a first side surface connecting the top and bottom surfaces and extending from the display region to the lead out wiring region. The encapsulation layer is disposed at the display region and located between the circuit substrate and the light-emitting elements, where a first terminal surface of the encapsulation layer is aligned with the first side surface of the circuit substrate. The sealing layer covers the first side surface and the first terminal surface. A tiled display device including the above-mentioned display panel and a manufacturing method of the display panel are also provided.

Abstract: A display apparatus includes a first display module including a substrate, an encapsulation layer, and a sealant. The substrate has a display surface, a bottom surface, and a side surface connected between the opposite display and bottom surfaces. The encapsulation layer is disposed on the display surface. The sealant includes a connection part, a bottom part contacting the bottom surface, and an extension part having an outer surface. The connection part has two opposite ends and opposite first and second surfaces. The bottom part and the extension part are respectively located at the two opposite ends and extended from the first and second surfaces in directions away from each other. The first surface contacts the side surface. The encapsulation layer contacts the connection part and the extension part and is coplanar with the outer surface. A horizontal distance between the outer surface and the second surface is greater than 0.

Abstract: A display panel includes a package including a substrate, LEDs and a encapsulation adhesive. The substrate includes a bottom surface, a first side and a second side. The first side and the second side are opposite sides, and the bottom surface and the first side form a first angle, the bottom surface and the second side form a second angle. The LEDs are on the substrate. The encapsulation adhesive covers the first side, the second side and the light-emitting diodes. The encapsulation adhesive has a third side adjacent to the first side and a fourth side adjacent to the second side, and the bottom surface and the third side form a third angle, the bottom surface of the first substrate and the fourth side form a fourth angle. The third angle is greater than the first angle, and the fourth angle is smaller than the second angle.