Patents by Inventor Sheng-Fen Sang

Sheng-Fen Sang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11764522
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: September 19, 2023
    Assignee: Amphenol East Asia Ltd.
    Inventors: Wen Te (Hank) Hsu, Sheng-Fen Sang
  • Publication number: 20220360016
    Abstract: An electrical connector includes: an insulating housing; a first terminal assembly disposed at least partially in the housing; a plurality of guide holes disposed in the housing and extending in an insertion direction; a guide groove disposed in the housing and extending in the insertion direction; at least one mating groove disposed in the housing and extending in the insertion direction; and, optionally, a first vent hole disposed in the housing. The guide holes, the guide groove, and the mating groove may each include an inclined wall to facilitate mating with a mating connector. The guide holes may extend from a mating surface of the housing or may extend from guide posts protruding from the mating surface of the housing. The mating groove may have a plurality of heights.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Applicant: Amphenol East Asia Limited (Hong Kong)
    Inventors: Lo-Wen (a.k.a. Joan) Lu, Sheng-Fen Sang
  • Publication number: 20210218195
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Applicant: Amphenol East Asia Ltd.
    Inventors: Wen Te (a.k.a. Hank) Hsu, Sheng-Fen Sang
  • Patent number: 10965064
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 30, 2021
    Assignee: Amphenol East Asia Ltd.
    Inventors: Wen Te Hsu, Sheng-Fen Sang
  • Publication number: 20200335914
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Application
    Filed: November 25, 2019
    Publication date: October 22, 2020
    Applicant: Amphenol East Asia Ltd.
    Inventors: Wen Te (a.k.a. Hank) Hsu, Sheng-Fen Sang