Patents by Inventor Sheng-Fen Sang
Sheng-Fen Sang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12176650Abstract: An electrical connector includes: an insulating housing; a first terminal assembly disposed at least partially in the housing; a plurality of guide holes disposed in the housing and extending in an insertion direction; a guide groove disposed in the housing and extending in the insertion direction; at least one mating groove disposed in the housing and extending in the insertion direction; and, optionally, a first vent hole disposed in the housing. The guide holes, the guide groove, and the mating groove may each include an inclined wall to facilitate mating with a mating connector. The guide holes may extend from a mating surface of the housing or may extend from guide posts protruding from the mating surface of the housing. The mating groove may have a plurality of heights.Type: GrantFiled: May 4, 2022Date of Patent: December 24, 2024Assignee: Amphenol East Asia Limited (Hong Kong)Inventors: Lo-Wen (Joan) Lu, Sheng-Fen Sang
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Publication number: 20240405493Abstract: Robust connectors and active connectors therewith are provided. A receptacle connector includes first and second terminal assemblies disposed in a same housing slot and separated from each other by a predetermined space. Such a configuration enables the first and second terminal assemblies to be configured according to physical dimensions of various interface standards while simultaneously satisfying respective electrical requirements. The receptacle connector is connected to an end of a cable directly or through a plug connector. The plug connector comprises a circuit board having first and second groups of contact pads aligned in a row and spaced from each other so as to respectively mate with the first and second terminal assemblies of the receptacle connector. The circuit board has a third group of contact pads configured more suitable for attaching the cable. The third group is electrically coupled to the first and second groups.Type: ApplicationFiled: May 31, 2024Publication date: December 5, 2024Applicant: Amphenol East Asia Limited (Hong Kong)Inventors: Lo-Wen Lu, Sheng-Fen Sang
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Patent number: 11764522Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.Type: GrantFiled: March 29, 2021Date of Patent: September 19, 2023Assignee: Amphenol East Asia Ltd.Inventors: Wen Te (Hank) Hsu, Sheng-Fen Sang
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Publication number: 20220360016Abstract: An electrical connector includes: an insulating housing; a first terminal assembly disposed at least partially in the housing; a plurality of guide holes disposed in the housing and extending in an insertion direction; a guide groove disposed in the housing and extending in the insertion direction; at least one mating groove disposed in the housing and extending in the insertion direction; and, optionally, a first vent hole disposed in the housing. The guide holes, the guide groove, and the mating groove may each include an inclined wall to facilitate mating with a mating connector. The guide holes may extend from a mating surface of the housing or may extend from guide posts protruding from the mating surface of the housing. The mating groove may have a plurality of heights.Type: ApplicationFiled: May 4, 2022Publication date: November 10, 2022Applicant: Amphenol East Asia Limited (Hong Kong)Inventors: Lo-Wen (a.k.a. Joan) Lu, Sheng-Fen Sang
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Publication number: 20210218195Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.Type: ApplicationFiled: March 29, 2021Publication date: July 15, 2021Applicant: Amphenol East Asia Ltd.Inventors: Wen Te (a.k.a. Hank) Hsu, Sheng-Fen Sang
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Patent number: 10965064Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.Type: GrantFiled: November 25, 2019Date of Patent: March 30, 2021Assignee: Amphenol East Asia Ltd.Inventors: Wen Te Hsu, Sheng-Fen Sang
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Publication number: 20200335914Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.Type: ApplicationFiled: November 25, 2019Publication date: October 22, 2020Applicant: Amphenol East Asia Ltd.Inventors: Wen Te (a.k.a. Hank) Hsu, Sheng-Fen Sang