Patents by Inventor Sheng-Feng Tseng

Sheng-Feng Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Detecting device for detecting electrical connection between pads of a package substrate
    Patent number: 7839150
    Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: November 23, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Heng-Lung Su, Wen-Shian Huang, Sheng-Feng Tseng, Feng-Chen Cheng, Chang-Shuo Lee
  • Detecting device
    Publication number: 20080252300
    Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.
    Type: Application
    Filed: November 13, 2007
    Publication date: October 16, 2008
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Heng-Lung Su, Wen-Shian Huang, Sheng-Feng Tseng, Feng-Chen Cheng, Chang-Shuo Lee