Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.

Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.

Abstract: A film comprises a base layer, a first patterned layer and a second patterned layer. The base layer includes a first surface and a second surface opposite to the first surface. The first patterned layer is laminated with the base layer partially over the first surface of the base layer. The first patterned layer is belt-shaped and includes a plurality of spaced first strip patterns, such that a first interval space is defined between adjacent two first strip pattern. The second patterned layer is laminated with the base layer partially over the second surface of the base layer. The second patterned layer being belt-shaped and includes a plurality of spaced second strip patterns corresponding to the first strip patterns. The second strip patterns are partially overlapped with corresponding first strip patterns and the rest of the second strip patterns are partially overlapped with corresponding first interval spaces.

Abstract: A template (10) for assisting cover design has a decorative surface (12). The decorative surface includes a curved portion (121) and an essentially flat portion (122) around the curved portion. The flat portion has a plurality of slots (124) formed therein and is divided into several sections by the slots. Each section has been processed to have a characteristic texture. Each texture within a given section is different from that of any other one of the sections.

Abstract: A template (10) for assisting cover design has a decorative surface (12). The decorative surface includes a curved portion (121) and an essentially flat portion (122) around the curved portion. The flat portion has a plurality of slots (124) formed therein and is divided into several sections by the slots. Each section has been processed to have a characteristic texture. Each texture within a given section is different from that of any other one of the sections.

Abstract: The present invention provides a method and a set of trimming accessories for trimming rubber plate used in an ion implanter. The rubber plate is suitable for use in an ion implanter, wherein the ion implanter has a platform with multiple primary holes and multiple primary notches. In specific embodiments, the set of trimming accessories includes trimming equipment such as a knife or preferably a laser; a template with secondary holes corresponding to primary holes and secondary notches corresponding to primary notches. The template is used as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.

Abstract: One embodiment is directed to a method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality of primary holes and a plurality of primary notches. The method comprises providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter; and trimming the rubber plate using the template as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.

Abstract: The present invention provides a method and a set of trimming accessories for trimming rubber plate used in an ion implanter. The rubber plate is suitable for use in an ion implanter, wherein the ion implanter has a platform with multiple primary holes and multiple primary notches. In specific embodiments, the set of trimming accessories includes trimming equipment such as a knife or preferably a laser; a template with secondary holes corresponding to primary holes and secondary notches corresponding to primary notches. The template is used as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.

Abstract: A plate-tilting apparatus adapted to be used in a semiconductor-manufacturing process is disclosed. The plate-tilting apparatus is used for preventing thin wafers from being collected in a cassette contacted with each other after the thin wafers are taken out of a solution. It includes a plate having the container locked thereon and having a first edge pivotally connected to a basal plane of a tank used in the semiconductor-manufacturing process, and a plate-lifting device connected to a second edge of the plate opposite to the first edge for lifting the second edge of the plate, so that the plate can be tilted at a specific angle.

Abstract: A wafer load/unload apparatus used to load/unload the wafer into/from the clamp ring for performing the E-Gun evaporation process is disclosed. The apparatus comprises a base, a central cylinder and a plurality of peripheral cylinders. The base has an even upper surface, and the central cylinder and the plurality of the peripheral cylinders are connected to the upper surface of the base respectively, wherein the plurality of the peripheral cylinders are located around the central cylinders. A recessed trench penetrating through sidewalls of the central cylinder is formed on a top surface of the central cylinder. The central cylinder can penetrate through a clamp ring, wherein the clamp ring is used to load a wafer for performing the E-Gun evaporating process. The spacing distances between the plurality of peripheral cylinders and the central cylinder are bigger than the width of the clamp ring.

Abstract: Ion implantation equipment is modified so as to provide a support ring between the filament and the cathode where it can continue its function of insulating the filament, thereby greatly extending the lifetime and reducing downtime of the equipment. According to the present invention, apparatus for preventing the short circuit of a filament of a source head to a cathode, comprising: an arc chamber, having an opening; a cathode tube, through the opening of the arc chamber extending in the arc chamber, one end of the cathode tube having a hollow, the hollow facing outside of the arc chamber; an isolated support ring, locating in the hollow's sidewall of the cathode tube; and a filament, through the isolated support ring locating in the cathode tube.