Patents by Inventor Sheng-feng Chung

Sheng-feng Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150177867
    Abstract: A touch panel structure includes a transparent substrate having a touch area and a frame wire area, X conductive electrodes, Y conductive electrodes, X conductive connecting sections connecting the X conductive electrodes along a first direction, frame wires, insulated layers and Y conductive connecting bridges on the insulated layers. The X and Y conductive electrodes are respectively arranged in an array in the touch area and interlaced with each other. The X and Y conductive electrodes are electrically connected to an external circuit via the frame wires. The insulated layers each cover one of the X conductive electrodes and two of the Y conductive electrodes. The Y conductive electrodes are electrically connected to each other via the Y conductive connecting bridges along a second direction. A conducting material is performed by one-time printing to pattern the X and Y conductive electrodes, X conductive connecting sections and frame wires.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Applicant: Industrial Technology Research Institute
    Inventors: Sheng-Feng CHUNG, Cheng-Yi SHIH, Shu-Yi CHANG, Su-Tsai LU
  • Publication number: 20130008687
    Abstract: A conductive film structure capable of resisting moisture and oxygen and an electronic apparatus using the same are provided. The conductive film structure includes a metal electrode, a metal oxide layer, and an insulating layer. The metal oxide layer is disposed on the metal electrode and includes an oxide of the metal electrode. The insulating layer covers the metal oxide layer and has at least one pinhole therein.
    Type: Application
    Filed: November 24, 2011
    Publication date: January 10, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Mike Lu, Sheng-Feng Chung, Bao-Shun Yau, Cheng-Yi Chiang
  • Publication number: 20030123651
    Abstract: The present invention includes cardbus interface for DSP (digital signal processing) and for controlling the 32-bits information transmission DSP (digital signal processor) is connected to the cardbus interface to process the digital signal. D/A converter is connected to the DSP to transform the digital signal to analog signal. A transmitter amplify is coupled to the D/A converter to amplify the transformed signal. A multi-level filter is connected to the A/D converter via one terminal. The bandwidth of the multi-level filter is about 24K to 1M. The transmitter amplify is coupled to a protection circuit consisting of current protector 152, bias protector, lightning protector and high voltage to low voltage transformer. A phone jack is connected to the protection circuit for plugging the transmission line to communicate to outside.
    Type: Application
    Filed: February 28, 2002
    Publication date: July 3, 2003
    Inventor: Sheng-feng Chung