Patents by Inventor Sheng-Chung Wang

Sheng-Chung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240090340
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a memory device surrounded by a dielectric structure disposed over a substrate. The memory device includes a data storage structure disposed between a bottom electrode and a top electrode. A bottom electrode via couples the bottom electrode to a lower interconnect. A top electrode via couples the top electrode to an upper interconnect. A bottommost surface of the top electrode via is directly over the top electrode and has a first width that is smaller than a second width of a bottommost surface of the bottom electrode via.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Ming-Che Ku, Harry-Hak-Lay Chuang, Hung Cho Wang, Tsun Chung Tu, Jiunyu Tsai, Sheng-Huang Huang
  • Patent number: 10381474
    Abstract: A power semiconductor device includes a substrate, a main body and an electrode unit. The main body includes an active portion, an edge termination portion surrounding the active portion, and an insulating layer disposed on the edge termination portion. The edge termination portion includes a first-type semiconductor region, and a plurality of spaced-apart second-type semiconductor segments distributed in the first-type semiconductor region and arranged at intervals along a Y-direction directing from the insulating layer toward the substrate, and an X-direction directing from the active portion toward the edge termination portion. The electrode unit includes a first electrode and a second electrode.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: August 13, 2019
    Assignee: MACROBLOCK, INC.
    Inventors: Kung-Yen Lee, Chih-Fang Huang, Sheng-Chung Wang, Chia-Hui Cheng
  • Publication number: 20180308974
    Abstract: A power semiconductor device includes a substrate, a main body and an electrode unit. The main body includes an active portion, an edge termination portion surrounding the active portion, and an insulating layer disposed on the edge termination portion. The edge termination portion includes a first-type semiconductor region, and a plurality of spaced-apart second-type semiconductor segments distributed in the first-type semiconductor region and arranged at intervals along a Y-direction directing from the insulating layer toward the substrate, and an X-direction directing from the active portion toward the edge termination portion. The electrode unit includes a first electrode and a second electrode.
    Type: Application
    Filed: April 17, 2018
    Publication date: October 25, 2018
    Applicant: MACROBLOCK, INC.
    Inventors: Kung-Yen Lee, Chih-Fang Huang, Sheng-Chung Wang, Chia-Hui Cheng